MADP-017025-1314
MADP-030025-1314
SURMOUNT™ 25µM PIN Diodes
RoHS Compliant
Case Style ODS 1314
Features
♦
♦
♦
♦
♦
♦
♦
♦
0603 Outline
Surface Mount
25µm I-Region Length Devices
No Wirebonds Required
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
High Average and Peak Power Handling
Rev. V5
Description
This device is a silicon, glass PIN diode surmount chip
fabricated with M/A-COM’s patented HMIC
TM
process.
This device features two silicon pedestals embedded in a
low loss, low dispersion glass. The diode is formed on the
top of one pedestal and connections to the backside of the
device are facilitated by making the pedestal sidewalls
electrically conductive. Selective backside metallization is
applied producing a surface mount device. This vertical
topology provides for exceptional heat transfer. The
topside is fully encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact protection.
These protective coatings prevent damage to the junction
and the anode air-bridge during handling and assembly.
Applications
These packageless devices are suitable for usage in
moderate incident power,
≤50dBm/C.W.
or where the peak
power is
≤75dBm,
pulse width is 1µS, and duty cycle is
0.01%. Their low parasitic inductance, 0.4 nH, and
excellent RC constant, make these devices a superior
choice for higher frequency switch elements when
compared to their plastic package counterparts
.
Chip Dimensions
DIM
A
B
C
D
E
F
G
Notes:
1) Backside metal: 0.1microns thick.
2) Yellow area with hatch lines indicate backside ohmic gold
contacts.
3) Both devices have same outline dimensions ( A to G).
INCHES
Min
0.060
0.031
0.004
0.019
0.019
0.019
0.029
Max
0.062
0.032
0.008
0.021
0.021
0.021
0.031
Min
1.525
0.775
0.102
0.475
0.475
0.475
0.725
MM
Max
1.575
0.825
0.203
0.525
0.525
0.525
0.775
Absolute Maximum Ratings
1
@ TA = +25°C
(unless otherwise specified)
Parameter
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
C.W. Incident Power
Peak Incident Power (dBm)
Mounting Temperature
1
Absolute Maximum
500 mA
- 135 V
-55°C to +125°C
-55 °C to +150°C
+175°C
+44dBm MADP-017025
+47dBM MADP-030025
+50 dBm, 10µS, 1% duty
+280°C for 30 seconds
1) Exceeding these limits may cause permanent damage
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.4155721
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MADP-017025-1314
MADP-030025-1314
SURMOUNT™ 25µM PIN Diodes
RoHS Compliant
Electrical Specifications @ T
A
= 25°C (unless otherwise noted)
Parameter
Capacitance
1
Capacitance
1
Capacitance
1
, 85°C
Resistance
2
Resistance
2
Resistance
2
, 85°C
Resistance
2
, 85°C
Forward Voltage
Reverse Leakage
Current
Third Order
Intercept Point
C.W.
Thermal Resistance
Lifetime
Rev. V5
Symbol
C
T
C
T
C
T
R
S
R
S
R
S
R
S
V
F
I
R
Conditions
- 40V, 1MHz
1
- 40V, 1GHz
1,3
- 40V, 1GHz
1,3
+10mA, 1GHz
2,3
+70mA, 1GHz
2,3
+10mA, 1GHz
2,3
+70mA, 1GHz
2,3
+10mA
| -135V |
F1 = 1800MHz
F2 = 1810MHz
Input Power = +39dBm CW
I bias = +70mA
I
H
= 0.5A, I
L
= 10mA
+10mA / -6mA
( 50 % - 90 % V )
Units
pF
pF
pF
Ω
Ω
Ω
Ω
V
µA
Min
Typ
0.23
0.23
0.22
1.01
0.64
1.48
1.03
0.74
-
Max
0.29
Min
Typ
0.50
0.50
-
0.65
0.45
-
-
Max
0.56
MADP-017025
MADP-030025
0.90
10
0.73
-
0.90
10
IP3
dBm
76
77
R
qJL
°C/W
30
13
T
L
uS
2.3
2.8
Notes:
1) Total capacitance, C
T
, is equivalent to the sum of Junction Capacitance ,C
j
, and Parasitic Capacitance, C
par
.
2)
3)
Series resistance R
S
is equivalent to the total diode resistance : R
s
= R
j
( Junction Resistance) + R
c
( Ohmic Resistance)
R
s
and C
T
are measured on an HP4291A Impedance Analyzer with die mounted in an ODS213 package with 80/20,
Au/Sn solder.
MADP-0XX025 Series
Typical Spice Parameters @ +25°C
Spice Parameter
Units
MADP-017025-1314
MADP-030025-1314
2
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.4155721
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
N
-
1.1
1.1
RS
Ω
1.4
1.3
IS
A
5.1E-15
7.8E-15
IK
BV
IBV
Ct
CJO
VJ
M
-
0.50
0.50
FC
-
0.12
0.07
Cpar_Cj
(F)
2.7E-13
5.3E-13
(mA) (Volts) (µA)
12.6
12.7
175
175
10
10
(pF) (pF) (Volts)
0.38
0.80
0.10
0.27
0.17
0.12
MADP-017025-1314
MADP-030025-1314
SURMOUNT™ 25µM PIN Diodes
RoHS Compliant
MADP-0XXX15 Series Typical Performance Curves @ +25°C
Ct vs. V
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
0
10.00
Rs @ 1GHz (ohm)
Rev. V5
Rs vs. I
Ct @ 1GHz (pF)
MADP-030025
MADP-017025
1.00
MADP-030025
MADP-017025
10
20
Voltage (V)
30
40
0.10
0.001
0.01
Current (A)
0.1
Ct vs. Freq.
0.8
0V
10V
40V
0V
10V
40V
MADP-17025
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
0.7
0.6
Ct (pF)
0.5
0.4
0.3
0.2
0.1
0
Frequency (GHz)
MADP-30025
Ls vs. Freq.
0.2
0.18
0.16
0.14
0.12
0.1
0.08
0.06
0.04
0.02
0
0
0.2
0.4
Ls @ 5, 10, 20mA (nH)
MADP-17025
MADP-30025
0.6
0.8
1
1.2
1.4
1.6
1.8
Frequency (GHz)
Rs vs. Freq.
1.6
1.4
1.2
Rs (ohm)
1.0
0.8
0.6
0.4
0.2
0.0
0.0
3
Ls vs. I
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
0
MADP-017025
MADP-017025
10mA
20mA
5m
A
10mA
20mA
MADP-030025
Ls @ 1GHz (nH)
5m
A
MADP-030025
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.02
0.04
0.06
0.08
0.1
Frequency (GHz)
Current (A)
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.4155721
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MADP-017025-1314
MADP-030025-1314
SURMOUNT™ 25µM PIN Diodes
RoHS Compliant
Assembly Guidelines
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Rev. V5
Bonding
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder or conductive epoxy attachment onto hard and soft substrates. The use
of 60/40, Pb/Sn, 80/20, Au/Sn or any other lead-free solder is recommended to achieve the lowest series
resistance and optimum heat sink.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a
vacuum tip and applying a force of 40 - 60 grams to the top surface of the device. When soldering, position the die
so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the
circuit trace near the mounting pads while applying 40 to 60 grams of force perpendicular to the top surface of the
die. Both mounting pads should be heated simultaneously so that the solder under both pads flows at the same
time. The solder joint should not be made one at a time. By doing so, would create an un-equal heat flow and
potentially create thermal stress to the chip.
Solder reflow should not be performed by causing heat to flow through the top surface of the die. Die should be
uniformly heated in a re-flow oven. Proper flow is easily determined looking down from the top since the HMIC
glass is transparent and the edges of the mounting pads can be visually inspected through the die after
attachment is complete. A typical
soldering
process profile and handling instructions are provided in
Application Notes,
M538 Surface Mounting Instructions
and
M541 Bonding and Handling Procedures
on the
MA-COM website at
www.macomtech.com.
Conductive silver epoxy may also be used for die attachment, in lower Incident power applications where the
average power is < 1 W. Apply a thin controlled amount approximately 1- 2 mils thick to minimize ohmic and
thermal stresses. Take care not to bridge the gap between the chip pads with epoxy. A thin epoxy fillet should be
visible around the perimeter of the pads after placement to ensure full coverage. Cure per epoxy per
manufacturer’s recommended schedule.
Ordering Information
Part Number
MADP-017025-13140G
MADP-017025-13140P
MADP-030025-13140G
MADP-030025-13140P
4
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.4155721
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
Package
100 piece gel pack
3000 piece reel
100 piece gel pack
3000 piece reel
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