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72291L20TF

产品描述TQFP-64, Tray
产品类别存储    存储   
文件大小549KB,共27页
制造商IDT (Integrated Device Technology)
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72291L20TF概述

TQFP-64, Tray

72291L20TF规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码TQFP
包装说明STQFP-64
针数64
制造商包装代码PP64
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间12 ns
其他特性RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH
最大时钟频率 (fCLK)50 MHz
周期时间20 ns
JESD-30 代码S-PQFP-G64
JESD-609代码e0
长度10 mm
内存密度1179648 bit
内存集成电路类型OTHER FIFO
内存宽度9
湿度敏感等级3
功能数量1
端子数量64
字数131072 words
字数代码128000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织128KX9
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装等效代码QFP64,.47SQ,20
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)240
电源5 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.02 A
最大压摆率0.08 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间20
宽度10 mm

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CMOS SuperSync FIFO™
65,536 x 9
131,072 x 9
FEATURES:
IDT72281
IDT72291
OBSOLETE PARTS
Choose among the following memory organizations:
IDT72281
65,536 x 9
IDT72291
131,072 x 9
Pin-compatible with the IDT72261LA/72271LA SuperSync FIFOs
10ns read/write cycle time (6.5ns access time)
Fixed, low first word data latency time
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable
settings
Retransmit operation with fixed, low first word data
latency time
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag
can default to one of two preselected offsets
Program partial flags by either serial or parallel means
Select IDT Standard timing (using
EF
and
FF
flags) or First
Word Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
Independent Read and Write clocks (permit reading and writing
simultaneously)
Available in the 64-pin Thin Quad Flat Pack (TQFP) and the 64-
pin Slim Thin Quad Flat Pack (STQFP)
High-performance submicron CMOS technology
Industrial temperature range (-40°C to +85°C) is available
FUNCTIONAL BLOCK DIAGRAM
WEN
WCLK
S OR
T F
R
A D
P E
E ND S
T E
E
N
L M IG
O M S
S O
E
B C
D
O E
R EW
T N
O
N
D
0
-D
8
LD SEN
INPUT REGISTER
OFFSET REGISTER
WRITE CONTROL
LOGIC
FLAG
LOGIC
WRITE POINTER
RAM ARRAY
65,536 x 9
131,072 x 9
The IDT72281/72291 are exceptionally deep, high speed, CMOS First-In-
First-Out (FIFO) memories with clocked read and write controls. These FIFOs
offer numerous improvements over previous SuperSync FIFOs, including the
following:
The limitation of the frequency of one clock input with respect to the other has
been removed. The Frequency Select pin (FS) has been removed, thus
it is no longer necessary to select which of the two clock inputs, RCLK or
WCLK, is running at the higher frequency.
The period required by the retransmit operation is now fixed and short.
The first word data latency period, from the time the first word is written to an
empty FIFO to the time it can be read, is now fixed and short. (The variable
clock cycle counting delay associated with the latency period found on
previous SuperSync devices has been eliminated on this SuperSync family.)
SuperSync FIFOs are particularly appropriate for network, video, telecom-
munications, data communications and other applications that need to buffer
large amounts of data.
DESCRIPTION:
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
READ POINTER
READ
CONTROL
LOGIC
OUTPUT REGISTER
MRS
PRS
RT
RESET
LOGIC
RCLK
REN
OE
Q
0
-Q
8
4675 drw01
IDT, IDT logo are registered trademarks of Integrated Device Technology, Inc. The SuperSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
MARCH 2013
DSC-4675/5

 
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