Parallel In Parallel Out, 8-Bit, TTL, CDIP20,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | AMD(超微) |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDIP-T20 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | PARALLEL IN PARALLEL OUT |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| SN74LS299J | 5962-01-048-8985 | SN54LS299J | SN54LS299W | SN54LS299WB | SN74LS299NT | SN74LS299NTB | |
|---|---|---|---|---|---|---|---|
| 描述 | Parallel In Parallel Out, 8-Bit, TTL, CDIP20, | Shift Register, 8-Bit, TTL, CDIP20 | Shift Register, 8-Bit, Bidirectional, TTL, CDIP20 | Shift Register, 8-Bit, TTL, CDFP20 | Shift Register, 8-Bit, TTL, CDFP20 | Shift Register, 8-Bit, TTL, PDIP20 | Shift Register, 8-Bit, TTL, PDIP20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | compliant | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-XDFP-F20 | R-XDFP-F20 | R-PDIP-T20 | R-PDIP-T20 |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C | - | - |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DFP | DFP | DIP | DIP |
| 封装等效代码 | DIP20,.3 | DIP20,.3 | DIP20,.3 | FL20,.3 | FL20,.3 | DIP20,.3 | DIP20,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES | YES | NO | NO |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 包装说明 | - | DIP, DIP20,.3 | DIP, DIP20,.3 | DFP, FL20,.3 | DFP, FL20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 |
| 筛选级别 | - | MIL-STD-883 Class C | MIL-STD-883 Class C | MIL-STD-883 Class C | MIL-STD-883 Class B (Modified) | - | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 |
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