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IDT72V51556L6BBG

产品描述FIFO, 64KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
产品类别存储    存储   
文件大小556KB,共58页
制造商IDT (Integrated Device Technology)
标准  
下载文档 详细参数 选型对比 全文预览

IDT72V51556L6BBG概述

FIFO, 64KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256

IDT72V51556L6BBG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明BGA,
针数256
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间3.7 ns
其他特性ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT
周期时间6 ns
JESD-30 代码S-PBGA-B256
JESD-609代码e1
长度17 mm
内存密度2359296 bit
内存宽度36
湿度敏感等级3
功能数量1
端子数量256
字数65536 words
字数代码64000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织64KX36
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度3.5 mm
最大供电电压 (Vsup)3.45 V
最小供电电压 (Vsup)3.15 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度17 mm

文档预览

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3.3V MULTI-QUEUE FLOW-CONTROL DEVICES
(32 QUEUES) 36 BIT WIDE CONFIGURATION
1,179,648 bits
2,359,296 bits
IDT72V51546
IDT72V51556
FEATURES:
Choose from among the following memory density options:
IDT72V51546
Total Available Memory = 1,179,648 bits
IDT72V51556
Total Available Memory = 2,359,296 bits
Configurable from 1 to 32 Queues
Queues may be configured at master reset from the pool of
Total Available Memory in blocks of 256 x 36
Independent Read and Write access per queue
User programmable via serial port
Default multi-queue device configurations
– IDT72V51546 : 1,024 x 36 x 32Q
– IDT72V51556 : 2,048 x 36 x 32Q
100% Bus Utilization, Read and Write on every clock cycle
166 MHz High speed operation (6ns cycle time)
3.7ns access time
Individual, Active queue flags (OV,
FF, PAE, PAF, PR)
8 bit parallel flag status on both read and write ports
Shows
PAE
and
PAF
status of 8 Queues
Direct or polled operation of flag status bus
Global Bus Matching - (All Queues have same Input Bus Width
and Output Bus Width)
User Selectable Bus Matching Options:
– x36in to x36out
– x18in to x36out
– x9in to x36out
– x36in to x18out
– x36in to x9out
FWFT mode of operation on read port
Packet mode operation
Partial Reset, clears data in single Queue
Expansion of up to 8 multi-queue devices in parallel is available
JTAG Functionality (Boundary Scan)
Available in a 256-pin PBGA, 1mm pitch, 17mm x 17mm
HIGH Performance submicron CMOS technology
Industrial temperature range (-40°C to +85°C) is available
FUNCTIONAL BLOCK DIAGRAM
MULTI-QUEUE FLOW-CONTROL DEVICE
Q
0
FSTR
WRADD
WEN
WCLK
8
READ CONTROL
WADEN
RADEN
ESTR
8
WRITE CONTROL
Q
1
RDADD
REN
RCLK
OE
Q
2
Din
Qout
x36
DATA
OUT
WRITE FLAGS
READ FLAGS
OV
PR
PAE
8
x36
DATA IN
FF
PAF
PAFn
8
Q
31
PAEn/PRn
5904 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2003
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
JUNE 2003
DSC-5904/9

IDT72V51556L6BBG相似产品对比

IDT72V51556L6BBG IDT72V51546L7-5BBGI BURNDY_YF1018ID IDT72V51546L7-5BBG IDT72V51556L7-5BBG IDT72V51556L7-5BBGI
描述 FIFO, 64KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 32KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 Elect Cu Single Insul Wire Ferrules, Smooth Funnel Entry, 10 AWG, 1.02" L, Tin Plated, Yellow, For use on Cu Cond. FIFO, 32KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
是否无铅 不含铅 不含铅 - 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 - 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 BGA BGA - BGA BGA BGA
包装说明 BGA, BGA, - BGA, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 BGA,
针数 256 256 - 256 256 256
Reach Compliance Code compliant compliant - compliant compliant compliant
ECCN代码 EAR99 EAR99 - EAR99 EAR99 EAR99
最长访问时间 3.7 ns 4 ns - 4 ns 4 ns 4 ns
其他特性 ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT - ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT
周期时间 6 ns 7.5 ns - 7.5 ns 7.5 ns 7.5 ns
JESD-30 代码 S-PBGA-B256 S-PBGA-B256 - S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
JESD-609代码 e1 e1 - e1 e1 e1
长度 17 mm 17 mm - 17 mm 17 mm 17 mm
内存密度 2359296 bit 1179648 bit - 1179648 bit 2359296 bit 2359296 bit
内存宽度 36 36 - 36 36 36
湿度敏感等级 3 3 - 3 3 3
功能数量 1 1 - 1 1 1
端子数量 256 256 - 256 256 256
字数 65536 words 32768 words - 32768 words 65536 words 65536 words
字数代码 64000 32000 - 32000 64000 64000
工作模式 SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 85 °C - 70 °C 70 °C 85 °C
组织 64KX36 32KX36 - 32KX36 64KX36 64KX36
可输出 YES YES - YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA - BGA BGA BGA
封装形状 SQUARE SQUARE - SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY - GRID ARRAY GRID ARRAY GRID ARRAY
并行/串行 PARALLEL PARALLEL - PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 - 260 260 260
认证状态 Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified
座面最大高度 3.5 mm 3.5 mm - 3.5 mm 3.5 mm 3.5 mm
最大供电电压 (Vsup) 3.45 V 3.45 V - 3.45 V 3.45 V 3.45 V
最小供电电压 (Vsup) 3.15 V 3.15 V - 3.15 V 3.15 V 3.15 V
标称供电电压 (Vsup) 3.3 V 3.3 V - 3.3 V 3.3 V 3.3 V
表面贴装 YES YES - YES YES YES
技术 CMOS CMOS - CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL - COMMERCIAL COMMERCIAL INDUSTRIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
端子形式 BALL BALL - BALL BALL BALL
端子节距 1 mm 1 mm - 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM - BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 30 - 30 30 30
宽度 17 mm 17 mm - 17 mm 17 mm 17 mm
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