Multi-Port SRAM, 16X4, 30ns, TTL, CHIP-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | DIE |
| 包装说明 | DIE, LCC28,.45SQ |
| 针数 | 28 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.2.C |
| 最长访问时间 | 30 ns |
| JESD-30 代码 | S-XUUC-N28 |
| JESD-609代码 | e0 |
| 长度 | 11.43 mm |
| 内存密度 | 64 bit |
| 内存集成电路类型 | MULTI-PORT SRAM |
| 内存宽度 | 4 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 28 |
| 字数 | 16 words |
| 字数代码 | 16 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 16X4 |
| 输出特性 | 3-STATE |
| 可输出 | YES |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装等效代码 | LCC28,.45SQ |
| 封装形状 | SQUARE |
| 封装形式 | UNCASED CHIP |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) |
| 座面最大高度 | 2.54 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | UPPER |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 11.43 mm |
| AM29705ALM-B | AM29707LM-B | AM29707DM-B | AM29705AFM-B | AM29705ADC-B | AM29707DC-B | AM29707FM-B | AM29705ADM-B | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Multi-Port SRAM, 16X4, 30ns, TTL, CHIP-28 | Multi-Port SRAM, 16X4, 30ns, TTL, CHIP-28 | Multi-Port SRAM, 16X4, 30ns, TTL, CDIP28, CERAMIC, SLIMDIP-28 | Multi-Port SRAM, 16X4, 30ns, TTL, PDFP28, FLAT PACK-28 | Multi-Port SRAM, 16X4, 25ns, TTL, CDIP28, CERAMIC, SLIMDIP-28 | Multi-Port SRAM, 16X4, 25ns, TTL, CDIP28, CERAMIC, SLIMDIP-28 | Multi-Port SRAM, 16X4, 30ns, TTL, PDFP28, FLAT PACK-28 | Multi-Port SRAM, 16X4, 30ns, TTL, CDIP28, CERAMIC, SLIMDIP-28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIE | DIE | DIP | DFP | DIP | DIP | DFP | DIP |
| 包装说明 | DIE, LCC28,.45SQ | DIE, LCC28,.45SQ | DIP, DIP28,.6 | DFP, FL28,.4 | DIP, DIP28,.6 | DIP, DIP28,.6 | DFP, FL28,.4 | DIP, DIP28,.6 |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | compliant | unknown | unknown | unknown | unknown | unknown | unknown | compliant |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | EAR99 | EAR99 | 3A001.A.2.C | 3A001.A.2.C |
| 最长访问时间 | 30 ns | 30 ns | 30 ns | 30 ns | 25 ns | 25 ns | 30 ns | 30 ns |
| JESD-30 代码 | S-XUUC-N28 | S-XUUC-N28 | R-CDIP-T28 | R-PDFP-F28 | R-CDIP-T28 | R-CDIP-T28 | R-PDFP-F28 | R-CDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit |
| 内存集成电路类型 | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words |
| 字数代码 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - | - | -55 °C | -55 °C |
| 组织 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIE | DIE | DIP | DFP | DIP | DIP | DFP | DIP |
| 封装等效代码 | LCC28,.45SQ | LCC28,.45SQ | DIP28,.6 | FL28,.4 | DIP28,.6 | DIP28,.6 | FL28,.4 | DIP28,.6 |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | UNCASED CHIP | UNCASED CHIP | IN-LINE | FLATPACK | IN-LINE | IN-LINE | FLATPACK | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.54 mm | 2.54 mm | 5.715 mm | 2.032 mm | 5.715 mm | 5.715 mm | 2.032 mm | 5.715 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | NO | NO | YES | NO |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | NO LEAD | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | UPPER | UPPER | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
| 长度 | 11.43 mm | 11.43 mm | 37.338 mm | - | 37.338 mm | 37.338 mm | - | 37.338 mm |
| 筛选级别 | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | - | - | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) |
| 宽度 | 11.43 mm | 11.43 mm | 15.24 mm | - | 15.24 mm | 15.24 mm | - | 15.24 mm |
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