MADS-011010-1419
Schottky Zero Bias Detector Diode Chip
V1
Absolute Maximum Ratings
1,2
Features
•
•
•
•
•
•
P-Type Schottky Diode
Can be used Without External DC Bias
Large Bondable Contact
RoHs Compliant
Available in Chip Form (ODS-1419)
Can be Mounted with Solder or
Conductive Epoxy.
Operating Temperature
Storage Temperature
Reverse Voltage @ 25
°C
Maximum Mounting
Temperature
ESD Classification
3
-55°C to +125°C
-55°C to +150°C
1.5 Volts
+320C for 10 sec.
Class 0
Description
M/ A - CO M
T e c h n o lo g y
S o lu t io n s ’
MADS-011010-1419 Zero Bias Detector
Diode (ZBD) is suitable for use in microstrip
or stripline detector circuits. These chips
can be used in automatic assembly
processes due to their 2.6 x 5.7 mil rectan-
gular gold contact and sturdy construction.
.
1.
2.
3.
Exceeding any one or combination of these limits may cause
permanent damage to this device.
M/A-COM does not recommend sustained operation near
these survivability limits.
Human Body Model
Chip Layout ( ODS– 1419 )
Cathode Contact
Ordering Information
Part Number
MAVR-011010-14190G
Package
Gel Pack
Full Area Anode
1
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes
Commitment to produce in volume is not guaranteed.
to the product(s) or information contained herein without notice.
MADS-011010-1419
Schottky Zero Bias Detector Diode Chip
Electrical Specifications @ T
A
= +25 °C
Parameter
Condition
Symbol
Specification
V1
Breakdown Voltage
Forward Voltage
Forward Voltage
Total Capacitance
I
R
= 100µA
I
F
= .1 mA
I
F
= 1 mA
V
R
= .5 V
f = 1 MHz
V
B
V
F
V
F
C
T
1.5 V min.
60 - 120mV max.
150 - 220mV max.
0.15 pF Typical.
Dynamic Resistance
I
F
= 9.5 -10.5mA
R
D
40 Ohms max.
Chip Dimensions (ODS - 1419)
Dimension
A
B
C
Mils
10.5 +/- 1.0
7 +/- 1.0
2.6 X 5.7
mm
0.266 +/- 0.025
0.177 +/- 0.025
.066 X .144
1. Topside metal (cathode contact) thickness :
10 microns Au ( typical )
2. Backside metal (anode contact) thickness:
.1 micron Au ( typical )
2
* Specifications are subject to change without prior notification
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes
Commitment to produce in volume is not guaranteed.
to the product(s) or information contained herein without notice.
MADS-011010-1419
Schottky Zero Bias Detector Diode Chip
V1
Die Handling and Mounting Information
Handling:
All semiconductor chips should be handled with care in order to avoid damage or contamination
from perspiration, salts, and skin oils. For individual die, the use of plastic tipped tweezers or vacuum pick up
tools is strongly recommended. Bulk handling should ensure that abrasion and mechanical shock are mini-
mized.
Die Attach:
The die have Ti-Pt-Au back metal and gold plated contact metal. Die can be mounted with a gold
-tin, eutectic solder preform or conductive silver epoxy.
Eutectic Die Attachment Using Hot Gas Die Bonder:
An 80/20, gold tin eutectic solder perform is
recommended with a work surface temperature of 255°C and a tool tip temperature of 220°C. When the hot gas
is applied, the temperature at the tool tip should be approximately 290°C. The chip should not be exposed to
temperature greater than 320°C for more than 10 seconds.
Eutectic Die Attachment Using Reflow Oven:
See Application Note M541, “Bonding and Handling
Procedures for Chip Diode Devices” . Link below.
Epoxy Die Attachment:
A thin, controlled amount of electrically conductive silver epoxy should be applied
at approximately a 1-2 mils thickness to minimize ohmic and thermal resistances. A thin epoxy fillet should be
visible around the perimeter of the chip after placement to ensure full area coverage. Cure conductive epoxy per
manufacturer’s schedule.
Wire Bonding:
0.001” diameter gold wire is recommended with a stage temperature of 150°C and minimal
force. Ultrasonic energy should be adjusted to the minimum required. Automatic ball bonding can also be used.
S
ee Application Note M541, “Bonding and Handling Procedures for Chip Diode Devices” for
more detailed handling and assembly instructions at following link:
http://www.macom.com/Application%20Notes/pdf/m541.pdf
.
3
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes
Commitment to produce in volume is not guaranteed.
to the product(s) or information contained herein without notice.
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