Bit-Slice Processor, 16-Bit, CMOS, PQCC68, PLASTIC, LCC-68
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | LCC |
| 包装说明 | PLASTIC, LCC-68 |
| 针数 | 68 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A991.A.2 |
| 最大时钟频率 | 32.26 MHz |
| 外部数据总线宽度 | 16 |
| JESD-30 代码 | S-PQCC-J68 |
| JESD-609代码 | e0 |
| 长度 | 24.2062 mm |
| 湿度敏感等级 | 1 |
| 端子数量 | 68 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC68,1.0SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.572 mm |
| 最大压摆率 | 95 mA |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 24.2062 mm |
| uPs/uCs/外围集成电路类型 | BIT-SLICE MICROPROCESSOR |
| IDT49C402AJ | IDT49C402AG68 | IDT49C402AG68B | IDT49C402BJ | IDT49C402BG68B | IDT49C402J | IDT49C402G68 | IDT49C402BG68 | IDT49C402G68B | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Bit-Slice Processor, 16-Bit, CMOS, PQCC68, PLASTIC, LCC-68 | Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, CAVITY-UP, PGA-68 | Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, CAVITY-UP, PGA-68 | Bit-Slice Processor, 16-Bit, CMOS, PQCC68, PLASTIC, LCC-68 | Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, CAVITY-UP, PGA-68 | Bit-Slice Processor, 16-Bit, CMOS, PQCC68, PLASTIC, LCC-68 | Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, CAVITY-UP, PGA-68 | Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, CAVITY-UP, PGA-68 | Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, CAVITY-UP, PGA-68 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | LCC | PGA | PGA | LCC | PGA | LCC | PGA | PGA | PGA |
| 包装说明 | PLASTIC, LCC-68 | PGA, | PGA, | PLASTIC, LCC-68 | PGA, | PLASTIC, LCC-68 | PGA, | PGA, | PGA, |
| 针数 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| Reach Compliance Code | not_compliant | unknown | unknown | not_compliant | unknown | not_compliant | unknown | unknown | unknow |
| 最大时钟频率 | 32.26 MHz | 32.26 MHz | 27.77 MHz | 50 MHz | 41.67 MHz | 20.83 MHz | 20.83 MHz | 50 MHz | 20 MHz |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| JESD-30 代码 | S-PQCC-J68 | S-CPGA-P68 | S-CPGA-P68 | S-PQCC-J68 | S-CPGA-P68 | S-PQCC-J68 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 24.2062 mm | 29.464 mm | 29.464 mm | 24.2062 mm | 29.464 mm | 24.2062 mm | 29.464 mm | 29.464 mm | 29.464 mm |
| 端子数量 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| 最高工作温度 | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCJ | PGA | PGA | QCCJ | PGA | QCCJ | PGA | PGA | PGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | GRID ARRAY | GRID ARRAY | CHIP CARRIER | GRID ARRAY | CHIP CARRIER | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.572 mm | 5.207 mm | 5.207 mm | 4.572 mm | 5.207 mm | 4.572 mm | 5.207 mm | 5.207 mm | 5.207 mm |
| 最大压摆率 | 95 mA | 95 mA | 130 mA | 95 mA | 130 mA | 95 mA | 95 mA | 95 mA | 130 mA |
| 最大供电电压 | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V |
| 最小供电电压 | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | NO | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn85Pb15) | TIN LEAD | TIN LEAD | Tin/Lead (Sn85Pb15) | TIN LEAD | Tin/Lead (Sn85Pb15) | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | J BEND | PIN/PEG | PIN/PEG | J BEND | PIN/PEG | J BEND | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | QUAD | PERPENDICULAR | PERPENDICULAR | QUAD | PERPENDICULAR | QUAD | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
| 宽度 | 24.2062 mm | 29.464 mm | 29.464 mm | 24.2062 mm | 29.464 mm | 24.2062 mm | 29.464 mm | 29.464 mm | 29.464 mm |
| uPs/uCs/外围集成电路类型 | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR |
| ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A001.A.2.C | 3A001.A.3 | 3A001.A.2.C | - | - | 3A001.A.3 | 3A001.A.2.C |
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