iC-HG
3 A LASER SWITCH
Rev B2, Page 1/20
FEATURES
o
o
o
o
o
o
o
o
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Six channel laser switch from CW up to 200 MHz
CW operation with up to 500 mA per channel
Pulsed operation with up to 1.5 A per channel
Spike-free switching of the laser current
6 x 1 channels with TTL inputs
3 x 2 channels with LVDS inputs
Operates as six independent voltage-controlled current sinks
Outputs (LDKx) are 12 V capable for blue/green laser diodes
Fast and slow switching mode
Simple current control at pins CIx
CIx voltage < 3 V for full CW current
Wide supply voltage range from 3 to 5.5 V
All channels can be paralleled for up to 3 A CW and 9 A pulsed
operation
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Multiple iC-HG can be connected in parallel for higher currents
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Open drain error output
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Thermal shutdown
APPLICATIONS
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Pump lasers
Laser projection
Laser TV
Data transmission
TOF camera lighting
PACKAGES
QFN28 5 mm x 5 mm
BLOCK DIAGRAM
VDD
iC-HG
LDK1
CI1
EN1
+
&
AGND1
LDK2
CI2
EN2
CI3
EN3
CI4
EN4
CI5
EN5
CI6
EN6
VDD
-
&
AGND2
LDK3
AGND3
LDK4
AGND4
LDK5
AGND5
LDK6
AGND6
NER
80%
60%
40%
20%
ELVDS
&
Power &
Temperature
Monitor
GND
Copyright © 2014 iC-Haus
http://www.ichaus.com
iC-HG
3 A LASER SWITCH
Rev B2, Page 2/20
DESCRIPTION
Six channel Laser Switch iC-HG enables the spike-
free switching of laser diodes with well-defined cur-
rent pulses at frequencies ranging from DC to
200 MHz.
The diode current is determined by the voltages at
pins CIx.
The six fast switches are controlled independently via
TTL inputs. Input ELVDS = hi selects LVDS type in-
puts and three channel mode.
TTL slow switch mode
is selected with 30% VDD and
LVDS slow switch
mode
with 70% VDD at input ELVDS.
The laser diode can thus be turned on and off or
switched between different current levels (LDKx con-
nected) defined by the voltages at CIx.
Each channel can be operated up to 500 mA CW and
1500 mA pulsed current depending on the frequency,
duty cycle and heat dissipation.
The integrated thermal shutdown feature protects the
iC-HG from damage by excessive temperature.
iC-HG
3 A LASER SWITCH
Rev B2, Page 3/20
PACKAGING INFORMATION QFN28 5 mm x 5 mm to JEDEC
PIN CONFIGURATION QFN28 5 mm x 5 mm
PIN FUNCTIONS
No. Name Function
1
2
3
4
5
6
7
8
9
10
11
12
13
14
CI1
CI2
CI3
GND
CI4
CI5
CI6
AGND6
LDK6
AGND5
LDK5
AGND4
LDK4
EN6
Current control voltage channel 1
Current control voltage channel 2
Current control voltage channel 3
Ground
Current control voltage channel 4
Current control voltage channel 5
Current control voltage channel 6
Analog ground channel 6
Laser diode cathode channel 6
Analog ground channel 5
Laser diode cathode channel 5
Analog ground channel 4
Laser diode cathode channel 4
TTL switching input channel 6
Negative LVDS Input channel 5 and 6
TTL switching input channel 5
Positive LVDS Input channel 5 and 6
TTL switching input channel 4
Negative LVDS Input channel 3 and 4
TTL switching input channel 3
Positive LVDS Input channel 3 and 4
Supply voltage
TTL/LVDS Fast/Slow Input selector
TTL switching input channel 2
Negative LVDS Input channel 1 and 2
TTL switching input channel 1
Positive LVDS Input channel 1 and 2
Error monitor output
Laser diode cathode channel 3
Analog ground channel 3
Laser diode cathode channel 2
Analog ground channel 2
Laser diode cathode channel 1
Analog ground channel 1
28
27
26
25
24
23
22
1
2
3
4
5
6
7
21
20
19
HG
code...
...
18
17
16
15
15 EN5
8
9
10
11
12
13
14
16 EN4
17 EN3
18 VDD
19 ELVDS
20 EN2
21 EN1
22
23
24
25
26
27
28
NER
LDK3
AGND3
LDK2
AGND2
LDK1
AGND1
The
Thermal Pad
is to be connected to a
Ground Plane
(GND, AGND1. . . 6) on the PCB.
Only pin 1 marking on top or bottom defines the package orientation ( HG label and coding is subject
to change).
iC-HG
3 A LASER SWITCH
Rev B2, Page 4/20
PACKAGE DIMENSIONS QFN28-5x5
All dimensions given in mm.
This package falls within JEDEC MO-220-VHHD-1.
RECOMMENDED PCB-FOOTPRINT
4.70
3.15
15
R0.
SIDE
0.90
3.15
4.70
0.50
0.30
TOP
5
BOTTOM
3.15
0.50
0.25
0.55
drb_qfn28-2_pack_1, 10:1
3.15
5
0.90
iC-HG
3 A LASER SWITCH
Rev B2, Page 5/20
ABSOLUTE MAXIMUM RATINGS
Beyond these values damage may occur; device operation is not guaranteed.
Item
No.
Symbol
Parameter
Voltage at VDD
Current in VDD
Voltage at CI1. . . 6
Voltage at EN1. . . 6, AGND1. . . 6,
ELVDS, NER
Voltage at LDK1. . . 6
Current in LDK1. . . 6
Current in AGND1. . . 6
Current in CI1. . . 6, EN1. . . 6, ELVDS
Current in NER
ESD Susceptibility at all pins
Operating Junction Temperature
Storage Temperature Range
HBM 100 pF discharged through 1.5 kΩ
-40
-40
DC current
DC current
Conditions
Min.
-0.3
-10
-0.3
-0.3
-0.3
-10
-600
-10
-10
Max.
6
750
6
6
12
600
10
10
20
2
125
150
V
mA
V
V
V
mA
mA
mA
mA
kV
°C
°C
Unit
G001 VDD
G002 I(VDD)
G003 V(CI)
G004 V()
G005 V(LDK)
G006 I(LDK)
G007 I(AGND)
G008 I()
G009 I(NER)
G010 Vd()
G011 Tj
G012 Ts
THERMAL DATA
Item
No.
T01
T02
T03
Symbol
Ta
Rthja
RthjTP
Parameter
Operating Ambient Temperature Range
(extended range on request)
Thermal Resistance Chip/Ambient
Thermal Resistance Chip/Thermal Pad
Mounted onto the Evaluation Board HG1D
Conditions
Min.
-25
25
4
Typ.
Max.
85
°C
K/W
K/W
Unit
All voltages are referenced to ground unless otherwise stated.
All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.
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