IC MCU 8BIT 128KB FLASH 100CBGA
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Microchip(微芯科技) |
包装说明 | 9 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, GREEN, CBGA-100 |
Reach Compliance Code | compliant |
Factory Lead Time | 4 weeks |
具有ADC | YES |
其他特性 | ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4 MHZ |
地址总线宽度 | 16 |
位大小 | 8 |
CPU系列 | AVR RISC |
最大时钟频率 | 8 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | 8 |
JESD-30 代码 | S-PBGA-B100 |
长度 | 9 mm |
I/O 线路数量 | 86 |
端子数量 | 100 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TFBGA |
封装等效代码 | BGA100,10X10,32 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH |
电源 | 2/5 V |
认证状态 | Not Qualified |
RAM(字节) | 8192 |
ROM(单词) | 65536 |
ROM可编程性 | FLASH |
座面最大高度 | 1.2 mm |
速度 | 8 MHz |
最大压摆率 | 14 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 2.7 V |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
宽度 | 9 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
ATMEGA1280V-8CU | ATMEGA2561V-8AU | ATMEGA2561V-8MU | ATMEGA640-16AU | ATMEGA640V-8CU | ATMEGA1280V-8AU | ||
---|---|---|---|---|---|---|---|
描述 | IC MCU 8BIT 128KB FLASH 100CBGA | IC MCU 8BIT 256KB FLASH 64TQFP | IC MCU 8BIT 256KB FLASH 64QFN | IC MCU 8BIT 64KB FLASH 100TQFP | IC MCU 8BIT 64KB FLASH 100CBGA | IC MCU 8BIT 128KB FLASH 100TQFP | |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | |
厂商名称 | Microchip(微芯科技) | - | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | |
包装说明 | 9 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, GREEN, CBGA-100 | 14 X 14 MM, 1 MM HEIGHT, 0.80 MM PITCH, GREEN, PLASTIC, MS-026AEB, TQFP-64 | HVQCCN, LCC64,.35SQ,20 | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, MS-026AED, TQFP-100 | 9 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, GREEN, CBGA-100 | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, MS-026AED, TQFP-100 | |
Reach Compliance Code | compliant | compli | compli | compliant | compliant | compli | |
Factory Lead Time | 4 weeks | 4 weeks 6 days | 10 weeks | 7 weeks | 4 weeks | 7 weeks | |
具有ADC | YES | YES | YES | YES | YES | YES | |
其他特性 | ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4 MHZ | ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 2 MHZ | ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 2 MHZ | ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 8 MHZ | ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4 MHZ | ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4 MHZ | |
地址总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | |
位大小 | 8 | 8 | 8 | 8 | 8 | 8 | |
CPU系列 | AVR RISC | AVR RISC | AVR RISC | AVR RISC | AVR RISC | AVR RISC | |
最大时钟频率 | 8 MHz | 8 MHz | 8 MHz | 16 MHz | 8 MHz | 8 MHz | |
DAC 通道 | NO | NO | NO | NO | NO | NO | |
DMA 通道 | NO | NO | NO | NO | NO | NO | |
外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | |
JESD-30 代码 | S-PBGA-B100 | S-PQFP-G64 | S-XQCC-N64 | S-PQFP-G100 | S-PBGA-B100 | S-PQFP-G100 | |
长度 | 9 mm | 14 mm | 9 mm | 14 mm | 9 mm | 14 mm | |
I/O 线路数量 | 86 | 54 | 54 | 86 | 86 | 86 | |
端子数量 | 100 | 64 | 64 | 100 | 100 | 100 | |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | |
PWM 通道 | YES | YES | YES | YES | YES | YES | |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | |
封装代码 | TFBGA | TQFP | HVQCCN | TFQFP | TFBGA | TFQFP | |
封装等效代码 | BGA100,10X10,32 | TQFP64,.63SQ,32 | LCC64,.35SQ,20 | TQFP100,.63SQ | BGA100,10X10,32 | TQFP100,.63SQ | |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | |
封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | FLATPACK, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | |
电源 | 2/5 V | 2/5 V | 2/5 V | 3/5 V | 2/5 V | 2/5 V | |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | |
RAM(字节) | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | |
ROM(单词) | 65536 | 131072 | 131072 | 32768 | 32768 | 65536 | |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | |
座面最大高度 | 1.2 mm | 1.2 mm | 1 mm | 1.2 mm | 1.2 mm | 1.2 mm | |
速度 | 8 MHz | 8 MHz | 8 MHz | 16 MHz | 8 MHz | 8 MHz | |
最大压摆率 | 14 mA | 14 mA | 14 mA | 14 mA | 14 mA | 14 mA | |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | |
最小供电电压 | 2.7 V | 2.7 V | 2.7 V | 4.5 V | 2.7 V | 2.7 V | |
标称供电电压 | 3 V | 3 V | 3 V | 5 V | 3 V | 3 V | |
表面贴装 | YES | YES | YES | YES | YES | YES | |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | |
端子形式 | BALL | GULL WING | NO LEAD | GULL WING | BALL | GULL WING | |
端子节距 | 0.8 mm | 0.8 mm | 0.5 mm | 0.5 mm | 0.8 mm | 0.5 mm | |
端子位置 | BOTTOM | QUAD | QUAD | QUAD | BOTTOM | QUAD | |
宽度 | 9 mm | 14 mm | 9 mm | 14 mm | 9 mm | 14 mm | |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | |
JESD-609代码 | - | e3 | e3 | e3 | - | e3 | |
湿度敏感等级 | - | 3 | 3 | 3 | - | 3 | |
峰值回流温度(摄氏度) | - | 260 | 260 | 260 | - | 260 | |
端子面层 | - | Matte Tin (Sn) | MATTE TIN | Matte Tin (Sn) | - | Matte Tin (Sn) | |
处于峰值回流温度下的最长时间 | - | 40 | 40 | 40 | - | 40 |
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