REVISIONS
LTR
A
DESCRIPTION
Add footnote 4/ in 1.5. Add footnote 2/ and make change to
I
DCHG
test in
table I. -rrp
DATE (YR-MO-DA)
03-06-17
APPROVED
R. MONNIN
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
15
16
17
18
REV
SHEET
PREPARED BY
RICK OFFICER
19
20
21
A
1
2
22
23
A
3
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
12
13
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
RAJESH PITHADIA
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
APPROVED BY
RAYMOND MONNIN
DRAWING APPROVAL DATE
02-02-06
MICROCIRCUIT, LINEAR, RADIATION
HARDENED, HIGH SPEED, DUAL OUTPUT
PULSE WIDTH MODULATOR WITH SEU
PROTECTION, MONOLITHIC SILICON
SIZE
A
SHEET
CAGE CODE
AMSC N/A
REVISION LEVEL
A
67268
1 OF
23
5962-02511
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E447-03
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the
PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
F
02511
01
V
E
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
IS-1825ASRH
Circuit function
Radiation hardened, DI dual output pulse
width modulator with SEU protection
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Q or V
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
E
X
Descriptive designator
CDIP2-T16
CDFP4-F20
Terminals
16
20
Package style
Dual-in-line
Flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-02511
SHEET
2
1.3 Absolute maximum ratings. 1/ 2/ 3/
Supply voltage (V
S
) ............................................................................................. 35 V dc
Power dissipation (P
D
) ......................................................................................... 714 mW
Junction temperature (T
J
) .................................................................................... +175°C maximum
Lead temperature (soldering, 10 seconds) .......................................................... +260°C maximum
Storage temperature range .................................................................................. -65°C to +150°C
Thermal resistance, junction-to-case (θ
JC
):
Case E ............................................................................................................. 18°C/W
Case X ............................................................................................................. 15°C/W
Thermal resistance, junction-to-ambient (θ
JA
):
Case E ............................................................................................................. 70°C/W
Case X ............................................................................................................. 80°C/W
1.4 Recommended operating conditions. 2/ 3/
Supply voltage (V
S
) ............................................................................................. 12 V to 20 V
Ambient operating temperature range (T
A
) ......................................................... -50°C to +125°C
1.5 Radiation features:
Maximum total dose available (dose rate = 50 – 300 rad (Si) / s):
Device classes M, Q, or V ................................................................................ 3 x 10 Rads 4/
Dose-rate latch-up ............................................................................................... None 5/
Single event latch-up ..........................................................................................
>
83 MeV/(cm /mg) 5/
Single event upset ………………………………………………………………………
>
35 MeV / (cm /mg) 5/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
______
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Unless otherwise noted, all voltages are referenced to GND.
3/ The limits for the parameters specified herein shall apply over the full specified V
CC
range and ambient temperature range
of -50°C to +125°C unless otherwise noted.
4/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,
method 1019, condition A.
5/ Guaranteed by process or design.
2
2
5
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-02511
SHEET
A
3
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A to this document.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Logic diagram. The logic diagram shall be as specified on figure 2.
3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 3.
3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the
full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-02511
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Test conditions 1/ 2/
-50°C
≤
T
A
≤
+125°C
unless otherwise specified
Device
type
Group A
subgroups
Limits
Unit
Min
Reference section
Output voltage
V
REF
01
1
2,3
M,D,P,L,R,F
Line regulation
V
LINE
12 V
<
V
C
<
20 V
01
1
1
2,3
M,D,P,L,R,F
Load regulation
V
LOAD
1 mA
<
I
OUT
<
10 mA
01
1
1
2,3
M,D,P,L,R,F
Total output
variation
V
OM
V
C
= 12 V, 20 V,
I
L
= 1 mA, 10 mA
M,D,P,L,R,F
Short circuit current
I
SC
V
REF
= 0 V
01
01
1
1
2,3
1
1
2,3
M,D,P,L,R,F
1
5.00
4.920
4.920
-15
-20
-20
-25
-50
-50
5.00
4.92
4.92
30
20
20
Max
5.20
5.28
5.28
15
20
20
25
50
50
5.20
5.28
5.28
V
mV
mV
V
mA
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-02511
SHEET
A
5
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