EDO DRAM, 1MX16, 50ns, CMOS, PDSO44, 400 MIL, 0.80 MM PITCH, PLASTIC, TSOPII-50/44
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 符合 |
厂商名称 | LAPIS Semiconductor Co Ltd |
零件包装代码 | TSOP2 |
包装说明 | SOP, TSOP44/50,.46,32 |
针数 | 50/44 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
访问模式 | FAST PAGE WITH EDO |
最长访问时间 | 50 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-G44 |
JESD-609代码 | e0 |
内存密度 | 16777216 bit |
内存集成电路类型 | EDO DRAM |
内存宽度 | 16 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 44 |
字数 | 1048576 words |
字数代码 | 1000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 1MX16 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | TSOP44/50,.46,32 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
刷新周期 | 1024 |
自我刷新 | NO |
最大待机电流 | 0.001 A |
最大压摆率 | 0.135 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
MSM5118165F-50TS-K | CR0402-16W-1581FPT-13 | MSM5118165F-60TS-K | MSM5118165F-70TS-K | MSM5118165F-60JS | MSM5118165F-50JS | |
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描述 | EDO DRAM, 1MX16, 50ns, CMOS, PDSO44, 400 MIL, 0.80 MM PITCH, PLASTIC, TSOPII-50/44 | Fixed Resistor, Metal Glaze/thick Film, 0.063W, 1580ohm, 50V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 0402, CHIP, ROHS COMPLIANT | EDO DRAM, 1MX16, 60ns, CMOS, PDSO44, 400 MIL, 0.80 MM PITCH, PLASTIC, TSOPII-50/44 | EDO DRAM, 1MX16, 70ns, CMOS, PDSO44, 400 MIL, 0.80 MM PITCH, PLASTIC, TSOPII-50/44 | EDO DRAM, 1MX16, 60ns, CMOS, PDSO42, 400 MIL, 1.27 MM PITCH, PLASTIC, SOJ-42 | EDO DRAM, 1MX16, 50ns, CMOS, PDSO42, 400 MIL, 1.27 MM PITCH, PLASTIC, SOJ-42 |
包装说明 | SOP, TSOP44/50,.46,32 | CHIP, ROHS COMPLIANT | SOP, TSOP44/50,.46,32 | SOP, TSOP44/50,.46,32 | SOJ, SOJ42,.44 | SOJ, SOJ42,.44 |
Reach Compliance Code | unknown | compliant | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
端子数量 | 44 | 2 | 44 | 44 | 42 | 42 |
最高工作温度 | 70 °C | 155 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装形状 | RECTANGULAR | RECTANGULAR PACKAGE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMT | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | METAL GLAZE/THICK FILM | CMOS | CMOS | CMOS | CMOS |
是否无铅 | 含铅 | 不含铅 | 含铅 | 含铅 | - | 含铅 |
是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 | - | 不符合 |
厂商名称 | LAPIS Semiconductor Co Ltd | - | LAPIS Semiconductor Co Ltd | - | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
零件包装代码 | TSOP2 | - | TSOP2 | TSOP2 | SOJ | SOJ |
针数 | 50/44 | - | 50/44 | 50/44 | 42 | 42 |
访问模式 | FAST PAGE WITH EDO | - | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
最长访问时间 | 50 ns | - | 60 ns | 70 ns | 60 ns | 50 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | - | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O 类型 | COMMON | - | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDSO-G44 | - | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-J42 | R-PDSO-J42 |
JESD-609代码 | e0 | e4 | e0 | e0 | - | e0 |
内存密度 | 16777216 bit | - | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
内存集成电路类型 | EDO DRAM | - | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM |
内存宽度 | 16 | - | 16 | 16 | 16 | 16 |
功能数量 | 1 | - | 1 | 1 | 1 | 1 |
端口数量 | 1 | - | 1 | 1 | 1 | 1 |
字数 | 1048576 words | - | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
字数代码 | 1000000 | - | 1000000 | 1000000 | 1000000 | 1000000 |
工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
组织 | 1MX16 | - | 1MX16 | 1MX16 | 1MX16 | 1MX16 |
输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | - | SOP | SOP | SOJ | SOJ |
封装等效代码 | TSOP44/50,.46,32 | - | TSOP44/50,.46,32 | TSOP44/50,.46,32 | SOJ42,.44 | SOJ42,.44 |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
电源 | 5 V | - | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 1024 | - | 1024 | 1024 | 1024 | 1024 |
自我刷新 | NO | - | NO | NO | NO | NO |
最大待机电流 | 0.001 A | - | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
最大压摆率 | 0.135 mA | - | 0.125 mA | 0.115 mA | 0.125 mA | 0.135 mA |
最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V |
温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | TIN LEAD | PALLADIUM SILVER | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | - | GULL WING | GULL WING | J BEND | J BEND |
端子节距 | 0.8 mm | - | 0.8 mm | 0.8 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
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