DDR DRAM Module, 128MX72, CMOS, LEAD FREE, MO-269, RDIMM-240
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Micron Technology |
| 零件包装代码 | DIMM |
| 包装说明 | LEAD FREE, MO-269, RDIMM-240 |
| 针数 | 240 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 访问模式 | SINGLE BANK PAGE BURST |
| 其他特性 | AUTO/SELF REFRESH |
| JESD-30 代码 | R-XDMA-N240 |
| JESD-609代码 | e4 |
| 内存密度 | 9663676416 bit |
| 内存集成电路类型 | DDR DRAM MODULE |
| 内存宽度 | 72 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 240 |
| 字数 | 134217728 words |
| 字数代码 | 128000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 128MX72 |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIMM |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 自我刷新 | YES |
| 最大供电电压 (Vsup) | 1.575 V |
| 最小供电电压 (Vsup) | 1.425 V |
| 标称供电电压 (Vsup) | 1.5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Gold (Au) |
| 端子形式 | NO LEAD |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| MT9JSF12872PIY-1G6XX | MT9JSF12872PIY-1G1XX | MT9JSF12872PY-1G4D1 | MT9JSF12872PIY-1G4XX | MT9JSF12872PIY-80BXX | MT9JSF12872PIY-1G0XX | |
|---|---|---|---|---|---|---|
| 描述 | DDR DRAM Module, 128MX72, CMOS, LEAD FREE, MO-269, RDIMM-240 | DDR DRAM Module, 128MX72, CMOS, LEAD FREE, MO-269, RDIMM-240 | DDR DRAM Module, 128MX72, CMOS, LEAD FREE, MO-269, RDIMM-240 | DDR DRAM Module, 128MX72, CMOS, LEAD FREE, MO-269, RDIMM-240 | DDR DRAM Module, 128MX72, CMOS, LEAD FREE, MO-269, RDIMM-240 | DDR DRAM Module, 128MX72, CMOS, LEAD FREE, MO-269, RDIMM-240 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| 零件包装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
| 包装说明 | LEAD FREE, MO-269, RDIMM-240 | DIMM, | DIMM, | LEAD FREE, MO-269, RDIMM-240 | LEAD FREE, MO-269, RDIMM-240 | LEAD FREE, MO-269, RDIMM-240 |
| 针数 | 240 | 240 | 240 | 240 | 240 | 240 |
| Reach Compliance Code | compliant | compliant | unknown | compliant | compliant | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST |
| 其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| JESD-30 代码 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 |
| 内存密度 | 9663676416 bit | 9663676416 bit | 9663676416 bit | 9663676416 bit | 9663676416 bit | 9663676416 bi |
| 内存集成电路类型 | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE |
| 内存宽度 | 72 | 72 | 72 | 72 | 72 | 72 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 240 | 240 | 240 | 240 | 240 | 240 |
| 字数 | 134217728 words | 134217728 words | 134217728 words | 134217728 words | 134217728 words | 134217728 words |
| 字数代码 | 128000000 | 128000000 | 128000000 | 128000000 | 128000000 | 128000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 组织 | 128MX72 | 128MX72 | 128MX72 | 128MX72 | 128MX72 | 128MX72 |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 自我刷新 | YES | YES | YES | YES | YES | YES |
| 最大供电电压 (Vsup) | 1.575 V | 1.575 V | 1.575 V | 1.575 V | 1.575 V | 1.575 V |
| 最小供电电压 (Vsup) | 1.425 V | 1.425 V | 1.425 V | 1.425 V | 1.425 V | 1.425 V |
| 标称供电电压 (Vsup) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Gold (Au) | Gold (Au) | Gold (Au) | Gold (Au) | Gold (Au) | Gold (Au) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 |
| 是否无铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 |
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