电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

060320500220FCB

产品描述Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.000022uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT
产品类别无源元件    电容器   
文件大小197KB,共2页
制造商Syfer
标准  
下载文档 详细参数 全文预览

060320500220FCB概述

Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.000022uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT

060320500220FCB规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Syfer
包装说明, 0603
Reach Compliance Codecompliant
ECCN代码EAR99
电容0.000022 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
JESD-609代码e3
制造商序列号0603
安装特点SURFACE MOUNT
多层Yes
负容差1%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法BULK
正容差1%
额定(直流)电压(URdc)50 V
尺寸代码0603
表面贴装YES
温度特性代码C0G
温度系数-/+30ppm/Cel ppm/°C
端子面层Matte Tin (Sn)
端子形状WRAPAROUND

文档预览

下载PDF文档
MLCCs
for Non-
magnetic
applications
C0G/NP0, High Q and X7R
Copper Barrier MLCCs
Multilayer ceramic capacitors
with silver/palladium (Ag/Pd)
terminations have often been
used in medical applications
where non-magnetic
components are required, for
example in MRI equipment.
The use of conventional nickel
barrier terminations is not
suitable due to nickel exhibiting
magnetic properties.
However, RoHS requirements
have dictated the use of
lead-free solders, and the
composition of these solders
has resulted in an increase in
soldering temperatures. This
has caused solder leaching
problems for the Ag/Pd
termination, and meant
alternative terminations have
had to be found.
Specification
Capacitance Values
C0G/NP0 & High Q
0.1pF - 15nF
X7R
47pF - 6.8µF
See overleaf for full list of values
Mechanical
Termination Material
See ordering information below
Solderability
IEC 60068-2-58. Passed 3 times reflow
profile defined in J-STD-020
Printing
Consult sales office
Lead Free Soldering
Termination codes 2 and 3 ranges are
fully compliant with the RoHS and WEEE
directives and parts are compatible with lead
free solders.
Climatic Category
55/125/56
Reeled Quantities
See Capacitance tables overleaf
Electrical
C0G/NP0
-55°C to
+125°C
High Q
-55°C to
+125°C
X7R
-55°C to
+125°C
Operating Temperature
Temperature Coefficient
(Typical)
0 ± 30
ppm/°C
0 ± 30
ppm/°C
±15%
Insulation Resistance
Time constant (Ri xCr) (whichever is the least)
100GΩ or
1000s
Ageing Rate
None
None
Typical 1% per
time decade
100GΩ or
1000s
100GΩ or
1000s
Ordering Information
1210
Chip
size
0402
0603
0505
0805
1206
1111
1210
1808
1812
2220
2225
3
Termination
2
(for C0G/NP0
& High Q only)
= Sintered
silver base with
copper barrier
(100% matte tin
plating). RoHS
compliant.
100
Voltage
0103
Capacitance in
picofarads (pF)
J
Capacitance
tolerance
X
Dielectric
T
Packaging
___
Suffix
As copper is non-magnetic,
one solution is to use a copper
barrier instead of a nickel
barrier, with a tin finish on top,
and this is the solution Syfer
has developed.
This copper barrier termination
is offered with selected non-
magnetic C0G/NP0, High Q
and X7R dielectrics, providing a
fully non-magnetic component.
To meet high temperature
260ºC soldering reflow profiles
as detailed in J-STD-020, C0G/
NP0 dielectrics are supplied
with sintered termination and
X7R dielectrics are supplied
with Syfer’s award winning
FlexiCap™ termination.
41/09
016 = 16V <10pF Insert a P for
C
= C0G/
T
= 178mm Used for
<4.7pF
the decimal point, H = ±0.05pF NP0 (1B)
025 = 25V
(7”) reel
specific
050 = 50V
eg P300 = 0.3pF,
customer
B = ±0.1pF
X
= X7R
R
= 330mm
8P20 = 8.2pF.
063 = 63V
C = ±0.25pF
(2R1)
(13”) reel requirements
100 = 100V
D = ±0.5pF
10pF 1st digit
Q
= High Q
B
= Bulk
150 = 150V
is 0. 2nd and
4.7pF &
pack - tubs
200 = 200V
3rd digits are
<10pF
250 = 250V significant figures
B = ±0.1pF
3
= FlexiCap™ 500 = 500V
of capacitance
C = ±0.25pF
630 = 630V code. The 4th digit D = ±0.5pF
base with
1K0 = 1000V is number of 0’s
copper barrier
10pF
(100% matte 1K2 = 1200V
following
F = ±1%
1K5 = 1500V
tin plating).
eg. 0103 =
G = ±2%
RoHS compliant. 2K0 = 2000V
10000pF
J = ±5%
3K0 = 3000V
K = ±10%
Values <1pF in
0.1pF steps, above
this values are E24
series
[转]嵌入式linux系统工程师学习目标
嵌入式linux系统工程师学习目标 一:linux开发工程师学习目标:一个基本开发工程师我们可以称为linux开发工程师。首先应该学习如下的几个知识:1>linux的基本概念:linux系统的概念,起源文 ......
qinzheng0507 嵌入式系统
铁臂阿童木——Intel ATOM处理器剖析与研究
来看看咱们帅哥版主的大作吧: Intel在21世纪的第一个十年即将过去时,推出了新一代的嵌入式处理器——Atom,“阿童木”。回首往事,Intel在嵌入式领域的上一个经典之作,居然是已步入而立 ......
gina 嵌入式系统
做了个苹果小壳的充电器方案贡献出来给大家
苹果小壳的充电器方案,虽然已经做了很多年了,但可能太经典了,国内还是很多工程师喜欢做这种方案,为此特意做了个这样的方案,现免费贡献给大家。欢迎交流,QQ:516299686 201240 20 ......
jimmyliu188 电源技术
高手进来帮帮忙
STM32F103VCT6能使用外部5V ADC参考电压吗...
皓锋微电子 stm32/stm8
关于X86的问题
请问:我用的CPU是AMD的LX800,桥片是CS5536 属于X86架构, 买的开发板给了一个BSP 但是我想用CEPCx86的BSP 请问各位高手,这两个BSP是不是可以通用 (注:因为用CEPCx86的BSP不用自己写bo ......
282767310 嵌入式系统
eboot 下载NK.bin ,RAM下载方式运行一次后,引起下次FLAH里的OS无法启动问题?
64M Flash, 通过eboot 烧写了可以正常启动的NK.bin 有时候为了方便调试NK.bin系统, 改用 RAM 编译, 通过eboot下载后,也可以正常启动。 可当重启设备后, 原来的FLASH保存的NK.bin好 ......
almax12 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 231  1071  466  455  1231  47  49  44  43  46 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved