
IC,GRAPHICS PROCESSOR,CMOS,BGA,423PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| Reach Compliance Code | unknown |
| JESD-30 代码 | S-PBGA-B423 |
| 端子数量 | 423 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FBGA |
| 封装等效代码 | BGA423,24X24,25 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH |
| 电源 | 1.1,1.2,1.8,1.8/3 V |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | BALL |
| 端子节距 | 0.635 mm |
| 端子位置 | BOTTOM |
| uPs/uCs/外围集成电路类型 | GRAPHICS PROCESSOR |
| OMAP3515DCUSR | OMAP3503DCBBR | OMAP3503DCBBAR | OMAP3515DCBBR | OMAP3503DCBCR | OMAP3503DCUSR | OMAP3515DCBCR | |
|---|---|---|---|---|---|---|---|
| 描述 | IC,GRAPHICS PROCESSOR,CMOS,BGA,423PIN,PLASTIC | IC,GRAPHICS PROCESSOR,CMOS,BGA,515PIN,PLASTIC | IC,GRAPHICS PROCESSOR,CMOS,BGA,515PIN,PLASTIC | IC,GRAPHICS PROCESSOR,CMOS,BGA,515PIN,PLASTIC | IC,GRAPHICS PROCESSOR,CMOS,BGA,515PIN,PLASTIC | IC,GRAPHICS PROCESSOR,CMOS,BGA,423PIN,PLASTIC | IC,GRAPHICS PROCESSOR,CMOS,BGA,515PIN,PLASTIC |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | S-PBGA-B423 | S-PBGA-B515 | S-PBGA-B515 | S-PBGA-B515 | S-PBGA-B515 | S-PBGA-B423 | S-PBGA-B515 |
| 端子数量 | 423 | 515 | 515 | 515 | 515 | 423 | 515 |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FBGA | FBGA | FBGA | FBGA | FBGA | FBGA | FBGA |
| 封装等效代码 | BGA423,24X24,25 | BGA515,28X28,16 | BGA515,28X28,16 | BGA515,28X28,16 | BGA515,26X26,20 | BGA423,24X24,25 | BGA515,26X26,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
| 电源 | 1.1,1.2,1.8,1.8/3 V | 1.1,1.2,1.8,1.8/3 V | 1.1,1.2,1.8,1.8/3 V | 1.1,1.2,1.8,1.8/3 V | 1.1,1.2,1.8,1.8/3 V | 1.1,1.2,1.8,1.8/3 V | 1.1,1.2,1.8,1.8/3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.635 mm | 0.4 mm | 0.4 mm | 0.4 mm | 0.5 mm | 0.635 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| uPs/uCs/外围集成电路类型 | GRAPHICS PROCESSOR | GRAPHICS PROCESSOR | GRAPHICS PROCESSOR | GRAPHICS PROCESSOR | GRAPHICS PROCESSOR | GRAPHICS PROCESSOR | GRAPHICS PROCESSOR |
| 包装说明 | - | FBGA, BGA515,28X28,16 | FBGA, BGA515,28X28,16 | FBGA, BGA515,28X28,16 | FBGA, BGA515,26X26,20 | FBGA, BGA423,24X24,25 | FBGA, BGA515,26X26,20 |
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