D Latch, 2-Func, 2-Bit, CMOS, PDIP16,
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDIP-T16 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D LATCH |
最大I(ol) | 0.004 A |
位数 | 2 |
功能数量 | 2 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5 V |
Prop。Delay @ Nom-Sup | 42 ns |
认证状态 | Not Qualified |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
74HCT75N | 74HCT75D | 74HC75N | 74HC75DB | 74HC75PW | |
---|---|---|---|---|---|
描述 | D Latch, 2-Func, 2-Bit, CMOS, PDIP16, | D Latch, 2-Func, 2-Bit, CMOS, PDSO16, | D Latch, 2-Func, 2-Bit, CMOS, PDIP16, | D Latch, 2-Func, 2-Bit, CMOS, PDSO16, | D Latch, 2-Func, 2-Bit, CMOS, PDSO16 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 | SSOP, SSOP16,.3 | TSSOP, TSSOP16,.25 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH |
最大I(ol) | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
位数 | 2 | 2 | 2 | 2 | 2 |
功能数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SOP | DIP | SSOP | TSSOP |
封装等效代码 | DIP16,.3 | SOP16,.25 | DIP16,.3 | SSOP16,.3 | TSSOP16,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
电源 | 5 V | 5 V | 2/6 V | 2/6 V | 2/6 V |
Prop。Delay @ Nom-Sup | 42 ns | 42 ns | 36 ns | 36 ns | 36 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | YES | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 0.635 mm | 0.635 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | - | 1 | 1 | - | 1 |
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