REVISIONS
LTR
A
DESCRIPTION
Make change to VTHUV test specified under table I. - ro
DATE (YR-MO-DA)
00-03-07
APPROVED
R. MONNIN
B
Add device type 02. - ro
01-07-26
R. MONNIN
C
Make changes to I
LK
and +I
IN
tests as specified in table I. - ro
01-12-14
R. MONNIN
D
Make change to the high side floating supply offset voltage limit for device
type 02 as specified under 1.4. - ro
02-04-17
R. MONNIN
E
Add a new logic diagram for device type 02. - ro
03-04-15
R. MONNIN
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
E
15
E
16
E
17
E
18
REV
SHEET
PREPARED BY
RICK OFFICER
CHECKED BY
RAJESH PITHADIA
E
19
E
20
E
21
E
1
E
22
E
2
E
23
E
3
E
24
E
4
E
5
E
6
E
7
E
8
E
9
E
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E
11
E
12
E
13
E
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
MICROCIRCUIT, DIGITAL, RADIATION HARDENED,
HIGH FREQUENCY HALF BRIDGE DRIVER,
MONOLITHIC SILICON
APPROVED BY
RAYMOND MONNIN
DRAWING APPROVAL DATE
99-06-29
REVISION LEVEL
E
SIZE
A
SHEET
CAGE CODE
67268
1 OF
24
5962-99536
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E332-03
1. SCOPE
1.1 Scope. This drawing documents three product assurance class levels consisting of high reliability (device classes Q and
M), space application (device class V) and for appropriate satellite and similar applications (device class T). A choice of case
outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of
Radiation Hardness Assurance (RHA) levels are reflected in the PIN. For device class T, the user is encouraged to review the
manufacturer’s Quality Management (QM) plan as part of their evaluation of these parts and their acceptability in the intended
application.
1.2 PIN. The PIN is as shown in the following example:
5962
F
99536
01
V
X
C
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
\/
Drawing number
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
1.2.1 RHA designator. Device classes Q, T and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number
HS-2100RH
IS-2100ARH
Circuit function
120 V, radiation hardened, dielectric isolated high
frequency half bridge driver
150 V, radiation hardened, dielectric isolated high
frequency half bridge driver
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Certification and qualification to MIL-PRF-38535
Certification and qualification to MIL-PRF-38535 with performance as specified
in the device manufacturers approved quality management plan.
Q, V
T
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Descriptive designator
CDFP4-F16
Terminals
16
Package style
Flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q, T and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-99536
SHEET
E
2
1.3 Absolute maximum ratings. 1/ 2/
High side floating supply voltage (V
B
):
Device type 01 ................................................................................................. -0.3 V to 120 V
Device type 02 ................................................................................................. -0.3 V to 150 V
High side floating supply offset voltage (V
S
) ....................................................... V
B
– 25 V to V
B
+ 0.3 V
High side floating output voltage (V
HO
) .............................................................. V
S
– 0.3 V to V
B
+ 0.3 V
Low side fixed supply voltage (V
CC
) ................................................................... -0.3 V to 25 V
Low side output voltage (V
LO
) ............................................................................ COM – 0.3 V to V
CC
+ 0.3 V
Logic supply voltage (V
DD
) ................................................................................. V
CC
3/
Logic input voltage (HIN, LIN, and SD pins) ....................................................... V
SS
– 0.3 V to V
DD
+0.3 V
V
S
slew rate (dV
S
/ dt):
Device type 01 ................................................................................................. 10 V / ns maximum
Device type 02 ................................................................................................. 15 V / ns maximum
COM (low driver return) offset to V
SS
:
Device type 01 ................................................................................................. -7 V to +7 V
Device type 02 ................................................................................................. -5 V to +5 V
Maximum power dissipation (P
D
) (T
A
≤
+25°C) .................................................. 1.6 W
Lead temperature (soldering, 10 seconds) ........................................................ +300°C
Junction temperature (T
J
) ................................................................................... +175°C
Storage temperature range ................................................................................. -55°C to +150°C
Thermal resistance, junction-to-case (θ
JC
) ......................................................... 18°C/W
Thermal resistance, junction-to-ambient (θ
JA
) .................................................... 90°C/W
1.4 Recommended operating conditions.
High side floating supply absolute voltage (V
B
) .................................................. V
S
+ 12 V to V
S
+20 V
High side floating supply offset voltage (V
S
):
Device type 01 ................................................................................................. - 4 V to 100 V 4/
Device type 02 ................................................................................................. - 4 V to 130 V 4/
High side floating output voltage (V
HO
) .............................................................. V
S
to V
B
Low side fixed supply (V
CC
) ................................................................................ 12 V to 20 V
Low side output voltage (V
LO
) ............................................................................ COM to V
CC
Logic supply voltage (V
DD
) ................................................................................. V
CC
3/
_____
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ All voltage parameters are absolute voltages referenced to V
SS
.
3/
4/
Logic is operational for V
S
of –4 V but V
B
must remain minimum 12 V above V
SS
(ground).
This device is recommended for V
DD
= V
CC
and they should be tied together at the board level. V
DD
and V
CC
can have
different values but both must remain within 12 V – 20 V range. Low side undervoltage monitors V
DD
to V
SS
differential.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-99536
SHEET
E
3
1.4 Recommended operating conditions – continued.
Logic supply return (V
SS
) .................................................................................... 0 V
COM (low driver return) offset to V
SS
................................................................. -5 V to 5 V 5/
Logic input voltage (V
IN
) ..................................................................................... V
SS
to V
DD
6/
Ambient operating temperature range (T
A
) ......................................................... -55°C to +125°C
1.5 Radiation features:
Maximum total dose available (dose rate = 50 - 300 rads (Si) / s):
Device classes M, Q, or V ................................................................................. 3 x 10 Rads
Device class T ................................................................................................... 1 x 10 Rads
Latch up .............................................................................................................. None 7/
Single event upset ............................................................................................... None 8/
5
5
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
____
5/
6/
7/
8/
V
CC
/ V
DD
to COM must remain in 12 V to 20 V range.
The input buffers are designed to accept 5 V logic level inputs while running V
DD
in 12 V – 20 V range.
Latch up immune due to dielectric isolation technology.
Error detection and correction for high side latch guarantees no single event latch upset.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-99536
SHEET
E
4
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q, T and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein.
3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A to this document.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q, T and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Logic diagram. The logic diagram shall be as specified on figure 2.
3.2.4 Irradiation test connections. The irradiation test connections shall be as specified in figure 3.
3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the
full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q, T and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q, T and V shall be a "QML" or "Q" as
required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix
A.
3.6 Certificate of compliance. For device classes Q, T and V, a certificate of compliance shall be required from a
QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a
certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-
HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q, T and V, the requirements of
MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q, T and V in MIL-PRF-38535 or
for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 91 (see MIL-PRF-38535, appendix A).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-99536
SHEET
E
5
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