Release
by
PARALIGHTDCC
PARA LIGHT NANJING ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan, R.O.C.
Tel: 886-2-2225-3733
Fax: 886-2-2225-4800
http://www.para.com.tw
E-mail:
para@para.com.tw
DATA SHEET
PART NO. : C-1021E
REV :
A/2
CUSTOMER’S APPROVAL : _______________
DRAWING NO. : DS-11-02-0171
DCC : ____________
Page : 1
HD-R/RD012
DATE : 2013-04-10
Release
by
PARALIGHTDCC
1.0
INCH
SINGLE
C-1021E
DIGIT DISPLAY
REV:A / 2
PACKAGE DIMENSIONS
NOTES : 1. All dimensions are in millimeters. (inches)
2. Tolerance is
6
0.25(0.010") unless otherwise specified.
DRAWING NO. : DS-11-02-0171
DATE : 2013-04-10
Page : 2
HD-R/RD013
Release
by
PARALIGHTDCC
1.0
INCH
SINGLE
C-1021E
DIGIT DISPLAY
REV:A / 2
FEATURES
Û
Û
Û
Û
26.00mm (1.0 inch ) DIGIT HEIGHT
COMMON CATHODE
I.C. COMPATIBLE
LOW POWER CONSUMPTION
Raw Material : GaAsP/GaP
ABSOLUTE MAXIMUM RATING : ( Ta = 25BC )
SYMBOL
P
D
V
R
I
AF
I
PF
－
Topr
Tstg
PARAMETER
Power Dissipation Per Segment
Reverse Voltage Per Segment(DP)
Continuous Forward Current Per Segment
Peak Forward Current Per Segment
(1/10 Duty Cycle,0.1ms Pulse Width)
Derating Linear From 25BC Per Segment
Operating Temperature Range
Storage Temperature Range
HI.EFFI RED
75
10(5)
25
100
0.33
UNIT
mW
V
mA
mA
mA/BC
－35BC
to 85BC
－35BC
to 85BC
ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25BC )
SYMBOL
V
F
I
R
l
P
l
D
Δ
l
I
V
PARAMETER
Forward Voltage , Per Segment(DP)
Reverse Current , Per Segment(DP)
Peak Emission Wavelength
Dominant Wavelength
Spectral Line Half－Width
Luminous Intensity Per Segment
TEST
CONDITION
I
F
= 20mA
V
R
=10 (5)V
I
F
= 20mA
I
F
= 20mA
I
F
= 20mA
I
F
= 10mA
1.7
632
622
35
4.2
MIN.
TYP.
MAX.
UNIT
V
mA
nm
nm
nm
mcd
4.2(2.1) 5.6(2.8)
100
DRAWING NO. : DS-11-02-0171
DATE : 2013-04-10
Page : 3
HD-R/RD014
Release
by
PARALIGHTDCC
1.0
INCH
SINGLE
C-1021E
DIGIT DISPLAY
REV:A / 2
DRAWING NO. : DS-11-02-0171
DATE : 2013-04-10
Page : 4
Release
by
PARALIGHTDCC
1.0
—SOLDERING
METHOD
INCH
SINGLE
C-1021E
DIGIT DISPLAY
REV:A / 2
SOLDERING CONDITIONS
REMARK
—
Solder no closer than 2mm from
DIP
SOLDERING
Bath temperature: 260 max
Immersion time: with 5 sec
the base of the package
—
Using soldering flux,” RESIN
FLUX” is recommended.
—
During soldering, take care not to
Soldering iron: 30W or smaller
press the tip of iron against the
SOLDERING
Temperature at tip of iron: 260
℃
or lower
PIN.
IRON
Soldering time: within 5 sec.
(To prevent heat from being
transferred directly to the PIN.)
1) When soldering the PIN of Display in a jig that the package is fixed with a panel (See fIg.1), be
careful not to stress the PIN with iron tip. When soldering Display in a condition that the package is
fixed with a panel, be careful not to cling and stress the surface of Display on the panel to avoid
damaging the Display.
Fig.1
Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin &
copper and silver is proposed with the temperature of Celsius 260. The proportion of the
alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly
3 seconds.
DRAWING NO. : DS-11-02-0171
DATE : 2013-04-10
Page : 5
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