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SKIIP703GD121-3DUL

产品描述Half Bridge Based Peripheral Driver, 3000A
产品类别模拟混合信号IC    驱动程序和接口   
文件大小190KB,共1页
制造商SEMIKRON
官网地址http://www.semikron.com
下载文档 详细参数 选型对比 全文预览

SKIIP703GD121-3DUL概述

Half Bridge Based Peripheral Driver, 3000A

SKIIP703GD121-3DUL规格参数

参数名称属性值
厂商名称SEMIKRON
包装说明,
Reach Compliance Codecompliant
ECCN代码EAR99
内置保护TRANSIENT
接口集成电路类型HALF BRIDGE BASED PERIPHERAL DRIVER
JESD-30 代码R-XXMA-X
功能数量3
输出电流流向SOURCE AND SINK
标称输出峰值电流3000 A
封装主体材料UNSPECIFIED
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
认证状态Not Qualified
表面贴装NO
端子形式UNSPECIFIED
端子位置UNSPECIFIED

SKIIP703GD121-3DUL文档预览

SKiiP 703GD121-3DUW
I. Power section 1 * SKiiP703GB121CT per phase
Absolute maximum ratings
Symbol
Conditions
1)
Values
1200
900
±
20
700 / 525
1400
525 / 393,75
900
4320
93
-40...+150 (125)
3000
1 * 500
Units
V
V
V
A
A
A
A
A
kA
2
s
°C
V
A
IGBT and inverse diode
V
CES
V
CC
Operating DC link voltage
V
GES
I
C
IGBT, T
heat sink
= 25 / 70 °C
I
CM
IGBT, t
p
< 1 ms,T
heat sink
= 25°C
I
F
Diode, T
heat sink
= 25 / 70 °C
I
FM
Diode, t
p
< 1 ms
I
FSM
Diode, T
j
= 150 °C, 10ms; sin
2
I t (Diode) Diode, T
j
= 150 °C, 10ms
T
j
, (T
stg
)
V
isol
AC, 1min.
4)
I
C-package
T
heat sink
= 70°C, T
term
= 115 °C
SKiiPPACK
SK integrated intelligent
Power PACK
rd
3 Generation
6-pack
3)
SKiiP 703GD121-3DUW
Target data
housing S33
Characteristics
Symbol
IGBT
V
(BR)CES
Conditions
1)
min.
≥V
CES
typ.
1,2
36
0,9
2,71
2,3
172
279
1
10
0,40
1,8
18
1,0
1,83
1 * 400
1 * 500
0,1
±
3000
max.
2
Units
V
mA
mA
V
mΩ
V
V
mJ
mJ
nF
nH
mΩ
V
V
mJ
V
mΩ
°C/W
°C/W
°C/W
°C/W
A
A
%
A
4)
5)
gate driver without supply
V
GE
= 0,
T
j
= 25 °C
I
CES
T
j
= 125 °C
V
CE
= V
CES
7)
V
CEO
T
j
= 125 °C
7)
r
T
T
j
= 125 °C
7)
V
CEsat
I
C
= 490A,
T
j
= 125 °C
7)
V
CEsat
I
C
= 490A,
T
j
= 25 °C
I =490A,
V
CC
=600V
E
on
+ E
off5) C
V
CC
=900V
T
j
= 125 °C
C
per SKiiP, AC side
L
CE
top, bottom
R
CC´-EE´
resistance, terminal-chip
Inverse diode
2)
V
F
= V
EC
I
F
= 450A;
T
j
= 125 °C
V
F
= V
EC
I
F
= 450A;
T
j
= 25 °C
5)
E
on
+ E
off
I
F
= 450A;
T
j
= 125 °C
V
TO
T
j
= 125 °C
r
T
T
j
= 125 °C
Thermal characteristics
R
thjs
per IGBT
R
thjs
per diode
3)
R
thsa
L: P16 heat sink; 280 m
3
/ h
W: WK 40; 8l/min; 50% glycol
Current sensor
I
p RMS
T
a
=100° C , V
supply
=
±
15V
I
pmax RMS
t
2s
V
supply
≥ ±14,25V,
0≤I≤
±
700A,
Linearity
per sensor
I
ppeak
t
10 µs, per sensor
Mechanical data
M1
DC terminals, SI Units
M2
AC terminals, SI Units
M3
to heat sink
6)
2,5
0,047
0,092
0,033
0,010
Features
SKiiP technology inside
-
pressure contact of ceramic
to heat sink; low thermal
impedance
-
pressure contact of main
electric terminals
-
pressure contact of auxiliary
electric terminals
-
increased thermal cycling
capability
-
low stray inductance
-
homogenous current
distribution
integrated current sensor
integrated temperature sensor
high power density
1)
2)
3)
4
8
3
6)
6
10
Nm
Nm
Nm
7)
8)
T
heatsink
= 25 °C, unless
otherwise specified
CAL = Controlled Axial Lifetime
Technology (soft and fast)
D integrated gate driver
U with DC-bus voltage
measurement (option for GB)
L mounted on standard P16 for
forced air cooling
W mounted on standard water
cooler
T
term
= temperature of terminal
with SKiiPPACK 3
rd
generation
gate driver
assembly instruction must be
followed
measured at chip level
external paralleling necessary
This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee,
expressed or implied is made regarding delivery, performance or suitability.
by
SEMIKRON
000911
B 7
11

SKIIP703GD121-3DUL相似产品对比

SKIIP703GD121-3DUL SKIIP703GD121-3DL SKIIP703GD121-3DLW SKIIP703GD121-3DU SKIIP703GD121-3DUW SKIIP703GD121-3DUWL SKIIP703GD121-3DW
描述 Half Bridge Based Peripheral Driver, 3000A Half Bridge Based Peripheral Driver, 3000A Half Bridge Based Peripheral Driver, 3000A Half Bridge Based Peripheral Driver, 3000A Half Bridge Based Peripheral Driver, 3000A Half Bridge Based Peripheral Driver, 3000A Half Bridge Based Peripheral Driver, 3000A
厂商名称 SEMIKRON SEMIKRON SEMIKRON SEMIKRON SEMIKRON SEMIKRON SEMIKRON
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
内置保护 TRANSIENT TRANSIENT TRANSIENT TRANSIENT TRANSIENT TRANSIENT TRANSIENT
接口集成电路类型 HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER
JESD-30 代码 R-XXMA-X R-XXMA-X R-XXMA-X R-XXMA-X R-XXMA-X R-XXMA-X R-XXMA-X
功能数量 3 3 3 3 3 3 3
输出电流流向 SOURCE AND SINK SOURCE AND SINK SOURCE AND SINK SOURCE AND SINK SOURCE AND SINK SOURCE AND SINK SOURCE AND SINK
标称输出峰值电流 3000 A 3000 A 3000 A 3000 A 3000 A 3000 A 3000 A
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 NO NO NO NO NO NO NO
端子形式 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
端子位置 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
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