HIGH-SPEED
32K x 8 DUAL-PORT
STATIC RAM
Features
◆
◆
7007L
◆
◆
True Dual-Ported memory cells which allow simultaneous
reads of the same memory location
High-speed access
– Commercial: 15ns (max.)
– Industrial: 20ns (max.)
Low-power operation
– IDT7007L
Active: 850mW (typ.)
Standby: 1mW (typ.)
IDT7007 easily expands data bus width to 16 bits or more
using the Master/Slave select when cascading more than
one device
◆
◆
◆
◆
◆
◆
◆
◆
◆
M/S = H for
BUSY
output flag on Master,
M/S = L for
BUSY
input on Slave
Interrupt Flag
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling
between ports
Fully asynchronous operation from either port
TTL-compatible, single 5V (±10%) power supply
Available in a 68-pin PLCC and a 80-pin TQFP
Industrial temperature range (–40°C to +85°C) is available
for selected speeds
Green parts available, see ordering information
Functional Block Diagram
OE
L
CE
L
R/W
L
OE
R
CE
R
R/W
R
I/O
0L
- I/O
7L
I/O
Control
BUSY
L
A
14L
A
0L
(1,2)
I/O
0R
-I/O
7R
I/O
Control
BUSY
R
A
14R
A
0R
(1,2)
Address
Decoder
15
MEMORY
ARRAY
15
Address
Decoder
CE
L
OE
L
R/W
L
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
CE
R
OE
R
R/W
R
SEM
L
(2)
INT
L
M/S
SEM
R
INT
R
(2)
2940 drw 01
NOTES:
1. (MASTER):
BUSY
is output; (SLAVE):
BUSY
is input.
2.
BUSY
and
INT
outputs are non-tri-stated push-pull.
SEPTEMBER 2019
1
DSC 2940/16
7007L
High-Speed 32K x 8 Dual-Port Static RAM
Military,
Industrial and Commercial Temperature Ranges
Description
The IDT7007 is a high-speed 32K x 8 Dual-Port Static RAM. The
IDT7007 is designed to be used as a stand-alone 256K-bit Dual-Port RAM
or as a combination MASTER/SLAVE Dual-Port RAM for 16-bit-or-more
word systems. Using the IDT MASTER/SLAVE Dual-Port RAM approach
in 16-bit or wider memory system applications results in full-speed, error-
free operation without the need for additional discrete logic.
This device provides two independent ports with separate control,
address, and I/O pins that permit independent, asynchronous access for
reads or writes to any location in memory. An automatic power down
feature controlled by
CE
permits the on-chip circuitry of each port to enter
a very LOW standby power mode.
Fabricated using CMOS high-performance technology, these de-
vices typically operate on only 850mW of power.
The IDT7007 is packaged in a 68-pin PLCC and an 80-pin thin
quad flatpack TQFP.
Pin Configurations
(1,2,3)
I/O
6R
I/O
5R
I/O
4R
I/O
3R
V
CC
I/O
2R
I/O
1R
I/O
0R
GND
V
CC
I/O
7L
I/O
6L
GND
I/O
5L
I/O
4L
I/O
3L
I/O
2L
26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10
I/O
7R
N/C
OE
R
R/
W
R
SEM
R
CE
R
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
9
8
7
6
5
4
3
2
1
68
67
66
65
64
63
62
I/O
1L
I/O
0L
N/C
OE
L
R/
W
L
SEM
L
CE
L
A
14R
A
13R
GND
A
12R
A
11R
A
10R
A
9R
A
8R
A
7R
A
6R
A
5R
7007
PLG68
(4)
68-Pin PLCC
Top View
61
43
44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60
A
14L
A
13L
V
CC
A
12L
A
11L
A
10L
A
9L
A
8L
A
7L
A
6L
2940 drw 02
A
4R
A
3R
A
2R
A
1R
A
0R
INT
R
BUSY
R
NOTES:
1. All Vcc pins must be connected to power supply.
2. All GND pins must be connected to ground.
3. Package body is approximately .95 in x .95 in x .17 in.
4. This package code is used to reference the package diagram.
2
BUSY
L
INT
L
M/S
GND
A
0L
A
1L
A
2L
A
3L
A
4L
A
5L
7007L
High-Speed 32K x 8 Dual-Port Static RAM
Military,
Industrial and Commercial Temperature Ranges
Pin Configurations
(1,2,3)
(con't.)
N/C
A
5L
A
4L
A
3L
A
2L
A
1L
A
0L
INT
L
BUSY
L
GND
M/S
BUSY
R
INT
R
A
0R
A
1R
A
2R
A
3R
A
4R
N/C
N/C
N/C
N/C
A
6L
A
7L
A
8L
A
9L
A
10L
A
11L
A
12L
V
CC
A
13L
A
14L
N/C
CE
L
SEM
L
R/W
L
OE
L
N/C
I/O
0L
I/O
1L
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
61
40
62
39
63
38
64
37
65
36
66
35
67
34
68
33
69
32
7007
70
31
PNG80
(4)
71
30
72
29
80-Pin TQFP
73
28
Top View
74
27
75
26
76
25
77
24
78
23
79
22
80
21
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
N/C
N/C
A
5R
A
6R
A
7R
A
8R
A
9R
A
10R
A
11R
A
12R
GND
A
13R
A
14R
N/C
CE
R
SEM
R
R/W
R
OE
R
N/C
I/O
7R
NOTES:
1. All Vcc pins must be connected to power supply.
2. All GND pins must be connected to ground.
3. Package body is approximately 14mm x 14mm x 1.4mm.
4. This package code is used to reference the package diagram.
N/C
I/O
2L
I/O
3L
I/O
4L
I/O
5L
GND
I/O
6L
I/O
7L
V
CC
N/C
GND
I/O
0R
I/O
1R
I/O
2R
V
CC
I/O
3R
I/O
4R
I/O
5R
I/O
6R
N/C
3
2940 drw 03
7007L
High-Speed 32K x 8 Dual-Port Static RAM
Military,
Industrial and Commercial Temperature Ranges
Pin Configurations
(1,2,3)
(con't.)
51
11
53
A
7L
55
A
9L
A
5L
52
A
6L
54
A
8L
50
A
4L
49
A
3L
48
A
2L
47
A
1L
46
44
42
A
0L
BUSY
L
M/S
40
38
INT
R
A
1R
36
A
3R
35
A
4R
32
A
7R
30
A
9R
11/06/01
10
45
43
41
39
37
INT
L
GND
BUSY
R
A
0R
A
2R
34
A
5R
33
A
6R
31
A
8R
09
08
57
56
A
11L
A
10L
59
58
V
CC
A
12L
61
60
A
13L
07
IDT7007G
GU68
(4)
68-Pin PGA
Top View
(5)
28
29
A
11R
A
10R
26
GND
27
A
12R
06
A
14L
05
63
62
SEM
L
CE
L
24
25
A
14R
A
13R
22
23
SEM
R
CE
R
20
OE
R
21
R/W
R
,
65
64
04
OE
L
R/W
L
03
67
66
I/O
0L
N/C
1
3
68
I/O
1L
I/O
2L
I/O
4L
2
01
A
INDEX
4
I/O
5L
I/O
3L
B
C
5
7
9
11
13
15
GND I/O
7L
GND I/O
1R
V
CC
I/O
4R
6
I/O
6L
D
8
10
12
14
16
V
CC
I/O
0R
I/O
2R
I/O
3R
I/O
5R
E
F
G
H
J
02
18
19
I/O
7R
N/C
17
I/O
6R
K
L
2940 drw 04b
NOTES:
1. All Vcc pins must be connected to power supply
2. All GND pins must be connected to ground.
3. Package body is approximately 1.8 in x 1.8 in x .16 in.
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part marking.
Pin Names
Left Port
CE
L
R/W
L
OE
L
A
0L
- A
14L
I/O
0L
- I/O
7L
SEM
L
INT
L
BUSY
L
CE
R
R/W
R
OE
R
A
0R
- A
14R
I/O
0R
- I/O
7R
SEM
R
INT
R
BUSY
R
M/S
V
CC
GND
Right Port
Names
Chip Enables
Read/Write Enable
Output Enable
Address
Data Input/Output
Semaphore Enable
Interrupt Flag
Busy Flag
Master or Slave Select
Power
Ground
2940 tbl 01
4
7007L
High-Speed 32K x 8 Dual-Port Static RAM
Military,
Industrial and Commercial Temperature Ranges
Truth Table I: Non-Contention Read/Write Control
Inputs
(1)
CE
H
L
L
X
R/W
X
L
H
X
OE
X
X
L
H
SEM
H
H
H
X
Outputs
I/O
0-7
High-Z
DATA
IN
DATA
OUT
High-Z
Deselected: Power-Down
Write to Memory
Read Memory
Outputs Disabled
2940 tbl 02
Mode
NOTE:
1. A
0L
— A
14L
≠
A
0R
— A
14R
Truth Table II: Semaphore Read/Write Control
(1)
Inputs
CE
H
H
L
R/W
H
OE
L
X
X
SEM
L
L
L
Outputs
I/O
0-7
DATA
OUT
DATA
IN
______
Mode
Read Semap hore Flag Data Out (I/O
0
-I/O
7
)
Write I/O
0
into Semaphore Flag
Not Allowed
2940 tbl 03
↑
X
NOTE:
1. There are eight semaphore flags written to via I/O
0
and read from all I/O's. These eight semaphores are addressed by A
0
- A
2
.
Absolute Maximum Ratings
(1)
Symbol
V
TERM
(2)
Rating
Terminal Voltage
with Respect
to GND
Temperature
Under Bias
Storage
Temperature
DC Output
Current
Commercial
& Industrial
-0.5 to +7.0
Military
-0.5 to +7.0
Unit
V
Maximum Operating Temperature
and Supply Voltage
(1)
Grade
Military
Ambient
Temperature
-55
O
C to+125
O
C
0
O
C to +70
O
C
-40
O
C to +85
O
C
GND
0V
0V
0V
Vcc
5.0V
+
10%
5.0V
+
10%
5.0V
+
10%
2940 tbl 05
T
BIAS
T
STG
I
OUT
-55 to +125
-65 to +150
50
-65 to +135
-65 to +150
50
o
C
C
Commercial
Industrial
o
mA
2940 tbl 04
NOTES:
1. This is the parameter T
A
. This is the "instant on" case temperature.
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM
RATINGS
may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those
indicated in the operational sections of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect
reliability.
2. V
TERM
must not exceed Vcc + 10% for more than 25% of the cycle time or 10ns maximum,
and is limited to < 20mA for the period of V
TERM
> Vcc + 10%.
Recommended DC Operating
Conditions
Symbol
V
CC
GND
V
IH
Parameter
Supply Voltage
Ground
Input High Voltage
Input Low Voltage
Min.
4.5
0
2.2
-0.5
(1)
Typ.
5.0
0
____
____
Max.
5.5
0
6.0
(2)
0.8
Unit
V
V
V
V
2940 tbl 06
Capacitance
(T
A
= +25°C, f = 1.0Mhz)
Symbol
C
IN
C
OUT
Parameter
(1)
Conditions
(2)
Max.
9
10
Unit
pF
pF
2940 tbl 07
V
IL
Input Capacitance
Output Capacitance
V
IN
= 3dV
V
OUT
= 3dV
NOTES:
1. V
IL
> -1.5V for pulse width less than 10ns.
2. V
TERM
must not exceed Vcc + 10%.
NOTES:
1. This parameter is determined by device characterization but is not production
tested. TQFP package only.
2. 3dV represents the interpolated capacitance when the input and output signals
switch from 0V to 3V or from 3V to 0V.
5
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