电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

70P3599S166DRG

产品描述Dual-Port SRAM, 128KX36, 12ns, PQFP208, 28 X 28 MM, 4.10 MM HEIGHT, PQFP-208
产品类别存储    存储   
文件大小315KB,共28页
制造商IDT (Integrated Device Technology)
标准  
下载文档 详细参数 选型对比 全文预览

70P3599S166DRG概述

Dual-Port SRAM, 128KX36, 12ns, PQFP208, 28 X 28 MM, 4.10 MM HEIGHT, PQFP-208

70P3599S166DRG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明FQFP,
针数208
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间12 ns
其他特性FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 代码S-PQFP-G208
JESD-609代码e3
长度28 mm
内存密度4718592 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度36
湿度敏感等级3
功能数量1
端子数量208
字数131072 words
字数代码128000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织128KX36
封装主体材料PLASTIC/EPOXY
封装代码FQFP
封装形状SQUARE
封装形式FLATPACK, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度4.1 mm
最大供电电压 (Vsup)1.9 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度28 mm

文档预览

下载PDF文档
Features:
HIGH-SPEED 1.8V
PRELIMINARY
256/128K x 36
IDT70P3519/99
SYNCHRONOUS
DUAL-PORT STATIC RAM
WITH 3.3V/2.5V/1.8V INTERFACE
True Dual-Port memory cells which allow simultaneous
access of the same memory location
Low Power
High-speed data access
– Commercial: 3.4 (200MHz)/3.6ns (166MHz)
– Industrial: 3.6ns (166MHz)
Selectable Pipelined or Flow-Through output mode
Dual chip enables allow for depth expansion without
additional logic
Full synchronous operation on both ports
– 5ns cycle time, 200MHz operation (14Gbps bandwidth)
– Fast 3.4ns clock to data out
– 1.5ns setup to clock and 0.5ns hold on all control, data, and
address inputs @ 200MHz
– Data input, address, byte enable and control registers
– Self-timed write allows fast cycle time
Counter enable and repeat features
Interrupt and Collision Detection Flags
Separate byte controls for multiplexed bus and bus
matching compatibility
Dual Cycle Deselect (DCD) for Pipelined Output Mode
1.8V (±100mV) power supply for core
LVTTL compatible,1.8V to 3.3V power supply for I/Os and
control signals on each port
Industrial temperature range (-40°C to +85°C) is
available at 166MHz
Available in a 256-pin Ball Grid Array (BGA), a 208-pin
Plastic Quad Flatpack (PQFP) and 208-pin fine pitch Ball
Grid Array (fpBGA)
Supports JTAG features compliant with IEEE 1149.1
Due to limited pin count JTAG is not supported on the 208-
pin PQFP package
Green parts available, see ordering information
Functional Block Diagram
BE
3L
BE
2L
BE
1L
BE
0L
BE
3R
BE
2R
BE
1R
BE
0R
FT/PIPE
L
1/0
0a 1a
a
0b 1b
b
0c 1c
c
0d 1d
d
1d 0d
d
1c 0c
c
1b 0b
b
1a 0a
a
1/0
FT/PIPE
R
R/W
L
R/W
R
CE
0L
CE
1L
1
0
1/0
B B
WW
0 1
L L
B B B B
WWWW
2 3 3 2
L L R R
B B
WW
1 0
R R
1
0
1/0
CE
0R
CE
1R
OE
L
OE
R
Dout0-8_L
Dout9-17_L
Dout18-26_L
Dout27-35_L
Dout0-8_R
Dout9-17_R
Dout18-26_R
Dout27-35_R
1d 0d 1c 0c 1b 0b 1a 0a
0a 1a 0b 1b 0c 1c 0d 1d
0/1
,
FT/PIPE
R
FT/PIPE
L
0/1
a bc d
dcba
256/128K x 36
MEMORY
ARRAY
I/O
0L
- I/O
35 L
Din_L
Din_R
I/O
0R
- I/O
35R
CLK
L
A
17L(1)
A
0L
REPEAT
L
ADS
L
CNTEN
L
A
17R(
1)
CLK
R
,
Counter/
Address
Reg.
ADDR_L
ADDR_R
Counter/
Address
Reg.
A
0R
REPEAT
R
ADS
R
CNTEN
R
TDI
TCK
T MS
T RST
CE
0 L
CE1L
R /
W
L
INTERRUPT
COLLISION
DETECTION
LOGIC
CE
0 R
CE1 R
R/
W
R
JTAG
TDO
COL
R
INT
R
COL
L
INT
L
ZZ
L
(2)
NOTES:
1. Address A
17
is a NC for the IDT70P3599.
+. The sleep mode pin shuts off all dynamic inputs, except JTAG inputs, when asserted. All static inputs, i.e., PL/FTx and the
sleep mode pins themselves (ZZx) are not affected during sleep mode.
ZZ
CONTROL
LOGIC
ZZ
R
(2)
7144 drw 01
JANUARY 2009
DSC 7144/2
1
©2009 Integrated Device Technology, Inc.

70P3599S166DRG相似产品对比

70P3599S166DRG 70P3519S166DRG
描述 Dual-Port SRAM, 128KX36, 12ns, PQFP208, 28 X 28 MM, 4.10 MM HEIGHT, PQFP-208 Dual-Port SRAM, 256KX36, 12ns, PQFP208, 28 X 28 MM, 4.10 MM HEIGHT, PQFP-208
是否无铅 不含铅 不含铅
是否Rohs认证 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 QFP QFP
包装说明 FQFP, FQFP,
针数 208 208
Reach Compliance Code compliant compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A
最长访问时间 12 ns 12 ns
其他特性 FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 代码 S-PQFP-G208 S-PQFP-G208
JESD-609代码 e3 e3
长度 28 mm 28 mm
内存密度 4718592 bit 9437184 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 36 36
湿度敏感等级 3 3
功能数量 1 1
端子数量 208 208
字数 131072 words 262144 words
字数代码 128000 256000
工作模式 SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C
组织 128KX36 256KX36
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 FQFP FQFP
封装形状 SQUARE SQUARE
封装形式 FLATPACK, FINE PITCH FLATPACK, FINE PITCH
并行/串行 PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260
认证状态 Not Qualified Not Qualified
座面最大高度 4.1 mm 4.1 mm
最大供电电压 (Vsup) 1.9 V 1.9 V
最小供电电压 (Vsup) 1.7 V 1.7 V
标称供电电压 (Vsup) 1.8 V 1.8 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL
端子面层 Matte Tin (Sn) Matte Tin (Sn)
端子形式 GULL WING GULL WING
端子节距 0.5 mm 0.5 mm
端子位置 QUAD QUAD
处于峰值回流温度下的最长时间 30 30
宽度 28 mm 28 mm

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2429  2876  2433  2686  1685  49  58  55  34  48 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved