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MX29F800BTI-90

产品描述Flash, 512KX16, 90ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48
产品类别存储    存储   
文件大小700KB,共42页
制造商Macronix
官网地址http://www.macronix.com/en-us/Pages/default.aspx
下载文档 详细参数 选型对比 全文预览

MX29F800BTI-90概述

Flash, 512KX16, 90ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48

MX29F800BTI-90规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Macronix
零件包装代码TSOP1
包装说明TSOP1, TSSOP48,.8,20
针数48
Reach Compliance Codeunknown
ECCN代码EAR99
最长访问时间90 ns
备用内存宽度8
启动块BOTTOM
命令用户界面YES
数据轮询YES
耐久性100000 Write/Erase Cycles
JESD-30 代码R-PDSO-G48
JESD-609代码e0
长度18.4 mm
内存密度8388608 bit
内存集成电路类型FLASH
内存宽度16
功能数量1
部门数/规模1,2,1,15
端子数量48
字数524288 words
字数代码512000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织512KX16
封装主体材料PLASTIC/EPOXY
封装代码TSOP1
封装等效代码TSSOP48,.8,20
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
编程电压5 V
认证状态Not Qualified
就绪/忙碌YES
座面最大高度1.2 mm
部门规模16K,8K,32K,64K
最大待机电流0.000005 A
最大压摆率0.05 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
切换位YES
类型NOR TYPE
宽度12 mm

文档预览

下载PDF文档
PRELIMINARY
MX29F800T/B
8M-BIT [1Mx8/512Kx16] CMOS FLASH MEMORY
FEATURES
• 1,048,576 x 8/524,288 x 16 switchable
• Single power supply operation
- 5.0V only operation for read, erase and program
operation
• Fast access time: 70/90/120ns
• Low power consumption
- 50mA maximum active current
- 0.2uA typical standby current
• Command register architecture
- Byte/word Programming (7us/12us typical)
- Sector Erase (Sector structure 16K-Bytex1,
8K-Bytex2, 32K-Bytex1, and 64K-Byte x15)
• Auto Erase (chip & sector) and Auto Program
- Automatically erase any combination of sectors with
Erase Suspend capability.
- Automatically program and verify data at specified
address
• Erase suspend/Erase Resume
- Suspends sector erase operation to read data from,
or program data to, another sector that is not being
erased, then resumes the erase.
• Status Reply
- Data polling & Toggle bit for detection of program and
erase operation completion.
Ready/Busy pin (RY/BY)
- Provides a hardware method of detecting program
or erase operation completion.
Sector protection
- Sector protect/chip unprotect for 5V/12V system.
- Hardware method to disable any combination of
sectors from program or erase operations
- Temporary sector unprotect allows code changes in
previously locked sectors.
100,000 minimum erase/program cycles
Latch-up protected to 100mA from -1V to VCC+1V
Boot Code Sector Architecture
- T = Top Boot Sector
- B = Bottom Boot Sector
Low VCC write inhibit is equal to or less than 3.2V
Package type:
- 44-pin SOP
- 48-pin TSOP
Compatibility with JEDEC standard
- Pinout and software compatible with single-power
supply Flash
GENERAL DESCRIPTION
The MX29F800T/B is a 8-mega bit Flash memory or-
ganized as 1M bytes of 8 bits or 512K words of 16 bits.
MXIC's Flash memories offer the most cost-effective and
reliable read/write non-volatile random access memory.
The MX29F800T/B is packaged in 44-pin SOP, 48-pin
TSOP. It is designed to be reprogrammed and erased
in system or in standard EPROM programmers.
The standard MX29F800T/B offers access time as fast
as 70ns, allowing operation of high-speed microproces-
sors without wait states. To eliminate bus contention,
the MX29F800T/B has separate chip enable (CE) and
output enable (OE) controls.
MXIC's Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
MX29F800T/B uses a command register to manage this
functionality. The command register allows for 100%
TTL level control inputs and fixed power supply levels
during erase and programming, while maintaining maxi-
mum EPROM compatibility.
MXIC Flash technology reliably stores memory contents
even after 100,000 erase and program cycles. The MXIC
cell is designed to optimize the erase and programming
mechanisms. In addition, the combination of advanced
tunnel oxide processing and low internal electric fields
for erase and program operations produces reliable cy-
cling. The MX29F800T/B uses a 5.0V±10% VCC sup-
ply to perform the High Reliability Erase and auto Pro-
gram/Erase algorithms.
The highest degree of latch-up protection is achieved
with MXIC's proprietary non-epi process. Latch-up pro-
tection is proved for stresses up to 100 milliamps on
address and data pin from -1V to VCC + 1V.
P/N:PM0578
REV. 1.9, JUN. 06, 2002
1

MX29F800BTI-90相似产品对比

MX29F800BTI-90 MX29F800BMI-90 MX29F800BTI-12
描述 Flash, 512KX16, 90ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 Flash, 512KX16, 90ns, PDSO44, 0.500 INCH, PLASTIC, MO-175, SOP-44 Flash, 512KX16, 120ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48
是否Rohs认证 不符合 不符合 不符合
厂商名称 Macronix Macronix Macronix
零件包装代码 TSOP1 SOIC TSOP1
包装说明 TSOP1, TSSOP48,.8,20 0.500 INCH, PLASTIC, MO-175, SOP-44 TSOP1, TSSOP48,.8,20
针数 48 44 48
Reach Compliance Code unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99
最长访问时间 90 ns 90 ns 120 ns
备用内存宽度 8 8 8
启动块 BOTTOM BOTTOM BOTTOM
命令用户界面 YES YES YES
数据轮询 YES YES YES
耐久性 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 代码 R-PDSO-G48 R-PDSO-G44 R-PDSO-G48
JESD-609代码 e0 e0 e0
长度 18.4 mm 28.5 mm 18.4 mm
内存密度 8388608 bit 8388608 bit 8388608 bit
内存集成电路类型 FLASH FLASH FLASH
内存宽度 16 16 16
功能数量 1 1 1
部门数/规模 1,2,1,15 1,2,1,15 1,2,1,15
端子数量 48 44 48
字数 524288 words 524288 words 524288 words
字数代码 512000 512000 512000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
组织 512KX16 512KX16 512KX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP1 SOP TSOP1
封装等效代码 TSSOP48,.8,20 SOP44,.63 TSSOP48,.8,20
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 5 V 5 V 5 V
编程电压 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified
就绪/忙碌 YES YES YES
座面最大高度 1.2 mm 3 mm 1.2 mm
部门规模 16K,8K,32K,64K 16K,8K,32K,64K 16K,8K,32K,64K
最大待机电流 0.000005 A 0.000005 A 0.000005 A
最大压摆率 0.05 mA 0.05 mA 0.05 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn/Pb)
端子形式 GULL WING GULL WING GULL WING
端子节距 0.5 mm 1.27 mm 0.5 mm
端子位置 DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
切换位 YES YES YES
类型 NOR TYPE NOR TYPE NOR TYPE
宽度 12 mm 12.6 mm 12 mm
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