Low Skew Clock Driver, FCT Series, 5 True Output(s), 0 Inverted Output(s), CMOS, CDIP20, CERDIP-20
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 20 |
| Reach Compliance Code | compliant |
| 系列 | FCT |
| 输入调节 | STANDARD |
| JESD-30 代码 | R-GDIP-T20 |
| JESD-609代码 | e0 |
| 长度 | 25.3365 mm |
| 逻辑集成电路类型 | LOW SKEW CLOCK DRIVER |
| 功能数量 | 2 |
| 反相输出次数 | |
| 端子数量 | 20 |
| 实输出次数 | 5 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 传播延迟（tpd） | 4.5 ns |
| 认证状态 | Not Qualified |
| Same Edge Skew-Max（tskwd） | 0.5 ns |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| IDT49FCT805CTDI | IDT49FCT805CTLI | IDT49FCT805BTDI | IDT49FCT805BTEI | IDT49FCT805BTLI | IDT49FCT805CTEI | |
|---|---|---|---|---|---|---|
| 描述 | Low Skew Clock Driver, FCT Series, 5 True Output(s), 0 Inverted Output(s), CMOS, CDIP20, CERDIP-20 | Low Skew Clock Driver, FCT Series, 5 True Output(s), 0 Inverted Output(s), CMOS, CQCC20, LCC-20 | Low Skew Clock Driver, FCT Series, 5 True Output(s), 0 Inverted Output(s), CMOS, CDIP20, CERDIP-20 | Low Skew Clock Driver, FCT Series, 5 True Output(s), 0 Inverted Output(s), CMOS, CDFP20, CERPACK-20 | Low Skew Clock Driver, FCT Series, 5 True Output(s), 0 Inverted Output(s), CMOS, CQCC20, LCC-20 | Low Skew Clock Driver, FCT Series, 5 True Output(s), 0 Inverted Output(s), CMOS, CDFP20, CERPACK-20 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | DIP | QLCC | DIP | DFP | QLCC | DFP |
| 包装说明 | DIP, | QCCN, | DIP, | CERPACK-20 | QCCN, | CERPACK-20 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compli |
| 系列 | FCT | FCT | FCT | FCT | FCT | FCT |
| 输入调节 | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD |
| JESD-30 代码 | R-GDIP-T20 | S-CQCC-N20 | R-GDIP-T20 | R-GDFP-F20 | S-CQCC-N20 | R-GDFP-F20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 实输出次数 | 5 | 5 | 5 | 5 | 5 | 5 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | QCCN | DIP | DFP | QCCN | DFP |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK | CHIP CARRIER | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 225 | NOT SPECIFIED | 225 | 225 | 225 |
| 传播延迟（tpd） | 4.5 ns | 4.5 ns | 5 ns | 5 ns | 5 ns | 4.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Same Edge Skew-Max（tskwd） | 0.5 ns | 0.5 ns | 0.7 ns | 0.7 ns | 0.7 ns | 0.5 ns |
| 座面最大高度 | 5.08 mm | 2.54 mm | 5.08 mm | 2.3368 mm | 2.54 mm | 2.3368 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT | NO LEAD | FLAT |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | NOT SPECIFIED | 30 | 30 | 30 |
| 宽度 | 7.62 mm | 8.89 mm | 7.62 mm | 6.9215 mm | 8.89 mm | 6.9215 mm |
| 长度 | 25.3365 mm | 8.89 mm | 25.3365 mm | - | 8.89 mm | - |
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