64A, 60V, 0.016ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | SMALL OUTLINE, R-PSSO-G2 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
雪崩能效等级(Eas) | 500 mJ |
外壳连接 | DRAIN |
配置 | SINGLE WITH BUILT-IN DIODE |
最小漏源击穿电压 | 60 V |
最大漏极电流 (ID) | 64 A |
最大漏源导通电阻 | 0.016 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95代码 | TO-263AB |
JESD-30 代码 | R-PSSO-G2 |
元件数量 | 1 |
端子数量 | 2 |
工作模式 | ENHANCEMENT MODE |
最高工作温度 | 175 °C |
封装主体材料 | PLASTIC/EPOXY |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
极性/信道类型 | N-CHANNEL |
功耗环境最大值 | 130 W |
最大脉冲漏极电流 (IDM) | 190 A |
认证状态 | Not Qualified |
表面贴装 | YES |
端子形式 | GULL WING |
端子位置 | SINGLE |
晶体管应用 | SWITCHING |
晶体管元件材料 | SILICON |
最大关闭时间(toff) | 230 ns |
最大开启时间(吨) | 230 ns |
NDB7061/S62Z | NDB7061/L99Z | NDB7061 | NDB7061/L86Z | NDP7061/J69Z | |
---|---|---|---|---|---|
描述 | 64A, 60V, 0.016ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB | 64A, 60V, 0.016ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB | 64A, 60V, 0.016ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB | 64A, 60V, 0.016ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB | 64A, 60V, 0.016ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220, TO-220, 3 PIN |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
包装说明 | SMALL OUTLINE, R-PSSO-G2 | SMALL OUTLINE, R-PSSO-G2 | SMALL OUTLINE, R-PSSO-G2 | SMALL OUTLINE, R-PSSO-G2 | FLANGE MOUNT, R-PSFM-T3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
雪崩能效等级(Eas) | 500 mJ | 500 mJ | 500 mJ | 500 mJ | 500 mJ |
配置 | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
最小漏源击穿电压 | 60 V | 60 V | 60 V | 60 V | 60 V |
最大漏极电流 (ID) | 64 A | 64 A | 64 A | 64 A | 64 A |
最大漏源导通电阻 | 0.016 Ω | 0.016 Ω | 0.016 Ω | 0.016 Ω | 0.016 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95代码 | TO-263AB | TO-263AB | TO-263AB | TO-263AB | TO-220AB |
JESD-30 代码 | R-PSSO-G2 | R-PSSO-G2 | R-PSSO-G2 | R-PSSO-G2 | R-PSFM-T3 |
元件数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 2 | 2 | 2 | 2 | 3 |
工作模式 | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
最高工作温度 | 175 °C | 175 °C | 175 °C | 175 °C | 175 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | FLANGE MOUNT |
极性/信道类型 | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL |
功耗环境最大值 | 130 W | 130 W | 130 W | 130 W | 130 W |
最大脉冲漏极电流 (IDM) | 190 A | 190 A | 190 A | 190 A | 190 A |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | YES | NO |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
晶体管应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
晶体管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON |
最大关闭时间(toff) | 230 ns | 230 ns | 230 ns | 230 ns | 230 ns |
最大开启时间(吨) | 230 ns | 230 ns | 230 ns | 230 ns | 230 ns |
外壳连接 | DRAIN | DRAIN | DRAIN | DRAIN | - |
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