Sample and Hold Circuit, 1 Func, Sample, 0.5us Acquisition Time, BIPolar, CQCC20, LCC-20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | AMD(超微) |
零件包装代码 | QLCC |
包装说明 | QCCN, LCC20,.35SQ |
针数 | 20 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
标称采集时间 | 0.5 µs |
放大器类型 | SAMPLE AND HOLD CIRCUIT |
最大下降率 | 20 V/s |
JESD-30 代码 | S-CQCC-N20 |
JESD-609代码 | e0 |
长度 | 8.89 mm |
负供电电压上限 | -16.5 V |
标称负供电电压 (Vsup) | -15 V |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN |
封装等效代码 | LCC20,.35SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
采样并保持/跟踪并保持 | SAMPLE |
筛选级别 | MIL-STD-883 Class B (Modified) |
座面最大高度 | 2.54 mm |
供电电压上限 | 16.5 V |
标称供电电压 (Vsup) | 15 V |
表面贴装 | YES |
技术 | BIPOLAR |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 8.89 mm |
AM6420LMB | AM6420LCB | AM6420LC | AM6420LM | AM6420XC | AM6420XCB | AM6420DC | AM6420DCB | AM6420DM | AM6420DMB | |
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描述 | Sample and Hold Circuit, 1 Func, Sample, 0.5us Acquisition Time, BIPolar, CQCC20, LCC-20 | Sample and Hold Circuit, 1 Func, Sample, 0.5us Acquisition Time, BIPolar, CQCC20, LCC-20 | Sample and Hold Circuit, 1 Func, Sample, 0.5us Acquisition Time, BIPolar, CQCC20, LCC-20 | Sample and Hold Circuit, 1 Func, Sample, 0.5us Acquisition Time, BIPolar, CQCC20, LCC-20 | Sample and Hold Circuit, 1 Func, Sample, 0.5us Acquisition Time, DIE | Sample and Hold Circuit, 1 Func, Sample, 0.5us Acquisition Time, DIE | Sample and Hold Circuit, 1 Func, Sample, 0.5us Acquisition Time, BIPolar, CDIP14, HERMETIC SEALED, DIP-14 | Sample and Hold Circuit, 1 Func, Sample, 0.5us Acquisition Time, BIPolar, CDIP14, HERMETIC SEALED, DIP-14 | Sample and Hold Circuit, 1 Func, Sample, 0.5us Acquisition Time, BIPolar, CDIP14, HERMETIC SEALED, DIP-14 | Sample and Hold Circuit, 1 Func, Sample, 0.5us Acquisition Time, BIPolar, CDIP14, HERMETIC SEALED, DIP-14 |
厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
零件包装代码 | QLCC | QLCC | QLCC | QLCC | DIE | DIE | DIP | DIP | DIP | DIP |
包装说明 | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ | DIE, | DIE, | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
针数 | 20 | 20 | 20 | 20 | 20 | 20 | 14 | 14 | 14 | 14 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | - | 不符合 | 不符合 | 不符合 | 不符合 |
标称采集时间 | 0.5 µs | 0.5 µs | 0.5 µs | 0.5 µs | 0.5 µs | 0.5 µs | - | 0.5 µs | 0.5 µs | - |
放大器类型 | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | - | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | - |
最大下降率 | 20 V/s | 20 V/s | 20 V/s | 20 V/s | 20 V/s | 20 V/s | - | 20 V/s | 20 V/s | - |
JESD-30 代码 | S-CQCC-N20 | S-CQCC-N20 | S-CQCC-N20 | S-CQCC-N20 | R-XUUC-N20 | R-XUUC-N20 | - | R-CDIP-T14 | R-CDIP-T14 | - |
JESD-609代码 | e0 | e0 | e0 | e0 | - | - | - | e0 | e0 | - |
长度 | 8.89 mm | 8.89 mm | 8.89 mm | 8.89 mm | - | - | - | 19.431 mm | 19.431 mm | - |
负供电电压上限 | -16.5 V | -16.5 V | -16.5 V | -16.5 V | -16.5 V | -16.5 V | - | -16.5 V | -16.5 V | - |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | - | -15 V | -15 V | - |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 | - |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | - | 14 | 14 | - |
最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C | - | 70 °C | 125 °C | - |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | UNSPECIFIED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - |
封装代码 | QCCN | QCCN | QCCN | QCCN | DIE | DIE | - | DIP | DIP | - |
封装等效代码 | LCC20,.35SQ | LCC20,.35SQ | LCC20,.35SQ | LCC20,.35SQ | - | - | - | DIP14,.3 | DIP14,.3 | - |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | UNCASED CHIP | UNCASED CHIP | - | IN-LINE | IN-LINE | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - |
采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | - | SAMPLE | SAMPLE | - |
座面最大高度 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | - | - | 5.08 mm | 5.08 mm | - |
供电电压上限 | 16.5 V | 16.5 V | 16.5 V | 16.5 V | 16.5 V | 16.5 V | - | 16.5 V | 16.5 V | - |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | - | 15 V | 15 V | - |
表面贴装 | YES | YES | YES | YES | YES | YES | - | NO | NO | - |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | - | - | - | BIPOLAR | BIPOLAR | - |
温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | MILITARY | - |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - | THROUGH-HOLE | THROUGH-HOLE | - |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | - | - | 2.54 mm | 2.54 mm | - |
端子位置 | QUAD | QUAD | QUAD | QUAD | UPPER | UPPER | - | DUAL | DUAL | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED | - |
宽度 | 8.89 mm | 8.89 mm | 8.89 mm | 8.89 mm | - | - | - | 7.62 mm | 7.62 mm | - |
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