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MT55L256L36FF-11

产品描述ZBT SRAM, 256KX36, 8.5ns, CMOS, PBGA165, FBGA-165
产品类别存储    存储   
文件大小487KB,共30页
制造商Micron Technology
官网地址http://www.mdtic.com.tw/
下载文档 详细参数 全文预览

MT55L256L36FF-11概述

ZBT SRAM, 256KX36, 8.5ns, CMOS, PBGA165, FBGA-165

MT55L256L36FF-11规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Micron Technology
零件包装代码BGA
包装说明FBGA-165
针数165
Reach Compliance Codenot_compliant
ECCN代码3A991.B.2.A
最长访问时间8.5 ns
其他特性FLOW-THROUGH ARCHITECTURE
最大时钟频率 (fCLK)90 MHz
I/O 类型COMMON
JESD-30 代码R-PBGA-B165
JESD-609代码e0
长度15 mm
内存密度9437184 bit
内存集成电路类型ZBT SRAM
内存宽度36
功能数量1
端子数量165
字数262144 words
字数代码256000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织256KX36
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码TBGA
封装等效代码BGA165,11X15,40
封装形状RECTANGULAR
封装形式GRID ARRAY, THIN PROFILE
并行/串行PARALLEL
电源3.3 V
认证状态Not Qualified
座面最大高度1.2 mm
最大待机电流0.01 A
最小待机电流3.14 V
最大压摆率0.275 mA
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
宽度13 mm

文档预览

下载PDF文档
8Mb: 512K x 18, 256K x 32/36
FLOW-THROUGH ZBT SRAM
8Mb
ZBT
®
SRAM
FEATURES
High frequency and 100 percent bus utilization
Fast cycle times: 10ns, 11ns and 12ns
Single +3.3V ±5% power supply (V
DD
)
Separate +3.3V or +2.5V isolated output buffer
supply (V
DD
Q)
Advanced control logic for minimum control
signal interface
Individual BYTE WRITE controls may be tied LOW
Single R/W# (read/write) control pin
CKE# pin to enable clock and suspend operations
Three chip enables for simple depth expansion
Clock-controlled and registered addresses, data
I/Os and control signals
Internally self-timed, fully coherent WRITE
Internally self-timed, registered outputs to
eliminate the need to control OE#
SNOOZE MODE for reduced-power standby
Common data inputs and data outputs
Linear or Interleaved Burst Modes
Burst feature (optional)
Pin/function compatibility with 2Mb, 4Mb, and
18Mb ZBT SRAM
100-pin TQFP
165-pin FBGA
119-pin BGA package
Automatic power-down
MT55L512L18F, MT55L512V18F,
MT55L256L32F, MT55L256V32F,
MT55L256L36F, MT55L256V36F
3.3V V
DD
, 3.3V or 2.5V I/O
100-Pin TQFP
1
165-Pin FBGA
(Preliminary Package Data)
OPTIONS
• Timing (Access/Cycle/MHz)
7.5ns/10ns/100 MHz
8.5ns/11ns/90 MHz
9ns/12ns/83 MHz
• Configurations
3.3V I/O
512K x 18
256K x 32
256K x 36
2.5V I/O
512K x 18
256K x 32
256K x 36
• Package
100-pin TQFP
165-pin FBGA
119-pin, 14mm x 22mm BGA
• Operating Temperature Range
Commercial (0ºC to +70ºC)
Industrial (-40°C to +85°C)**
MARKING*
-10
-11
-12
119-Pin BGA
2
MT55L512L18F
MT55L256L32F
MT55L256L36F
MT55L512V18F
MT55L256V32F
MT55L256V36F
T
F
B
None
IT
NOTE:
1. JEDEC-standard MS-026 BHA (LQFP).
2. JEDEC-standard MS-028 BHA (PBGA).
Part Number Example:
MT55L256L32FT-11
* A Part Marking Guide for the FBGA devices can be found on Micron’s
Web site—http://www.micron.com/support/index.html.
** Industrial temperature range offered in specific speed grades and
confgurations. Contact factory for more information.
8Mb: 512K x 18, 256K x 32/36 Flow-Through ZBT SRAM
MT55L512L18F_2.p65 – Rev. 6/01
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2001, Micron Technology, Inc.

 
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