Leiterplatten-Layout Vorschlag für SMT
PCB-Layout Proposal for SMT
1,6
-0,03
2
±0,05
a16
0,8
a1
1,2
0,3
Verpackt im Gurt nach DIN IEC 60286-3
Verpackungseinheit: 560 Stück
Tape on Reel Packaging according to DIN IEC 60286-3
Packaging unit: 560 pcs
1,27
1,27
15 x 1,27 = 19,05
23,47
±0,03
2,21
±0,03
330
7,6
2,2
b1
1,5
-0,03
5,2
Abspulrichtung -
Reel off Direction
7,2
b16
b1
0,75
-0,05
23,47
±0,03
21,07
1,27
Anforderungsstufe 1
9,6
7,2
3,85
44
Performance Level 1
Kontaktbereich vergoldet
3,05
Mating Area gold plating
1,55
1,27
15 x 1,27 = 19,05
22,07
25,4
Anschlussbereich verzinnt 4-6 µm
Terminal Area 4-6 µm tin plating
16
Koplanarität der Anschlüsse
≤
0,1 mm
Coplanarity Area of Termination
≤
0,1 mm
BA7-03 - Standard Bauhöhe
type7-03 - standard assembly height
Copyright by ERNI GmbH
Proprietary notice pursuant to ISO 16016 to be observed.
Information:
Tolerances
All Dimensions
in mm
Scale
3:1
3,27
2
1,5
1
All rights reserved.
Only for Information.
To ensure that this is the latest
version of this drawing, please
contact one of the ERNI companies
before using.
b
Index
22.04.2014
Date
Designation
Subject to modification without
prior notice.
Drawing will not be updated.
Federl. SMC-Q 32-SMD-BA7-03
Female SMC-Q 32-SMD-type7-03
www.ERNI.com
Class
354080
SMCQ
I
A3