Rambus DRAM, 8MX16, CMOS, PBGA62, 1 MM PITCH, MICRO, BGA-62
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IBM |
| 零件包装代码 | BGA |
| 包装说明 | TBGA, BGA62,12X9,40/32 |
| 针数 | 62 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 访问模式 | BLOCK ORIENTED PROTOCOL |
| 最大时钟频率 (fCLK) | 400 MHz |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PBGA-B62 |
| JESD-609代码 | e0 |
| 长度 | 11.79 mm |
| 内存密度 | 134217728 bit |
| 内存集成电路类型 | RAMBUS DRAM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 62 |
| 字数 | 8388608 words |
| 字数代码 | 8000000 |
| 工作模式 | SYNCHRONOUS |
| 组织 | 8MX16 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TBGA |
| 封装等效代码 | BGA62,12X9,40/32 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE |
| 电源 | 1.8/2.5,2.5 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 16384 |
| 座面最大高度 | 1.185 mm |
| 最大供电电压 (Vsup) | 2.63 V |
| 最小供电电压 (Vsup) | 2.37 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 宽度 | 8.95 mm |
| IBM0712161KU1A-25F | IBM0712161KU1A-33F | IBM0712161KU1A-25D | IBM0712161KU1A-33J | IBM0712161KU1A-25B | |
|---|---|---|---|---|---|
| 描述 | Rambus DRAM, 8MX16, CMOS, PBGA62, 1 MM PITCH, MICRO, BGA-62 | Rambus DRAM, 8MX16, CMOS, PBGA62, 1 MM PITCH, MICRO, BGA-62 | Rambus DRAM, 8MX16, CMOS, PBGA62, 1 MM PITCH, MICRO, BGA-62 | Rambus DRAM, 8MX16, CMOS, PBGA62, 1 MM PITCH, MICRO, BGA-62 | Rambus DRAM, 8MX16, CMOS, PBGA62, 1 MM PITCH, MICRO, BGA-62 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IBM | IBM | IBM | IBM | IBM |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | TBGA, BGA62,12X9,40/32 | TBGA, BGA62,12X9,40/32 | TBGA, BGA62,12X9,40/32 | TBGA, BGA62,12X9,40/32 | TBGA, BGA62,12X9,40/32 |
| 针数 | 62 | 62 | 62 | 62 | 62 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL |
| 最大时钟频率 (fCLK) | 400 MHz | 300 MHz | 400 MHz | 300 MHz | 400 MHz |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PBGA-B62 | R-PBGA-B62 | R-PBGA-B62 | R-PBGA-B62 | R-PBGA-B62 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 11.79 mm | 11.79 mm | 11.79 mm | 11.79 mm | 11.79 mm |
| 内存密度 | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bi |
| 内存集成电路类型 | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 62 | 62 | 62 | 62 | 62 |
| 字数 | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
| 字数代码 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 组织 | 8MX16 | 8MX16 | 8MX16 | 8MX16 | 8MX16 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TBGA | TBGA | TBGA | TBGA | TBGA |
| 封装等效代码 | BGA62,12X9,40/32 | BGA62,12X9,40/32 | BGA62,12X9,40/32 | BGA62,12X9,40/32 | BGA62,12X9,40/32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE |
| 电源 | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 16384 | 16384 | 16384 | 16384 | 16384 |
| 座面最大高度 | 1.185 mm | 1.185 mm | 1.185 mm | 1.185 mm | 1.185 mm |
| 最大供电电压 (Vsup) | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V |
| 最小供电电压 (Vsup) | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | 8.95 mm | 8.95 mm | 8.95 mm | 8.95 mm | 8.95 mm |
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