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SKIIP613GD121-3DW

产品描述Half Bridge Based Peripheral Driver, 3000A
产品类别模拟混合信号IC    驱动程序和接口   
文件大小200KB,共1页
制造商SEMIKRON
官网地址http://www.semikron.com
标准  
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SKIIP613GD121-3DW概述

Half Bridge Based Peripheral Driver, 3000A

SKIIP613GD121-3DW规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称SEMIKRON
包装说明,
Reach Compliance Codecompliant
ECCN代码EAR99
接口集成电路类型HALF BRIDGE BASED PERIPHERAL DRIVER
JESD-30 代码R-XXMA-X
JESD-609代码e3/e4
功能数量3
输出电流流向SOURCE AND SINK
标称输出峰值电流3000 A
封装主体材料UNSPECIFIED
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
表面贴装NO
端子面层TIN/SILVER
端子形式UNSPECIFIED
端子位置UNSPECIFIED
处于峰值回流温度下的最长时间NOT SPECIFIED

SKIIP613GD121-3DW相似产品对比

SKIIP613GD121-3DW SKIIP613GD121-3DL SKIIP613GD121-3DLW SKIIP613GD121-3DU SKIIP613GD121-3DUL SKIIP613GD121-3DULW SKIIP613GD121-3DUW
描述 Half Bridge Based Peripheral Driver, 3000A Half Bridge Based Peripheral Driver, 3000A Half Bridge Based Peripheral Driver, 3000A Half Bridge Based Peripheral Driver, 3000A Half Bridge Based Peripheral Driver, 3000A Half Bridge Based Peripheral Driver, 3000A Half Bridge Based Peripheral Driver, 3000A
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合
厂商名称 SEMIKRON SEMIKRON SEMIKRON SEMIKRON SEMIKRON SEMIKRON SEMIKRON
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
接口集成电路类型 HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER
JESD-30 代码 R-XXMA-X R-XXMA-X R-XXMA-X R-XXMA-X R-XXMA-X R-XXMA-X R-XXMA-X
JESD-609代码 e3/e4 e3/e4 e3/e4 e3/e4 e2 e3/e4 e3/e4
功能数量 3 3 3 3 3 3 3
输出电流流向 SOURCE AND SINK SOURCE AND SINK SOURCE AND SINK SOURCE AND SINK SOURCE AND SINK SOURCE AND SINK SOURCE AND SINK
标称输出峰值电流 3000 A 3000 A 3000 A 3000 A 3000 A 3000 A 3000 A
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 NO NO NO NO NO NO NO
端子面层 TIN/SILVER TIN/SILVER TIN/SILVER TIN/SILVER Tin/Silver (Sn/Ag) TIN/SILVER TIN/SILVER
端子形式 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
端子位置 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED

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