IC,COMPLEMENTARY PAIR AND INVERTER,CMOS,DIP,14PIN,CERAMIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | NXP(恩智浦) |
包装说明 | DIP, DIP14,.3 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-XDIP-T14 |
JESD-609代码 | e0 |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5/15 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
MC14007UBCLD | MC14007UBALDS | MC14007UBALD | MC14007UBCPDS | MC14007UBCPD | |
---|---|---|---|---|---|
描述 | IC,COMPLEMENTARY PAIR AND INVERTER,CMOS,DIP,14PIN,CERAMIC | IC,COMPLEMENTARY PAIR AND INVERTER,CMOS,DIP,14PIN,CERAMIC | IC,COMPLEMENTARY PAIR AND INVERTER,CMOS,DIP,14PIN,CERAMIC | IC,COMPLEMENTARY PAIR AND INVERTER,CMOS,DIP,14PIN,PLASTIC | IC,COMPLEMENTARY PAIR AND INVERTER,CMOS,DIP,14PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-PDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -55 °C | -55 °C | -40 °C | -40 °C |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
表面贴装 | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
Is Samacsys | - | N | N | N | - |
Base Number Matches | - | 1 | 1 | 1 | - |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved