256X4 OTPROM, 50ns, CDIP16, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 50 ns |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.43 mm |
| 内存密度 | 1024 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 字数 | 256 words |
| 字数代码 | 256 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256X4 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大压摆率 | 0.13 mA |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| DM74S287J | DM74S287AN | DM74S287N | DM74S287AV | DM74S287V | DM74S287AJ | |
|---|---|---|---|---|---|---|
| 描述 | 256X4 OTPROM, 50ns, CDIP16, CERAMIC, DIP-16 | 256X4 OTPROM, 30ns, PDIP16, PLASTIC, DIP-16 | 256X4 OTPROM, 50ns, PDIP16, PLASTIC, DIP-16 | 256X4 OTPROM, 30ns, PQCC20, PLASTIC, LCC-20 | IC 256 X 4 OTPROM, 50 ns, PQCC20, PLASTIC, LCC-20, Programmable ROM | 256X4 OTPROM, 30ns, CDIP16, CERAMIC, DIP-16 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP | DIP | DIP | QLCC | QLCC | DIP |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | QCCJ, LDCC20,.4SQ | QCCJ, LDCC20,.4SQ | DIP, DIP16,.3 |
| 针数 | 16 | 16 | 16 | 20 | 20 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 50 ns | 30 ns | 50 ns | 30 ns | 50 ns | 30 ns |
| JESD-30 代码 | R-GDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | S-PQCC-J20 | S-PQCC-J20 | R-GDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 19.43 mm | 21.755 mm | 21.755 mm | 8.89 mm | 8.89 mm | 19.43 mm |
| 内存密度 | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bi |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 20 | 20 | 16 |
| 字数 | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
| 字数代码 | 256 | 256 | 256 | 256 | 256 | 256 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256X4 | 256X4 | 256X4 | 256X4 | 256X4 | 256X4 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | QCCJ | QCCJ | DIP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | LDCC20,.4SQ | LDCC20,.4SQ | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 4.57 mm | 4.57 mm | 5.08 mm |
| 最大压摆率 | 0.13 mA | 0.13 mA | 0.13 mA | 0.13 mA | 0.13 mA | 0.13 mA |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES | YES | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 8.89 mm | 8.89 mm | 7.62 mm |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 |
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