ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, ECL, CDIP42, SIDE BRAZED, CERAMIC, DIP-42
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Signal Processing Technologies |
| 包装说明 | SIDE BRAZED, CERAMIC, DIP-42 |
| Reach Compliance Code | unknown |
| 最大模拟输入电压 | |
| 最小模拟输入电压 | -2 V |
| 最长转换时间 | 0.004 µs |
| 转换器类型 | ADC, FLASH METHOD |
| JESD-30 代码 | R-CDIP-T42 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 0.293% |
| 标称负供电电压 | -5.2 V |
| 模拟输入通道数量 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 42 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -25 °C |
| 输出位码 | BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, 8 BITS |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP42,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | -5.2 V |
| 认证状态 | Not Qualified |
| 采样速率 | 250 MHz |
| 表面贴装 | NO |
| 技术 | ECL |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| SPT7725AIJ | SPT7725AIQ | SPT7725BMJ | |
|---|---|---|---|
| 描述 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, ECL, CDIP42, SIDE BRAZED, CERAMIC, DIP-42 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, ECL, CQFP44, CERQUAD-44 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, ECL, CDIP42, CERAMIC, 42 PIN |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 包装说明 | SIDE BRAZED, CERAMIC, DIP-42 | CERQUAD-44 | CERAMIC, 42 PIN |
| Reach Compliance Code | unknown | unknown | unknown |
| 转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 代码 | R-CDIP-T42 | S-GQFP-G44 | R-CDIP-T42 |
| JESD-609代码 | e0 | e0 | e0 |
| 最大线性误差 (EL) | 0.293% | 0.293% | 0.3711% |
| 标称负供电电压 | -5.2 V | -5.2 V | -5.2 V |
| 模拟输入通道数量 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 42 | 44 | 42 |
| 最高工作温度 | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -25 °C | -25 °C | -55 °C |
| 输出位码 | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | QFP | DIP |
| 封装等效代码 | DIP42,.6 | QFP44,.7SQ,40 | DIP42,.6 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | IN-LINE |
| 电源 | -5.2 V | -5.2 V | -5.2 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 250 MHz | 250 MHz | 300 MHz |
| 表面贴装 | NO | YES | NO |
| 技术 | ECL | ECL | ECL |
| 温度等级 | OTHER | OTHER | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL |
| 厂商名称 | Signal Processing Technologies | - | Signal Processing Technologies |
| 最小模拟输入电压 | -2 V | -2 V | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
