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DPDD16MX8RLAY5-DP-XX7525

产品描述Synchronous DRAM, 16MX8, CMOS, PDSO66, STACK, LEADLESS, MODULE, TSOP-66
产品类别存储    存储   
文件大小64KB,共2页
制造商B&B Electronics Manufacturing Company
下载文档 详细参数 选型对比 全文预览

DPDD16MX8RLAY5-DP-XX7525概述

Synchronous DRAM, 16MX8, CMOS, PDSO66, STACK, LEADLESS, MODULE, TSOP-66

DPDD16MX8RLAY5-DP-XX7525规格参数

参数名称属性值
厂商名称B&B Electronics Manufacturing Company
零件包装代码TSOP
包装说明ATSOP,
针数66
Reach Compliance Codeunknown
ECCN代码EAR99
访问模式FOUR BANK PAGE BURST
其他特性AUTO/SELF REFRESH
备用内存宽度4
JESD-30 代码R-PDSO-G66
长度22.3266 mm
内存密度134217728 bit
内存集成电路类型SYNCHRONOUS DRAM
内存宽度8
功能数量1
端口数量1
端子数量66
字数16777216 words
字数代码16000000
工作模式SYNCHRONOUS
组织16MX8
封装主体材料PLASTIC/EPOXY
封装代码ATSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, PIGGYBACK, THIN PROFILE
认证状态Not Qualified
座面最大高度2.6162 mm
自我刷新YES
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL

DPDD16MX8RLAY5-DP-XX7525相似产品对比

DPDD16MX8RLAY5-DP-XX7525 DPDD16MX8RLAY5-DP-XX7520 DPDD16MX8RLAY5-DP-XX0825 DPDD16MX8RLAY5-DP-XX7515 DPDD16MX8RLAY5-DP-XX1020 DPDD16MX8RLAY5-DP-XX0815 DPDD16MX8RLAY5-DP-XX0820 DPDD16MX8RLAY5-DP-XX1015 DPDD16MX8RLAY5-DP-XX1025
描述 Synchronous DRAM, 16MX8, CMOS, PDSO66, STACK, LEADLESS, MODULE, TSOP-66 Synchronous DRAM, 16MX8, CMOS, PDSO66, STACK, LEADLESS, MODULE, TSOP-66 Synchronous DRAM, 16MX8, CMOS, PDSO66, STACK, LEADLESS, MODULE, TSOP-66 Synchronous DRAM, 16MX8, CMOS, PDSO66, STACK, LEADLESS, MODULE, TSOP-66 Synchronous DRAM, 16MX8, CMOS, PDSO66, STACK, LEADLESS, MODULE, TSOP-66 Synchronous DRAM, 16MX8, CMOS, PDSO66, STACK, LEADLESS, MODULE, TSOP-66 Synchronous DRAM, 16MX8, CMOS, PDSO66, STACK, LEADLESS, MODULE, TSOP-66 Synchronous DRAM, 16MX8, CMOS, PDSO66, STACK, LEADLESS, MODULE, TSOP-66 Synchronous DRAM, 16MX8, CMOS, PDSO66, STACK, LEADLESS, MODULE, TSOP-66
零件包装代码 TSOP TSOP TSOP TSOP TSOP TSOP TSOP TSOP TSOP
包装说明 ATSOP, ATSOP, ATSOP, ATSOP, ATSOP, ATSOP, ATSOP, ATSOP, ATSOP,
针数 66 66 66 66 66 66 66 66 66
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
其他特性 AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
备用内存宽度 4 4 4 4 4 4 4 4 4
JESD-30 代码 R-PDSO-G66 R-PDSO-G66 R-PDSO-G66 R-PDSO-G66 R-PDSO-G66 R-PDSO-G66 R-PDSO-G66 R-PDSO-G66 R-PDSO-G66
长度 22.3266 mm 22.3266 mm 22.3266 mm 22.3266 mm 22.3266 mm 22.3266 mm 22.3266 mm 22.3266 mm 22.3266 mm
内存密度 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit
内存集成电路类型 SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
内存宽度 8 8 8 8 8 8 8 8 8
功能数量 1 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1 1
端子数量 66 66 66 66 66 66 66 66 66
字数 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words
字数代码 16000000 16000000 16000000 16000000 16000000 16000000 16000000 16000000 16000000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
组织 16MX8 16MX8 16MX8 16MX8 16MX8 16MX8 16MX8 16MX8 16MX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 ATSOP ATSOP ATSOP ATSOP ATSOP ATSOP ATSOP ATSOP ATSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, PIGGYBACK, THIN PROFILE SMALL OUTLINE, PIGGYBACK, THIN PROFILE SMALL OUTLINE, PIGGYBACK, THIN PROFILE SMALL OUTLINE, PIGGYBACK, THIN PROFILE SMALL OUTLINE, PIGGYBACK, THIN PROFILE SMALL OUTLINE, PIGGYBACK, THIN PROFILE SMALL OUTLINE, PIGGYBACK, THIN PROFILE SMALL OUTLINE, PIGGYBACK, THIN PROFILE SMALL OUTLINE, PIGGYBACK, THIN PROFILE
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.6162 mm 2.6162 mm 2.6162 mm 2.6162 mm 2.6162 mm 2.6162 mm 2.6162 mm 2.6162 mm 2.6162 mm
自我刷新 YES YES YES YES YES YES YES YES YES
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
厂商名称 B&B Electronics Manufacturing Company B&B Electronics Manufacturing Company - B&B Electronics Manufacturing Company B&B Electronics Manufacturing Company B&B Electronics Manufacturing Company B&B Electronics Manufacturing Company B&B Electronics Manufacturing Company B&B Electronics Manufacturing Company

 
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