PPTC/TSM Series
Features
Surface Mount Devices
Lead free deivce
Size 5045mm/2018 mils
Surface Mount packaging for automated assembly
Agency recognition:
Dimensions (mm)
A
Applications
Almost anywhere there is a low voltage
power supply, up to DC60V and a load
to be protested, including:
Computer mother board, Modem.
Telecommunication equipments
5
1
1. ±0.
1. ±0.
5
1
B
3. ±0.
4
1
D
C
Model
TSM030
TSM050
TSM100
TSM100/33
TSM150
TSM200
A
min
4.44
4.44
4.
4.44
4.44
4.44
4.44
max
4.72
4.72
4.72
4.
4.72
4.72
4.72
Product dimensions (mm)
B
C
min
0.60
0.60
0.45
0.45
0.45
0.45
max
1.10
1.10
0.80
0.80
0.80
0.80
min
4.22
4.22
4.22
4.22
4.22
4.22
max
4.93
4.93
4.93
4.93
4.93
4.93
D
min
0.30
0.30
0.30
0.30
0.30
0.30
Environmental Specifications
Conditions
Test
85℃,1000hrs
Passive aging
85℃,85%℃R.H.,168hrs
Humidity aging
85℃,to-40℃,13times
Thermal shock
MIL-STD-202,Method 215
Resistance to solvent
MIL-STD-202,Method 201
Vibration
Ambient operating confitions:-40℃
to 85℃
Maximum surface of the device in the tripped state is 125℃
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
Termination pad characteristics
Terminal pad materials
Terminal pad solderability
Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper
Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
REV.2014.05.01
4. ±0.
6
1
01 | www.spsemi.cn
ZZZ
PPTC/TSM Series
Model
TSM030
TSM050
TSM100
TSM100/33
TSM150
TSM200
Ihold
Itrip
Vmax
Imax
Pd
Rmin/max
R1max
*CAUTION
Model
TSM030
TSM050
TSM100
TSM100/33
TSM150
TSM200
Ihold
(A)
0.30
0.55
1.00
1.00
1.50
2.00
Itrip
(A)
0.60
1.20
2.20
2.20
3.00
4.00
Electrical characteristics(25℃ )
Vmax Imax Pd max Maximum Time To Trip
Current
Time
(Vdc) (A)
(w)
(A)
(S)
60
100
0.9
1.50
3.0
60
100
1.0
2.5
3.00
15
100
1.1
8.0
0.40
33
100
1.1
8.0
0.4
15.0
100
1.1
8.0
0.8
10
100
1.1
8.0
2.4
Resistance
Rmin Rmax
(Ω
)
(Ω
)
0.500 2.300
0.200 1.000
0.060 0.360
0.060 0.360
0.050 0.170
0.030 0.100
Hold Current:Maximum current device will not trip in 25℃ still air.
Trip current:Minimum current at which the device will always trip in 25℃ still air
Maximum operating volatge device can withstand without damage at ratde current(imax).
Maximum fault current device can withstand without damage at rated voltage(Vmax).
Typical power dissipatde from device when in the tripped state in 25℃ still air.
Minimum/Maximum device resistance prior to tripping at 25℃.
Maximum resistance of device at 25℃ measured one hour after trippde tripping.
Operation beyond the specified rating may result in damage and possible arcing.
Ihold versus tempetature
maximun ambient operating temperature(Tmao)vs.hold current(Ihold)
—40℃ —20℃ 0℃
25℃ 40℃
50℃
60℃
70℃
85℃
0.480
0.42 0.350 0.30 0.240 0.21
0.17
0.15
0.100
0.87
0.77
0.67 0.55 0.460 0.41
0.36
0.31
0.23
1.71
1.52
1.32 1.00 0.940 0.84
0.74
0.64
0.50
1.71
1.52
1.32 1.00 0.940 0.84
0.74
0.64
0.50
2.38
2.10
1.82 1.50 1.270 1.13
0.99
0.85
0.64
2.95
2.65
2.35 2.00 1.740 1.59
1.44
1.29
1.06
Thermal Derating Curve
Derating Curves for SMD2018 Series
Percentage of Derated Current
160
140
Typical Time-To-Trip At 25°
C
Average Time Current Curves
100
10
050
100
80
60
40
20
Time In Second
120
100
1
150
0.1
0.01
0.001
200
0
-40
-20
0
20
40
60
80
133
0.1
1
10
100
030
Temperature (°
C)
Current In Amperes
Package Information
Reel:
TSM030½050
TSM100½200
1500pcs/Reel
2500pcs/Reel
REV.2014.05.01
02 | www.spsemi.cn
stm32/stm8
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