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70V261WL25PFG: 产品描述Dual-Port SRAM, 16KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100; 产品类别存储存储; 文件大小151KB，共17页; 制造商IDT (Integrated Device Technology); 标准

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70V261WL25PFG概述

Dual-Port SRAM, 16KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100

70V261WL25PFG规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	QFP
包装说明	LFQFP,
针数	100
Reach Compliance Code	compliant
ECCN代码	EAR99
最长访问时间	25 ns
JESD-30 代码	S-PQFP-G100
JESD-609代码	e3
长度	14 mm
内存密度	262144 bit
内存集成电路类型	DUAL-PORT SRAM
内存宽度	16
湿度敏感等级	3
功能数量	1
端子数量	100
字数	16384 words
字数代码	16000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	16KX16
封装主体材料	PLASTIC/EPOXY
封装代码	LFQFP
封装形状	SQUARE
封装形式	FLATPACK, LOW PROFILE, FINE PITCH
并行/串行	PARALLEL
峰值回流温度（摄氏度）	260
认证状态	Not Qualified
座面最大高度	1.6 mm
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	3 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	MATTE TIN
端子形式	GULL WING
端子节距	0.5 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	30
宽度	14 mm

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HIGH-SPEED 3.3V

16K x 16 DUAL-PORT

STATIC RAM

Features

◆

IDT70V261S/L

◆

True Dual-Ported memory cells which allow simultaneous

access of the same memory location

High-speed access

– Commercial: 25/35/55ns (max.)

– Industrial: 25ns (max.)

Low-power operation

– IDT70V261S

Active: 300mW (typ.)

Standby: 3.3mW (typ.)

– IDT70V261L

Active: 300mW (typ.)

Standby: 660

W (typ.)

Separate upper-byte and lower-byte control for multiplexed

bus compatibility

◆

IDT70V261 easily expands data bus width to 32 bits or more

using the Master/Slave select when cascading more than

one device

M/S = V

for

BUSY

output flag on Master

M/S = V

for

BUSY

input on Slave

Interrupt Flag

On-chip port arbitration logic

Full on-chip hardware support of semaphore signaling

between ports

Fully asynchronous operation from either port

TTL-compatible, single 3.3V (±0.3V) power supply

Available in a 100-pin TQFP, Thin Quad Plastic Flatpack

Industrial temperature range (-40°C to +85°C) is available

for selected speed

Green parts available, see ordering information

Functional Block Diagram

R/W

I/O

-I/O

15L

I/O

-I/O

BUSY

13L

(1,2)

I/O

Control

I/O

Control

I/O

-I/O

15R

I/O

-I/O

BUSY

13R

(1,2)

Address

Decoder

MEMORY

ARRAY

Address

Decoder

R/W

SEM

(2)

INT

NOTES:

1. (MASTER):

BUSY

is output; (SLAVE):

BUSY

is input.

BUSY

and

INT

outputs are non-tri-stated push-pull.

ARBITRATION

INTERRUPT

SEMAPHORE

LOGIC

R/W

SEM

(2)

INT

3040 drw 01

M/S

JANUARY 2009

DSC-3040/10

70V261WL25PFG相似产品对比

	70V261WL25PFG	70V261S25PFI	70V261S25PFI8	70V261WS55PFG	70V261WL25PFGI	70V261WS25PFG	70V261WS25PFGI	70V261WL35PFG	AD9683_17	70V261WL55PFG
描述	Dual-Port SRAM, 16KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100	Dual-Port SRAM, 16KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	Dual-Port SRAM, 16KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	Dual-Port SRAM, 16KX16, 55ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100	Dual-Port SRAM, 16KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100	Dual-Port SRAM, 16KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100	Dual-Port SRAM, 16KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100	Dual-Port SRAM, 16KX16, 35ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100	Analog-to-Digital Converter	Dual-Port SRAM, 16KX16, 55ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100
是否无铅	不含铅	含铅	含铅	不含铅	不含铅	不含铅	不含铅	不含铅	-	不含铅
是否Rohs认证	符合	不符合	不符合	符合	符合	符合	符合	符合	-	符合
厂商名称	IDT (Integrated Device Technology)	-	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)
零件包装代码	QFP	-	-	QFP	QFP	QFP	QFP	QFP	-	QFP
包装说明	LFQFP,	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	LFQFP,	LFQFP,	LFQFP,	LFQFP,	LFQFP,	-	LFQFP,
针数	100	-	-	100	100	100	100	100	-	100
Reach Compliance Code	compliant	not_compliant	not_compliant	compliant	compliant	compliant	compliant	compliant	-	compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	-	EAR99
最长访问时间	25 ns	25 ns	25 ns	55 ns	25 ns	25 ns	25 ns	35 ns	-	55 ns
JESD-30 代码	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	-	S-PQFP-G100
JESD-609代码	e3	e0	e0	e3	e3	e3	e3	e3	-	e3
长度	14 mm	-	-	14 mm	14 mm	14 mm	14 mm	14 mm	-	14 mm
内存密度	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	-	262144 bit
内存集成电路类型	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	-	DUAL-PORT SRAM
内存宽度	16	16	16	16	16	16	16	16	-	16
湿度敏感等级	3	3	3	3	3	3	3	3	-	3
功能数量	1	1	1	1	1	1	1	1	-	1
端子数量	100	100	100	100	100	100	100	100	-	100
字数	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	-	16384 words
字数代码	16000	16000	16000	16000	16000	16000	16000	16000	-	16000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS
最高工作温度	70 °C	85 °C	85 °C	70 °C	85 °C	70 °C	85 °C	70 °C	-	70 °C
组织	16KX16	16KX16	16KX16	16KX16	16KX16	16KX16	16KX16	16KX16	-	16KX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
封装代码	LFQFP	QFP	QFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	-	LFQFP
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	-	SQUARE
封装形式	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK	FLATPACK	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	-	FLATPACK, LOW PROFILE, FINE PITCH
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-	PARALLEL
峰值回流温度（摄氏度）	260	240	240	260	260	260	260	260	-	260
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
座面最大高度	1.6 mm	-	-	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	-	1.6 mm
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	-	3.6 V
最小供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	-	3 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	-	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	-	CMOS
温度等级	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	-	COMMERCIAL
端子面层	MATTE TIN	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN	-	MATTE TIN
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	-	GULL WING
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	-	0.5 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	-	QUAD
处于峰值回流温度下的最长时间	30	20	20	30	30	30	30	30	-	30
宽度	14 mm	-	-	14 mm	14 mm	14 mm	14 mm	14 mm	-	14 mm

70V261WL25PFG

70V261WL25PFG概述

70V261WL25PFG规格参数

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70V261WL25PFG相似产品对比

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