HCT SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT BIDIRECTIONAL DECADE COUNTER, CDIP16, CERAMIC, DIP-16
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | DIP, |
Reach Compliance Code | unknown |
其他特性 | TCO UP AND TCO DOWN OUTPUTS; SEPARATE UP/DOWN CLOCK |
计数方向 | BIDIRECTIONAL |
系列 | HCT |
JESD-30 代码 | R-GDIP-T16 |
长度 | 19.43 mm |
负载/预设输入 | YES |
逻辑集成电路类型 | DECADE COUNTER |
工作模式 | SYNCHRONOUS |
位数 | 4 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
传播延迟(tpd) | 65 ns |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
触发器类型 | POSITIVE EDGE |
宽度 | 7.62 mm |
最小 fmax | 35 MHz |
MM54HCT192J | MM74HCT192N | MM74HCT192J | |
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描述 | HCT SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT BIDIRECTIONAL DECADE COUNTER, CDIP16, CERAMIC, DIP-16 | HCT SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT BIDIRECTIONAL DECADE COUNTER, PDIP16, PLASTIC, DIP-16 | HCT SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT BIDIRECTIONAL DECADE COUNTER, CDIP16, CERAMIC, DIP-16 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
包装说明 | DIP, | DIP, DIP16,.3 | DIP, |
Reach Compliance Code | unknown | unknown | unknown |
其他特性 | TCO UP AND TCO DOWN OUTPUTS; SEPARATE UP/DOWN CLOCK | TCO UP AND TCO DOWN OUTPUTS; SEPARATE UP/DOWN CLOCK | TCO UP AND TCO DOWN OUTPUTS; SEPARATE UP/DOWN CLOCK |
计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
系列 | HCT | HCT | HCT |
JESD-30 代码 | R-GDIP-T16 | R-PDIP-T16 | R-GDIP-T16 |
长度 | 19.43 mm | 19.305 mm | 19.43 mm |
负载/预设输入 | YES | YES | YES |
逻辑集成电路类型 | DECADE COUNTER | DECADE COUNTER | DECADE COUNTER |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
位数 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 85 °C | 85 °C |
最低工作温度 | -55 °C | -40 °C | -40 °C |
封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
封装代码 | DIP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE |
传播延迟(tpd) | 65 ns | 54 ns | 54 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO |
技术 | CMOS | CMOS | CMOS |
温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm |
最小 fmax | 35 MHz | 16 MHz | 35 MHz |
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