Half Bridge Based Peripheral Driver, 3000A
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | SEMIKRON |
包装说明 | , |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
接口集成电路类型 | HALF BRIDGE BASED PERIPHERAL DRIVER |
JESD-30 代码 | R-XXMA-X |
JESD-609代码 | e3/e4 |
功能数量 | 3 |
输出电流流向 | SOURCE AND SINK |
标称输出峰值电流 | 3000 A |
封装主体材料 | UNSPECIFIED |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
表面贴装 | NO |
端子面层 | TIN/SILVER |
端子形式 | UNSPECIFIED |
端子位置 | UNSPECIFIED |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
SKIIP613GD121-3DW | SKIIP613GD121-3DL | SKIIP613GD121-3DLW | SKIIP613GD121-3DU | SKIIP613GD121-3DUL | SKIIP613GD121-3DULW | SKIIP613GD121-3DUW | |
---|---|---|---|---|---|---|---|
描述 | Half Bridge Based Peripheral Driver, 3000A | Half Bridge Based Peripheral Driver, 3000A | Half Bridge Based Peripheral Driver, 3000A | Half Bridge Based Peripheral Driver, 3000A | Half Bridge Based Peripheral Driver, 3000A | Half Bridge Based Peripheral Driver, 3000A | Half Bridge Based Peripheral Driver, 3000A |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | SEMIKRON | SEMIKRON | SEMIKRON | SEMIKRON | SEMIKRON | SEMIKRON | SEMIKRON |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
接口集成电路类型 | HALF BRIDGE BASED PERIPHERAL DRIVER | HALF BRIDGE BASED PERIPHERAL DRIVER | HALF BRIDGE BASED PERIPHERAL DRIVER | HALF BRIDGE BASED PERIPHERAL DRIVER | HALF BRIDGE BASED PERIPHERAL DRIVER | HALF BRIDGE BASED PERIPHERAL DRIVER | HALF BRIDGE BASED PERIPHERAL DRIVER |
JESD-30 代码 | R-XXMA-X | R-XXMA-X | R-XXMA-X | R-XXMA-X | R-XXMA-X | R-XXMA-X | R-XXMA-X |
JESD-609代码 | e3/e4 | e3/e4 | e3/e4 | e3/e4 | e2 | e3/e4 | e3/e4 |
功能数量 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
输出电流流向 | SOURCE AND SINK | SOURCE AND SINK | SOURCE AND SINK | SOURCE AND SINK | SOURCE AND SINK | SOURCE AND SINK | SOURCE AND SINK |
标称输出峰值电流 | 3000 A | 3000 A | 3000 A | 3000 A | 3000 A | 3000 A | 3000 A |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | NO | NO | NO | NO | NO | NO |
端子面层 | TIN/SILVER | TIN/SILVER | TIN/SILVER | TIN/SILVER | Tin/Silver (Sn/Ag) | TIN/SILVER | TIN/SILVER |
端子形式 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
端子位置 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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