Clock Generator, 700MHz, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LQFP-32
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | QFP |
包装说明 | 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LQFP-32 |
针数 | 32 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
JESD-30 代码 | S-PQFP-G32 |
JESD-609代码 | e0 |
长度 | 7 mm |
湿度敏感等级 | 3 |
端子数量 | 32 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
最大输出时钟频率 | 700 MHz |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LQFP |
封装等效代码 | QFP32,.35SQ,32 |
封装形状 | SQUARE |
封装形式 | FLATPACK, LOW PROFILE |
峰值回流温度(摄氏度) | 240 |
电源 | 3.3 V |
主时钟/晶体标称频率 | 25 MHz |
认证状态 | Not Qualified |
座面最大高度 | 1.6 mm |
最大压摆率 | 145 mA |
最大供电电压 | 3.465 V |
最小供电电压 | 3.135 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 20 |
宽度 | 7 mm |
uPs/uCs/外围集成电路类型 | CLOCK GENERATOR, OTHER |
8432BYI-51 | 8432BKI-51LF | 8432BKI-51LFT | 8432BYI-51LF | 8432BYI-51LFT | 8432BYI-51T | 8432BKI-51 | 8432BKI-51T | |
---|---|---|---|---|---|---|---|---|
描述 | Clock Generator, 700MHz, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LQFP-32 | Clock Generator, 700MHz, 5 X 5 MM, 0.95 MM HEIHT, ROHS COMPLIANT, MO-220, VFQFN-32 | Clock Generator, 700MHz, 5 X 5 MM, 0.95 MM HEIHT, ROHS COMPLIANT, MO-220, VFQFN-32 | Clock Generator, 700MHz, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MS-026, LQFP-32 | Clock Generator, 700MHz, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MS-026, LQFP-32 | Clock Generator, 700MHz, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LQFP-32 | Clock Generator, 700MHz, 5 X 5 MM, 0.95 MM HEIHT, MO-220, VFQFN-32 | Clock Generator, 700MHz, 5 X 5 MM, 0.95 MM HEIHT, MO-220, VFQFN-32 |
是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | QFP | QFN | QFN | QFP | QFP | QFP | QFN | QFN |
包装说明 | 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LQFP-32 | 5 X 5 MM, 0.95 MM HEIHT, ROHS COMPLIANT, MO-220, VFQFN-32 | 5 X 5 MM, 0.95 MM HEIHT, ROHS COMPLIANT, MO-220, VFQFN-32 | 7 X 7 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MS-026, LQFP-32 | 7 X 7 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MS-026, LQFP-32 | 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LQFP-32 | 5 X 5 MM, 0.95 MM HEIHT, MO-220, VFQFN-32 | 5 X 5 MM, 0.95 MM HEIHT, MO-220, VFQFN-32 |
针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | not_compliant | compliant | compliant | compliant | compliant | not_compliant | not_compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
JESD-30 代码 | S-PQFP-G32 | S-XQCC-N32 | S-XQCC-N32 | S-PQFP-G32 | S-PQFP-G32 | S-PQFP-G32 | S-XQCC-N32 | S-XQCC-N32 |
JESD-609代码 | e0 | e3 | e3 | e3 | e3 | e0 | e0 | e0 |
长度 | 7 mm | 5 mm | 5 mm | 7 mm | 7 mm | 7 mm | 5 mm | 5 mm |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
最大输出时钟频率 | 700 MHz | 700 MHz | 700 MHz | 700 MHz | 700 MHz | 700 MHz | 700 MHz | 700 MHz |
封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
封装代码 | LQFP | HVQCCN | HVQCCN | LQFP | LQFP | LQFP | HVQCCN | HVQCCN |
封装等效代码 | QFP32,.35SQ,32 | LCC32,.2SQ,20 | LCC32,.2SQ,20 | QFP32,.35SQ,32 | QFP32,.35SQ,32 | QFP32,.35SQ,32 | LCC32,.2SQ,20 | LCC32,.2SQ,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, LOW PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 240 | 260 | 260 | 260 | 260 | 240 | 225 | 225 |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
主时钟/晶体标称频率 | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.6 mm | 1 mm | 1 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1 mm | 1 mm |
最大压摆率 | 145 mA | 145 mA | 145 mA | 145 mA | 145 mA | 145 mA | 145 mA | 145 mA |
最大供电电压 | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
最小供电电压 | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | MATTE TIN | MATTE TIN | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING | NO LEAD | NO LEAD | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD |
端子节距 | 0.8 mm | 0.5 mm | 0.5 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 20 | NOT SPECIFIED | 30 | 30 | 30 | 20 | 30 | 30 |
宽度 | 7 mm | 5 mm | 5 mm | 7 mm | 7 mm | 7 mm | 5 mm | 5 mm |
uPs/uCs/外围集成电路类型 | CLOCK GENERATOR, OTHER | CLOCK GENERATOR, OTHER | CLOCK GENERATOR, OTHER | CLOCK GENERATOR, OTHER | CLOCK GENERATOR, OTHER | CLOCK GENERATOR, OTHER | CLOCK GENERATOR, OTHER | CLOCK GENERATOR, OTHER |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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