RUGGEDIZED cPCI SERIES (2MM) CONNECTORS
INTERCHANGEABLE COMPACT PCI COTS SYSTEMS
FEATURES:
►
Rugged implementation of the Compact PCI Standard
- Physical hole pattern in accordance with cPCI PICMG 2.0
- Contact identification in accordance with IEC 1076-4 101
►
Reliable Hypertac
®
contact technology with its field proven
immunity to shock and vibration
►
Highly optimized connector design for ruggedness and
high speed signal integrity up to 3.125 Gbps
► Hi-Rel and NASA GSFC Qualified versions
- Only cPCI approved by NASA
- LCP insulator meets NASA outgassing requirements
- Press –Fit also available for receptacle assembly: consult factory
Qualification Testing
The 2mm cPCI family of connectors meets applicable performance
requirements of EEE-INST-002, GEVS-SE Rev. A,
and is qualified to NASA GSFC S-311-P-822 specifications.
QCI (Quality Conformance Inspections)
K2 Series = MIL-DTL-55302 311P Series = NASA GSFC S-311-P-822
P1 / P4
K2A110FMD
P2 / P5
K2B110FMD
P3
K2B095FMD
J1 / J4
K2A110FFD
J2 / J5
K2B110FFD
J3
K2B095FFD
GENERAL SPECIFICATIONS
3U / 6U Form Factor
Part Number Reference
Design Criteria
Contact Gender
Contact Termination
Contact Spacing
Number of Contacts
Contact Current Rating
Temperature Range
Insulator Material
Flammability Rating
Insulation Resistance
Contact Material
Mating Contact Plating
Maximum Allowable Gap
Between Mating Connectors
Suggested Printed Circuit Board
Hole Diameter
Weight
IEC 1076-4 101
Male Pin
Solder tail 63/37 tin lead plated
2.00mm
110 signal
22 ground
95 signal
19 ground
1 Amp
-55° C to 125° C
30% Glass Filled LCP (meets NASA outgassing specification)
94 V-O
> 5000 megohm
Beryllium copper pin contacts
Beryllium copper Hypertac socket wires and
brass body
110 signal
22 ground
95 signal
19 ground
Hypertac 0.40mm socket
Gold or 63/37 tin lead dipped
50µin gold / 50µin nickel min.
0.039 inches [1.00mm]
0.71±.05mm after plating
0.55 oz.
0.53 oz.
0.38 oz.
0.38 oz.
0.60mm after plating
0.45 oz.
0.31 oz.
2MM CONNECTOR MATED PAIR
PERFORMANCE SPECIFICATIONS
3U / 6U Form Factor
Part Number Reference
LLCR (Low Level Contact Resistance)
DWV (Dielectric Withstanding Voltage)
Contact Life (Mate / Demate)
Mating Force
Demating Force
Vibration (Sinusoidal)*
Vibration (Random)**
Mechanical Shock*
P1 / P4
K2A110FMD
P2 / P5
K2B110FMD
P3
K2B95FMD
J1 / J4
K2A110FFD
J2 / J5
K2B110FFD
J3
K2B95FFD
7.20 milliohms average
1000V RMS
> 4000 Cycles (per mated connector pair)
16.38 LBF average (per mated connector pair)
13.2 LBF average (per mated connector pair)
Frequency 10 to 2000 HZ at 15 G (MIL-DTL-55302) (NASA GSFC S311-P-822)
Flight chassis unit level vibration (NASA Goddard GEVS SE Rev A)
100 G peak value (NASA GSFC S311-P-822)
* Testing was performed to determine if fretting occurs due to mechanical motion and to evaluate the integrity of the
Hypertac contact system under severe shock. To validate the test, event detection was performed at 10 nanoseconds.
There were no events recorded.
** Testing was performed using a 6U Flight Chassis to determine if fretting occurs due to mechanical motion and to evaluate
the integrity of the test samples relative to severe mechanical environment. To validate the test, event detection was
performed at 50 nanoseconds.
There were no events recorded.
MPC (MULTI-PURPOSE CENTER) KEYING
OPTIONS AVAILABLE
Material: 30% glass filled LCP – meets NASA outgassing requirements.
Color: natural
[EXAMPLE FOR CODE 1348]
[EXAMPLE FOR CODE 2368]
MATCHING CODES
MALE SIDE
(PCB)
1234
1236
1237
1238
1246
1247
1268
1345
1348
1357
1358
1378
1457
1467
1478
1568
1678
2346
3467
3478
4678
KEYSET MPC
KEY P/N
ZK2000-002-01
ZK2000-002-03
ZK2000-002-04
ZK2000-002-05
ZK2000-002-07
ZK2000-002-08
ZK2000-002-14
ZK2000-002-16
ZK2000-002-19
ZK2000-002-21
ZK2000-002-22
ZK2000-002-25
ZK2000-002-27
ZK2000-002-29
ZK2000-002-31
ZK2000-002-33
ZK2000-002-35
ZK2000-002-37
ZK2000-002-59
ZK2000-002-61
ZK2000-002-69
Intermates with
MATCHING CODES
FEMALE SIDE
(BACKPLANE)
5678
4578
4568
4567
3578
3568
3457
2678
2567
2468
2467
2456
2368
2358
2356
2347
2345
1578
1258
1256
1235
KEYSET MPC
KEY P/N
ZK2000-001-01
ZK2000-001-03
ZK2000-001-04
ZK2000-001-05
ZK2000-001-07
ZK2000-001-08
ZK2000-001-14
ZK2000-001-16
ZK2000-001-19
ZK2000-001-21
ZK2000-001-22
ZK2000-001-25
ZK2000-001-27
ZK2000-001-29
ZK2000-001-31
ZK2000-001-33
ZK2000-001-35
ZK2000-001-37
ZK2000-001-59
ZK2000-001-61
ZK2000-001-69
Note:
When assembling MPC keys into the connector, the lowest numbers should be oriented closest to row 1 on the connector.
HOW TO ORDER
K2
1
2
3
F
4
5
6
7
1
2
3
4
5
6
CONNECTOR FAMILY
K2
CONNECTOR STYLE*
(Per IEC 1076-4-101)
A
= WITH MULTI-PURPOSE CENTER
(MPC; polarization feature)
B
= WITHOUT MPC
NUMBER OF SIGNAL PINS
1 1 0
= 110 CONTACTS
0 9 5
= 95 CONTACTS
NUMBER OF ROWS
F
= TOP SHIELD
(6 row)
CONTACT GENDER
M
= MALE D.C.
F
= FEMALE B.P.
STRAIGHT DIP SOLDER
DESIGNATION
D
D4
BACKPLANE
CONNECTOR TAIL
LENGTH
0.216 [5.50]
0.166 [4.22]
DAUGHTER BOARD
CONNECTOR TAIL LENGTH
0.123 [3.12]
0.166 [4.22]
7
PLATING
T AH
= 50ΜIN GOLD OVER NICKEL
(mating surface only)
OTHER SURFACES GOLD FLASH OVER NICKEL
(female contacts only)
T ABH
= SAMPE AS TAH WITH TIN/LEAD
(63/67)
OVER NICKEL ON CONTACT TERMINATIONS
(female contacts only)
T BH
= SAME AS TH WITH TIN/LEAD (63/67) OVER NICKEL ON CONTACT TERMINATIONS
(male contacts only)
Quality Conformance Inspection = MIL-DTL 55302 Group A & B
* Pin one locations per 1076-4-101
FPGA/CPLD
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