0402/0603 Chip Inductors
FEATURES
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LASER CUT SPIRAL COIL OVER ALUMINA CORE
SUPER MINIATURE EIA 0402 & 0603 SIZE IN RESIN ENCLOSED BODY
HIGH Q AND SRF FOR HIGH FREQUENCY APPLICATIONS
TIGHT TOLERANCES (D ± 0.3nH, G ± 2% or J ± 5%)
BOTH FLOW AND REFLOW SOLDERING APPLICABLE
EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE
NIS Series
RoHS
Compliant
SPECIFICATIONS
Inductance Range
Inductance Tolerance
Operating Temperature Range
Q-Factor, Self Resonant Frequency,
DC Resistance, Rated DC Current
and INductance Tolerance
1.0 ~ 220nH
D (±0.3nH), J (±5%)
-40°C ~ +85°C
See Individual
Product Listings
includes all homogeneous materials
*See Part Number System for Details
ENVIRONMENTAL CHARACTERISTICS
Test
Solderability
Humidity Resistance
Soldering Effect
Low Frequency Vibration
Thermal Shock
Low Temperature Storage
High Temperature Load Life
Humidity Load Life
Specification
90% Min. Coverage
(1) No Evidence of Damage
(2) Inductance Shall Be Within
±5% of Initial Value
(3) Q Factor Shall Be Within
±20% of Initial Value
(±25% for 0201 Size)
(1) No Evidence of Damage
(2) Inductance Shall Be Within
±10% of Initial Value
(3) Q Factor Shall Be Within
±20% of Initial Value
Test Method & Condition
After 3 Sec. Dip in +230°C Solder Pot (Post Flux)
After 500 Hrs. at +60°C & 90-95% RH (No Load)
After 10 Sec. at +260°C (5 Min., 120°C Pre-Heat)
After 2 Hrs per Axis, 10~55Hz, 1.5mm Amplitude
After 100 Cycles (-40°C ~ +85°C) 30 Min. Each
After 500 Hrs. at -40°C
After 500 Hrs. at +85°C with Rated DC Current
After 500 Hrs. at +60°C & 90-95% RH with Rated
DC Current
PART NUMBER SYSTEM
NIS04 J 22N TR F
RoHS compliant
Packaging: TR = Tape & Reel
Inductance Code (N=decimal point)
(Ex. 2N2=2.2nH, 33N=33nH)
Tolerance Code (D=±0.3nH, G=±2%, J=±5%)
Series (04=0402, 06=0603)
PART AND LAND PATTERN DIMENSIONS (mm)
Series
L
W
H
t
NIS04 1.0±0.05 0.5±0.05 0.5±0.05 0.2±0.05
NIS06 1.6 0.05 0.8±0.15 0.8±0.15 0.3±0.2
A
0.5~0.6
0.8~1.0
B
1.5~1.7
2.0~2.6
C
0.5~0.6
0.7~0.9
Recommended land patterns for flow and reflow soldering
DIMENSION (mm)
Solder Plated Terminations
Resin Enclosure
NIS Chip
Land Pattern
H
C
t
L
®
W
A
B
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
1
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