Preliminary
GS82032T/Q-150/138/133/117/100/66
TQFP, QFP
Commercial Temp
Industrial Temp
Features
• FT pin for user-configurable flow through or pipeline
operation
• Single Cycle Deselect (SCD) operation
• 3.3 V +10%/–5% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Common data inputs and data outputs
• Clock Control, registered, address, data, and control
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard 100-lead TQFP or QFP package
-150 -138 -133 -117 -100
Pipeline tCycle 6.6 7.25 7.5 8.5
10
3-1-1-1
t
KQ
3.8
4
4
4.5
5
I
DD
270 245 240 210 180
Flow tCycle 10.5 15
15
15
15
Through t
KQ
9
9.7
10
11
12
2-1-1-1
I
DD
170 120 120 120 120
-66
12.5
6
150
20
18
95
Unit
ns
ns
mA
ns
ns
mA
64K x 32
2M Synchronous Burst SRAM
Flow Through/Pipeline Reads
150 MHz–66 MHz
9 ns–18 ns
3.3 V V
DD
3.3 V and 2.5 V I/O
The function of the Data Output register can be controlled by
the user via the FT mode pin/bump (Pin 14 in the TQFP, Bump
1F in the FP-BGA). Holding the FT mode pin/bump low,
places the RAM in Flow Through mode, causing output data to
bypass the Data Output Register. Holding FT high places the
RAM in Pipeline mode, activating the rising-edge-triggered
Data Output Register.
SCD Pipelined Reads
The GS82032 is an SCD (Single Cycle Deselect) pipelined
synchronous SRAM. DCD (Dual Cycle Deselect) versions are
also available. SCD SRAMs pipeline deselect commands one
stage less than read commands. SCD RAMs begin turning off
their outputs immediately after the deselect command has been
captured in the input registers.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the byte write
control inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion
(High) of the ZZ signal, or by stopping the clock (CK).
Memory data is retained during Sleep mode.
Functional Description
Applications
The GS82032 is a 2,097,152-bit high performance
synchronous SRAM with a 2-bit burst address counter.
Although of a type originally developed for Level 2 Cache
applications supporting high performance CPUs, the device
now finds application in synchronous SRAM applications
ranging from DSP main store to networking chip set support.
Core and Interface Voltages
The GS82032 operates on a 3.3 V power supply and all inputs/
outputs are 3.3 V- and 2.5 V-compatible. Separate output
power (V
DDQ
) pins are used to decouple output noise from the
internal circuit.
Controls
Addresses, data I/Os, chip enables (E
1
, E
2
, E
3
), address burst
control inputs (ADSP, ADSC, ADV), and write control inputs
(Bx, BW, GW) are synchronous and are controlled by a
positive-edge-triggered clock input (CK). Output enable (G)
and power down control (ZZ) are asynchronous inputs. Burst
cycles can be initiated with either ADSP or ADSC inputs. In
Burst mode, subsequent burst addresses are generated
internally and are controlled by ADV. The burst address
counter may be configured to count in either linear or
interleave order with the Linear Burst Order (LBO) input. The
Burst function need not be used. New addresses can be loaded
on every cycle with no degradation of chip performance.
Rev: 1.04 2/2001
1/23
© 2000, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
ByteSafe is a Trademark of Giga Semiconductor, Inc. (GSI Technology).
Preliminary
GS82032T/Q-150/138/133/117/100/66
GS82032 100-Pin TQFP and QFP Pinout
NC
DQ
C8
DQ
C7
V
DDQ
V
SS
DQ
C6
DQ
C5
DQ
C4
DQ
C3
V
SS
V
DDQ
DQ
C2
DQ
C1
FT
V
DD
NC
V
SS
DQ
D1
DQ
D2
V
DDQ
V
SS
DQ
D3
DQ
D4
DQ
D5
DQ
D6
V
SS
V
DDQ
DQ
D7
DQ
D8
NC
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
1
80
2
79
3
78
4
77
5
76
6
75
7
74
8
73
9
72
64K x 32
10
71
Top View
11
70
12
69
13
68
14
67
15
66
16
65
17
64
18
63
19
62
20
61
21
60
22
59
23
58
24
57
25
56
26
55
27
54
28
53
29
52
30
51
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
A
6
A
7
E
1
E
2
B
D
B
C
B
B
B
A
E
3
V
DD
V
SS
CK
GW
BW
G
ADSC
ADSP
ADV
A
8
A
9
NC
DQ
B8
DQ
B7
V
DDQ
V
SS
DQ
B6
DQ
B5
DQ
B4
DQ
B3
V
SS
V
DDQ
DQ
B2
DQ
B1
V
SS
NC
V
DD
ZZ
DQ
A1
DQ
A2
V
DDQ
V
SS
DQ
A3
DQ
A4
DQ
A5
DQ
A6
V
SS
V
DDQ
DQ
A7
DQ
A8
NC
Rev: 1.04 2/2001
LBO
A
5
A
4
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
A
3
A
2
A
1
A
0
NC
NC
V
SS
V
DD
NC
NC
A
10
A
11
A
12
A
13
A
14
A
15
NC
2/23
© 2000, Giga Semiconductor, Inc.
Preliminary
GS82032T/Q-150/138/133/117/100/66
TQFP Pin Description
Pin Location
37, 36
35, 34, 33, 32, 100, 99, 82, 81, 44, 45,
46, 47, 48, 49
52, 53, 56, 57, 58, 59, 62, 63
68, 69, 72, 73, 74, 75, 78, 79
2, 3, 6, 7, 8, 9, 12, 13
18, 19, 22, 23, 24, 25, 28, 29
16, 38, 39, 42, 43, 66, 50, 51, 80, 1, 30
87
93, 94
95, 96
89
88
98, 92
97
86
83
84, 85
64
14
31
15, 41, 65, 91
5,10,17, 21, 26, 40, 55, 60, 67, 71, 76, 90
4, 11, 20, 27, 54, 61, 70, 77
Symbol
A
0
, A
1
A
2
–A
15
DQ
A1
–DQ
A8
DQ
B1
–DQ
B8
DQ
C1
–DQ
C8
DQ
D1
–DQ
D8
NC
BW
B
A
, B
B
B
C
, B
D
CK
GW
E
1
, E
3
E
2
G
ADV
ADSP, ADSC
ZZ
FT
LBO
V
DD
V
SS
V
DDQ
Type
I
I
Description
Address field LSBs and Address Counter preset Inputs
Address Inputs
I/O
Data Input and Output pins
No Connect
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
Byte Write—Writes all enabled bytes; active low
Byte Write Enable for DQ
A
, DQ
B
Data I/Os; active low
Byte Write Enable for DQ
C
, DQ
D
Data I/Os; active low
Clock Input Signal; active high
Global Write Enable—Writes all bytes; active low
Chip Enable; active low
Chip Enable; active high
Output Enable; active low
Burst address counter advance enable; active low
Address Strobe (Processor, Cache Controller); active low
Sleep Mode control; active high
Flow Through or Pipeline mode; active low
Linear Burst Order mode; active low
Core power supply
I/O and Core Ground
Output driver power supply
Rev: 1.04 2/2001
3/23
© 2000, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS82032T/Q-150/138/133/117/100/66
GS82032 Block Diagram
Register
A0–An
D
Q
A0
D0
A1
D1
Q1
Counter
Load
A
Q0
A0
A1
LBO
ADV
CK
ADSC
ADSP
GW
BW
B
A
Register
Memory
Array
Q
D
Q
D
Register
D
B
B
Q
32
4
32
Register
D
B
C
Q
Q
Register
D
Register
Q
Register
D
D
B
D
Q
Register
D
Q
Register
E
1
E
2
E
3
D
Q
Register
D
Q
FT
G
Power Down
Control
1
ZZ
DQx1–DQx8
Rev: 1.04 2/2001
4/23
© 2000, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS82032T/Q-150/138/133/117/100/66
Mode Pin Functions
Mode Name
Burst Order Control
Output Register Control
Power Down Control
Pin
Name
LBO
FT
ZZ
State
L
H or NC
L
H or NC
L or NC
H
Function
Linear Burst
Interleaved Burst
Flow Through
Pipeline
Active
Standby, I
DD
= I
SB
Note:
There are pull-up devices on LBO and FT pins and a pull down device on the ZZ pin, so those input pins can be
unconnected and the chip will operate in the default states as specified in the above tables.
Burst Counter Sequences
Linear Burst Sequence
I
nterleaved Burst Sequence
A[1:0] A[1:0] A[1:0] A[1:0]
1st address
2nd address
3rd address
4th address
00
01
10
11
01
00
11
10
10
11
00
01
11
10
01
00
01
10
11
00
10
11
00
01
11
00
01
10
A[1:0] A[1:0] A[1:0] A[1:0]
1st address
2nd address
3rd address
4th address
00
01
10
11
Note: The burst counter wraps to initial state on the 5th clock.
Note: The burst counter wraps to initial state on the 5th clock.
Byte Write Truth Table
Function
Read
Read
Write byte
A
Write byte
B
Write byte
C
Write byte
D
Write all bytes
Write all bytes
GW
H
H
H
H
H
H
H
L
BW
H
L
L
L
L
L
L
X
B
A
X
H
L
H
H
H
L
X
B
B
X
H
H
L
H
H
L
X
B
C
X
H
H
H
L
H
L
X
B
D
X
H
H
H
H
L
L
X
Notes
1
1
2, 3
2, 3
2, 3, 4
2, 3, 4
2, 3, 4
Notes:
1. All byte outputs are active in read cycles regardless of the state of Byte Write Enable inputs.
2. Byte Write Enable inputs B
A
, B
B
, B
C
, and/or B
D
may be used in any combination with BW to write single or multiple bytes.
3. All byte I/Os remain High-Z during all write operations regardless of the state of Byte Write Enable inputs.
Rev: 1.04 2/2001
5/23
© 2000, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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