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HN27C301AFP-25: 产品描述OTP ROM, 128KX8, 250ns, CMOS, PDSO32, PLASTIC, SOP-32; 产品类别存储存储; 文件大小99KB，共20页; 制造商Hitachi （Renesas ）; 官网地址http://www.renesas.com/eng/

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HN27C301AFP-25概述

OTP ROM, 128KX8, 250ns, CMOS, PDSO32, PLASTIC, SOP-32

HN27C301AFP-25规格参数

参数名称	属性值
厂商名称	Hitachi （Renesas ）
零件包装代码	SOIC
包装说明	SOP,
针数	32
Reach Compliance Code	unknown
ECCN代码	EAR99
最长访问时间	250 ns
JESD-30 代码	R-PDSO-G32
长度	20.45 mm
内存密度	1048576 bit
内存集成电路类型	OTP ROM
内存宽度	8
功能数量	1
端子数量	32
字数	131072 words
字数代码	128000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	128KX8
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	PARALLEL
认证状态	Not Qualified
座面最大高度	3 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
宽度	11.3 mm

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HN27C101AP/AFP/ATT Series

HN27C301AP/AFP Series

131072-word

8-bit CMOS One Time Electrically Programmable

ROM

Description

The HN27C101AP/AFP/ATT series are 131072-word

8-bit one time electrically programmable ROM.

Initially, all bits of the HN27C101AP/AFP/ATT, HN27C301AP /AFP series are in the "1" state (output high).

Data is introduced by selectively programming "0" into the desired bit location. This device is packaged in

32-pin plastic package, therefore, this device cannot be rewritten and erased. The packages of the

HN27C101ATT series are surface mount thin and small outline packages. They are suitable for hand-held

equipment such as a memory card.

Features

•

Single power supply: +5 V

10%

•

Fast high-reliability programming mode and fast high-reliability page programming mode



Programming voltage: +12.5 V DC



Fast high-reliability page programming: 14 sec typ

•

High speed inputs and outputs TTL compatible during both read and program modes

•

Low power dissipation: 50 mW/MHz typ (active)

µW

typ (standby)

•

Pin arrangement: 32-pin JEDEC standard except HN27C301A series replaceable 32 pin Mask ROM

(HN27C301AP/AFP Series)

•

Package



Surface mount thin and small outline package (TSOP) type II: HN27C101ATT series

•

Device identifier mode: manufacturer code and device code

•

Fully compatible with HN27C101P/FP, 301P/FP series

HN27C301AFP-25相似产品对比

	HN27C301AFP-25	HN27C101AFP-25	HN27C301AP-20	HN27C301AP-25	HN27C301AFP-15	HN27C101AP-25
描述	OTP ROM, 128KX8, 250ns, CMOS, PDSO32, PLASTIC, SOP-32	OTP ROM, 128KX8, 250ns, CMOS, PDSO32, PLASTIC, SOP-32	OTP ROM, 128KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	OTP ROM, 128KX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	OTP ROM, 128KX8, 150ns, CMOS, PDSO32, PLASTIC, SOP-32	OTP ROM, 128KX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
零件包装代码	SOIC	SOIC	DIP	DIP	SOIC	DIP
包装说明	SOP,	SOP,	DIP,	DIP,	SOP,	DIP,
针数	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	250 ns	250 ns	200 ns	250 ns	150 ns	250 ns
JESD-30 代码	R-PDSO-G32	R-PDSO-G32	R-PDIP-T32	R-PDIP-T32	R-PDSO-G32	R-PDIP-T32
长度	20.45 mm	20.45 mm	41.9 mm	41.9 mm	20.45 mm	41.9 mm
内存密度	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
内存集成电路类型	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
内存宽度	8	8	8	8	8	8
功能数量	1	1	1	1	1	1
端子数量	32	32	32	32	32	32
字数	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
字数代码	128000	128000	128000	128000	128000	128000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	SOP	DIP	DIP	SOP	DIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	3 mm	3 mm	5.08 mm	5.08 mm	3 mm	5.08 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	NO	NO	YES	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE
端子节距	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
宽度	11.3 mm	11.3 mm	15.24 mm	15.24 mm	11.3 mm	15.24 mm
厂商名称	Hitachi （Renesas ）	Hitachi （Renesas ）	-	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）

HN27C301AFP-25

HN27C301AFP-25概述

HN27C301AFP-25规格参数

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