Pentium
®
III Processor for the PGA370
Socket at 500 MHz to 1.13 GHz
Datasheet
Revision 8
Product Features
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Available in 1.13 GHz, 1B GHz, 933, 866,
800EB, 733, 667, 600EB, and 533EB MHz
for a 133 MHz system bus
Available in 1.10 GHz, 1 GHz, 900, 850,
800, 750, 700, 650, 600E, 550E, and 500E
MHz for a 100 MHz system bus
System bus frequency at 100 MHz and
133 MHz (“E” denotes support for
Advanced Transfer Cache and Advanced
system buffering; “B” denotes support for a
133 MHz system bus where both bus
frequencies are available for order per each
given core frequency; See Table 1 for a
summary of features for each line item.)
Available in versions that incorporate
256-KB Advanced Transfer Cache (on-die,
full speed Level 2 (L2) cache with Error
Correcting Code (ECC))
Dual Independent Bus (DIB) architecture:
Separate dedicated external System Bus and
dedicated internal high-speed cache bus
Internet Streaming SIMD Extensions for
enhanced video, sound and 3D performance
Binary compatible with applications running
on previous members of the Intel
microprocessor line
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Dynamic execution micro architecture
Intel Processor Serial Number
Power Management capabilities
— System Management mode
— Multiple low-power states
Optimized for 32-bit applications running on
advanced 32-bit operating systems
Flip Chip Pin Grid Array (FC-PGA/FC-PGA2)
packaging technology; FC-PGA/FC-PGA2
processors deliver high performance with
improved handling protection and socketability
Integrated high performance 16-KB instruction
and 16-KB data, nonblocking, level one cache
256-KB Integrated Full Speed level two cache
allows for low latency on read/store operations
Double Quad Word Wide (256 bit) cache data
bus provides extremely high throughput on
read/store operations.
8-way cache associativity provides improved
cache hit rate on reads/store operations.
Error-correcting code for System Bus data
Enables systems which are scaleable for up to
two processors
The Pentium
®
III processor is designed for high-performance desktops and for workstations and
servers. It is binary compatible with previous Intel Architecture processors. The Pentium III processor
provides great performance for applications running on advanced operating systems such as Windows*
98, Windows NT and UNIX*. This is achieved by integrating the best attributes of Intel processors—
the dynamic execution, Dual Independent Bus architecture plus Intel MMX™ technology and Internet
Streaming SIMD Extentions— bringing a new level of performance for systems buyers. The Pentium
III processor is scaleable to two processors in a multiprocessor system and extends the power of the
Pentium
®
II processor with performance headroom for business media, communication and internet
capabilities. Systems based on Pentium III processors also include the latest features to simplify system
management and lower the cost of ownership for large and small business environments. The Pentium
III processor offers great performance for today’s and tomorrow’s applications.
FC-PGA370 Package
June 2001
Document Number
:
245264-08
Information in this document is provided in connection with Intel
®
products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Pentium
®
III processor may contain design defects or errors known as errata which may cause the product to deviate from published
specifcations. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling
1-800-548-4725 or by visiting Intel's website at http://www.intel.com.
Intel, Pentium II, Pentium III, Pentium Pro, Celeron and Intel387 are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the
United States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © Intel Corporation, 2001
Datasheet
Pentium
®
III Processor for the PGA370 Socket at 500 MHz to 1.13 GHz
Contents
1.0
Introduction
.................................................................................................................. 8
1.1
Terminology........................................................................................................... 9
1.1.1 Package and Processor Terminology ...................................................... 9
1.1.2 Processor Naming Convention...............................................................10
Related Documents.............................................................................................11
Processor System Bus and V
REF
........................................................................13
Clock Control and Low Power States..................................................................14
2.2.1 Normal State—State 1 ...........................................................................15
2.2.2 AutoHALT Powerdown State—State 2...................................................15
2.2.3 Stop-Grant State—State 3 .....................................................................16
2.2.4 HALT/Grant Snoop State—State 4 ........................................................16
2.2.5 Sleep State—State 5..............................................................................16
2.2.6 Deep Sleep State—State 6 ....................................................................17
2.2.7 Clock Control..........................................................................................17
Power and Ground Pins ......................................................................................17
2.3.1 Phase Lock Loop (PLL) Power...............................................................18
Decoupling Guidelines .......................................................................................19
2.4.1 Processor VCC
CORE
and AGTL+ (AGTL) Decoupling ...........................19
Processor System Bus Clock and Processor Clocking .......................................19
2.5.1 Mixing Processors of Different Frequencies...........................................20
Voltage Identification ...........................................................................................20
Processor System Bus Unused Pins...................................................................22
Processor System Bus Signal Groups ................................................................22
2.8.1 Asynchronous vs. Synchronous for System Bus Signals .......................24
2.8.2 System Bus Frequency Select Signals (BSEL[1:0]) ...............................25
Maximum Ratings................................................................................................26
Processor DC Specifications...............................................................................27
2.10.1 ICC Slew Rate Specifications.................................................................33
AGTL / AGTL+ System Bus Specifications .........................................................36
System Bus AC Specifications ............................................................................37
2.12.1 I/O Buffer Model .....................................................................................37
BCLK/BCLK# and PICCLK Signal Quality Specifications and Measurement
Guidelines ...........................................................................................................46
AGTL+ / AGTL Signal Quality Specifications and Measurement Guidelines ......47
AGTL+ Signal Quality Specifications and Measurement Guidelines ..................48
3.3.1 Overshoot/Undershoot Guidelines .........................................................48
3.3.2 Overshoot/Undershoot Magnitude .........................................................49
3.3.3 Overshoot/Undershoot Pulse Duration...................................................49
3.3.4 Activity Factor .........................................................................................49
3.3.5 Reading Overshoot/Undershoot Specification Tables............................50
3.3.6 Determining if a System Meets the Overshoot/Undershoot
Specifications .........................................................................................51
Non-AGTL+ (Non-AGTL) Signal Quality Specifications and Measurement
1.2
2.0
Electrical Specifications
........................................................................................13
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
3.0
Signal Quality Specifications
..............................................................................46
3.1
3.2
3.3
3.4
Datasheet
3
Pentium
®
III Processor for the PGA370 Socket at 500 MHz to 1.13 GHz
Guidelines ........................................................................................................... 54
3.4.1 Overshoot/Undershoot Guidelines ......................................................... 54
3.4.2 Ringback Specification........................................................................... 55
3.4.3 Settling Limit Guideline .......................................................................... 55
4.0
Thermal Specifications and Design Considerations
................................. 56
4.1
4.2
4.3
Thermal Specifications........................................................................................ 56
Processor Die Area ............................................................................................. 57
Thermal Diode..................................................................................................... 58
FC-PGA Mechanical Specifications .................................................................... 60
5.1.1 FC-PGA2 Mechanical Specifications ..................................................... 63
Processor Markings ............................................................................................ 65
5.2.1 Processor Markings for FC-PGA2.......................................................... 65
Recommended Mechanical Keep-Out Zones ..................................................... 66
Processor Signal Listing...................................................................................... 67
Mechanical Specifications for the Boxed Intel
®
Pentium
®
III Processor.............. 80
6.1.1 Boxed Processor Thermal Cooling Solution Dimensions....................... 80
6.1.2 Boxed Processor Heatsink Weight......................................................... 82
6.1.3 Boxed Processor Thermal Cooling Solution Clip ................................... 82
Thermal Specifications........................................................................................ 82
6.2.1 Boxed Processor Cooling Requirements ............................................... 82
Electrical Requirements for the Boxed Intel
®
Pentium
®
III Processor................. 83
6.3.1 Fan Heatsink Power Supply ................................................................... 83
Alphabetical Signals Reference .......................................................................... 85
Signal Summaries ............................................................................................... 92
5.0
Mechanical Specifications
.................................................................................. 60
5.1
5.2
5.3
5.4
6.0
Boxed Processor Specifications
....................................................................... 80
6.1
6.2
6.3
7.0
Processor Signal Description
............................................................................. 85
7.1
7.2
4
Datasheet
Pentium
®
III Processor for the PGA370 Socket at 500 MHz to 1.13 GHz
Figures
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Second Level (L2) Cache Implementation ........................................................... 8
AGTL+/AGTL Bus Topology in a Uniprocessor Configuration ............................14
AGTL+/AGTL Bus Topology in a Dual-Processor Configuration ........................14
Stop Clock State Machine ...................................................................................15
Processor Vcc
CMOS
Package Routing ................................................................18
Differential Clocking Example .............................................................................20
BSEL[1:0] Example for a 100/133 MHz or 100 MHz Only System Design .........25
Slew Rate (23A Load Step).................................................................................33
Generic Clock Waveform ....................................................................................41
BCLK, PICCLK, and TCK Generic Clock Waveform...........................................42
System Bus Valid Delay Timings ........................................................................42
System Bus Setup and Hold Timings..................................................................43
System Bus Reset and Configuration Timings....................................................43
Platform Power-On Sequence Timings ...............................................................44
Power-On Reset and Configuration Timings.......................................................45
BCLK, PICCLK Generic Clock Waveform at the Processor Pins........................47
Low to High AGTL+ Receiver Ringback Tolerance.............................................48
Maximum Acceptable AGTL+ Overshoot/Undershoot Waveform .......................53
Maximum Acceptable AGTL Overshoot/Undershoot Waveform .........................53
Non-AGTL+ (Non-AGTL) Overshoot/Undershoot, Settling Limit, and
Ringback 1 ..........................................................................................................54
Processor Functional Die Layout for FC-PGA.....................................................58
FC-PGA and FC-PGA2 Package Types .............................................................60
Package Dimensions...........................................................................................61
Package Dimensions for FC-PGA2.....................................................................63
FC-PGA2 Flatness Specification.........................................................................64
Top Side Processor Markings for FC-PGA (up to CPUID 0x686H) ....................65
Top Side Processor Markings for FC-PGA (for CPUID 0x68AH)).......................65
Top Side Processor Markings for FC-PGA2 .......................................................66
Volumetric Keep-Out for FC-PGA and FC-PGA2................................................66
Component Keep-Out .........................................................................................67
Intel
®
Pentium
®
III Processor Pinout ...................................................................68
Conceptual Boxed Intel
®
Pentium
®
III Processor for the PGA370 Socket ..........80
Dimensions of Mechanical Step Feature in Heatsink Base.................................81
Dimensions of Notches in Heatsink Base ...........................................................82
Thermal Airspace Requirement for all Boxed Intel
®
Pentium
®
III Processor Fan
Heatsinks in the PGA370 Socket ........................................................................83
Boxed Processor Fan Heatsink Power Cable Connector Description.................84
Motherboard Power Header Placement Relative to the Boxed
Intel
®
Pentium
®
III Processor ..............................................................................84
Datasheet
5
MEMS传感器
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