Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Mosel Vitelic Corporation ( MVC ) |
零件包装代码 | DIP |
包装说明 | DIP, DIP28,.6 |
针数 | 28 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最长访问时间 | 70 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDIP-T28 |
JESD-609代码 | e0 |
长度 | 37.33 mm |
内存密度 | 262144 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 28 |
字数 | 32768 words |
字数代码 | 32000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 32KX8 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP28,.6 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 4.95 mm |
最大待机电流 | 0.00002 A |
最小待机电流 | 2 V |
最大压摆率 | 0.07 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 15.24 mm |
V62C518256LL-70PI | V62C518256L-70F | V62C518256L-35FI | V62C518256LL-70T | V62C518256LL-70TI | V62C518256L-35PI | V62C518256LL-70FI | V62C518256L-35P | |
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描述 | Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.330 INCH, SOP-28 | Standard SRAM, 32KX8, 35ns, CMOS, PDSO28, 0.330 INCH, SOP-28 | Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, TSOP-28 | Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, TSOP-28 | Standard SRAM, 32KX8, 35ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.330 INCH, SOP-28 | Standard SRAM, 32KX8, 35ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | DIP | SOIC | SOIC | TSOP | TSOP | DIP | SOIC | DIP |
包装说明 | DIP, DIP28,.6 | SOP, SOP28,.5 | SOP, SOP28,.5 | TSOP1, TSSOP28,.53,22 | TSOP1, TSSOP28,.53,22 | DIP, DIP28,.6 | SOP, SOP28,.5 | DIP, DIP28,.6 |
针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 70 ns | 70 ns | 35 ns | 70 ns | 70 ns | 35 ns | 70 ns | 35 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 | R-PDIP-T28 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 37.33 mm | 18.11 mm | 18.11 mm | 11.8 mm | 11.8 mm | 37.33 mm | 18.11 mm | 37.33 mm |
内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bi |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C |
最低工作温度 | -40 °C | - | -40 °C | - | -40 °C | -40 °C | -40 °C | - |
组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SOP | SOP | TSOP1 | TSOP1 | DIP | SOP | DIP |
封装等效代码 | DIP28,.6 | SOP28,.5 | SOP28,.5 | TSSOP28,.53,22 | TSSOP28,.53,22 | DIP28,.6 | SOP28,.5 | DIP28,.6 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | IN-LINE | SMALL OUTLINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.95 mm | 2.85 mm | 2.85 mm | 1.2 mm | 1.2 mm | 4.95 mm | 2.85 mm | 4.95 mm |
最大待机电流 | 0.00002 A | 0.00005 A | 0.00007 A | 0.000015 A | 0.00002 A | 0.00007 A | 0.00002 A | 0.00005 A |
最小待机电流 | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
最大压摆率 | 0.07 mA | 0.06 mA | 0.07 mA | 0.06 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.06 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | YES | YES | YES | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 0.55 mm | 0.55 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 15.24 mm | 8.61 mm | 8.61 mm | 8 mm | 8 mm | 15.24 mm | 8.61 mm | 15.24 mm |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - | - |
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