MC10H116
Triple Line Receiver
Description
The MC10H116 is a triple differential amplifier designed for use in
sensing differential signals over long lines and is a functional/pinout
duplication of the MC10116, with 100% improvement in propagation
delay and no increase in power supply current. For termination
information see AND8020.
Features
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MARKING DIAGRAMS*
•
Propagation Delay, 1.0 ns Typical
•
Power Dissipation 85 mW Typ/Pkg (same as MECL 10K™)
•
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
•
Voltage Compensated
•
MECL 10K Compatible
•
Pb−Free Packages are Available*
4
5
9
10
12
13
V
BB
*
V
CC1
= Pin 1
V
CC2
= Pin 16
V
EE
= Pin 8
When input pin with
bubble goes positive
it’s respective output
pin with bubble goes
positive.
2
3
6
7
14
15
11
16
1
16
MC10H116L
AWLYYWW
1
CDIP−16
L SUFFIX
CASE 620A
16
16
1
PDIP−16
P SUFFIX
CASE 648
1
MC10H116P
AWLYYWWG
*V
BB
to be used to supply bias to the MC10H116 only and bypassed
(when used) with 0.01
mF
to 0.1
mF
capacitor to ground (0 V). V
BB
can
source < 1.0 mA.
The MC10H116 is designed to be used in sensing differential signals
over long lines. The bias supply (V
BB
) is made available to make the
device useful as a Schmitt trigger, or in other applications where a
stable reference voltage is necessary.
Active current sources provide these receivers with excellent
common−mode noise rejection. If any amplifier in a package is not
used, one input of that amplifier must be connected to V
BB
to prevent
unbalancing the current−source bias network.
The MC10H116 does not have internal−input pull− down resistors.
This provides high impedance to the amplifier input and facilitates
differential connections.
Applications:
•
Low Level Receiver
•
Voltage Level
•
Schmitt Trigger
Interface
1 20
20 1
PLCC−20
FN SUFFIX
CASE 775
16
10H116G
AWLYYWW
Figure 1. Logic Diagram
16
1
10H116G
AWLYWW
1
SO−16
D SUFFIX
CASE 751B
V
CC1
A
OUT
A
OUT
A
IN
A
IN
B
OUT
B
OUT
V
EE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC2
C
OUT
C
OUT
C
IN
C
IN
V
BB
B
IN
B
IN
16
1
16
10H116
ALYWG
1
= Assembly Location
= Wafer Lot
= Year
= Work Week
SOEIAJ−16
M, MEL SUFFIX
CASE 966
A
WL
YY
WW
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see TND309, the Pin Conversion Tables,
page 9.
Figure 2. Dip Pin Assignment
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
February, 2006
−
Rev. 10
1
Publication Order Number:
MC10H116/D
MC10H116
Table 1. MAXIMUM RATINGS
Symbol
V
EE
V
I
I
out
T
A
T
stg
Power Supply (V
CC
= 0)
Input Voltage (V
CC
= 0)
Output Current
−
Continuous
−
Surge
Characteristic
Rating
−8.0
to 0
0 to V
EE
50
100
0 to +75
−55
to +150
−55
to +165
Unit
Vdc
Vdc
mA
°C
°C
°C
Operating Temperature Range
Storage Temperature Range
−
Plastic
−
Ceramic
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS
(V
EE
=
−5.2
V
±5%)
(Note 2)
0°
Symbol
I
E
I
inH
I
CBO
V
BB
V
OH
V
OL
V
IH
V
IL
V
CMR
V
PP
Characteristic
Power Supply Current
Input Current High
Input Leakage Current
Reference Voltage
High Output Voltage
Low Output Voltage
High Input Voltage (Note 1)
Low Input Voltage (Note 1)
Common Mode
Range (Note 4)
Min
−
−
−
−1.38
−1.02
−1.95
−1.17
−1.95
−
−
Max
23
150
1.5
−1.27
−0.84
−1.63
−0.84
−1.48
−
−
Min
−
−
−
−1.35
−0.98
−1.95
−1.13
−1.95
25°
Max
21
95
1.0
−1.25
−0.81
−1.63
−0.81
−1.48
Min
−
−
−
−1.31
−0.92
−1.95
−1.07
−1.95
−
−
75°
Max
23
95
1.0
−1.19
−0.735
−1.60
−0.735
−1.45
−
−
Unit
mA
mA
mA
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
mV
PP
−2.85
to
−0.8
150 typ
Input Sensitivity (Note 3)
1. When V
BB
is used as the reference voltage.
2. Each MECL 10H™ series circuit has been designed to meet the specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is
maintained. Outputs are terminated through a 50−ohm resistor to
−2.0
V.
3. Differential input not to exceed 1.0 Vdc.
4. 150 mV
p−p
differential input required to obtain full logic swing on output.
Table 3. AC CHARACTERISTICS
0°
Symbol
t
pd
t
r
t
f
Propagation Delay
Rise Time
Fall Time
Characteristic
Min
0.4
0.5
0.5
Max
1.3
1.5
1.5
Min
0.4
0.5
0.5
25°
Max
1.3
1.6
1.6
Min
0.45
0.5
0.5
75°
Max
1.45
1.7
1.7
Unit
ns
ns
ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
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2
MC10H116
ORDERING INFORMATION
Device
MC10H116D
MC10H116DG
MC10H116DR2
MC10H116DR2G
MC10H116FN
MC10H116FNG
MC10H116FNR2
MC10H116FNR2G
MC10H116L
MC10H116M
MC10H116MG
MC10H116MEL
MC10H116MELG
MC10H116P
MC10H116PG
Package
SO−16
SO−16
(Pb−Free)
SO−16
SO−16
(Pb−Free)
PLCC−20
PLCC−20
(Pb−Free)
PLCC−20
PLCC−20
(Pb−Free)
CD1P−16
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
PD1P−16
PD1P−16
(Pb−Free)
Shipping
†
48 Units / Rail
48 Units / Rail
2500 / Tape & Reel
2500 / Tape & Reel
46 Units / Rail
46 Units/Rail
500 / Tape & Reel
500 / Tape & Reel
25 Units / Rail
50 Units / Rail
50 Units / Rail
2000 / Tape & Reel
2000 / Tape & Reel
25 Units / Rail
25 Units / Rail
†For information on tape and reel specifications,including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
MC10H116
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE E
B
−N−
Y BRK
D
−L−
−M−
W
D
V
0.010 (0.250)
T L−M
N
Z
0.007 (0.180)
M
T L−M
U
S
N
S
S
0.007 (0.180)
M
T L−M
N
S
20
1
X
VIEW D−D
G1
S
S
S
A
Z
R
0.007 (0.180)
M
T L−M
0.007 (0.180)
M
T L−M
S
N
N
S
S
S
H
K1
0.007 (0.180)
M
T L−M
S
N
S
C
E
G
G1
0.010 (0.250)
S
T L−M
J
0.004 (0.100)
−T−
SEATING
PLANE
K
F
VIEW S
0.007 (0.180)
M
T L−M
S
VIEW S
S
N
S
N
S
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−−
0.020
2
_
10
_
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2
_
10
_
7.88
8.38
1.02
−−−
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS
−L−, −M−,
AND
−N−
DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM
−T−,
SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
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MC10H116
PACKAGE DIMENSIONS
CDIP−16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A−01
ISSUE O
B
16
A
9
A
M
L
B
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10.
DIM
A
B
C
D
E
F
G
H
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
−−− 0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0
_
15
_
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
−−−
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0
_
15
_
0.51
1.01
16X
J
E
F
C
K
T
N
G
16X
0.25 (0.010)
M
T B
SEATING
PLANE
D
0.25 (0.010)
M
T A
−A−
16
9
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
ISSUE R
B
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0
_
10
_
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0
_
10
_
0.51
1.01
F
S
C
L
−T−
H
K
G
D
16 PL
SEATING
PLANE
J
T A
M
M
0.25 (0.010)
M
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