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TZA3019AV

产品描述IC ATM/SONET/SDH SUPPORT CIRCUIT, PBCC32, 5 X 5 MM, 0.65 MM HEIGHT, HEAT SINK, PLASTIC, MO-217, SOT-560-1, BCC-32, ATM/SONET/SDH IC
产品类别无线/射频/通信    电信电路   
文件大小185KB,共32页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
下载文档 详细参数 全文预览

TZA3019AV概述

IC ATM/SONET/SDH SUPPORT CIRCUIT, PBCC32, 5 X 5 MM, 0.65 MM HEIGHT, HEAT SINK, PLASTIC, MO-217, SOT-560-1, BCC-32, ATM/SONET/SDH IC

TZA3019AV规格参数

参数名称属性值
厂商名称NXP(恩智浦)
零件包装代码BCC
包装说明HVBCC,
针数32
制造商包装代码SOT-560-1
Reach Compliance Codeunknown
JESD-30 代码S-PBCC-B32
长度5 mm
负电源额定电压-3.3 V
功能数量1
端子数量32
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码HVBCC
封装形状SQUARE
封装形式CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
认证状态Not Qualified
座面最大高度0.8 mm
表面贴装YES
电信集成电路类型ATM/SONET/SDH SUPPORT CIRCUIT
温度等级INDUSTRIAL
端子形式BUTT
端子节距0.5 mm
端子位置BOTTOM
宽度5 mm

TZA3019AV文档预览

INTEGRATED CIRCUITS
DATA SHEET
TZA3019
2.5 Gbits/s dual
postamplifier with level
detectors and 2
×
2 switch
Preliminary specification
File under Integrated Circuits, IC19
2000 Apr 10
Philips Semiconductors
Preliminary specification
2.5 Gbits/s dual postamplifier with level
detectors and 2
×
2 switch
FEATURES
Dual postamplifier
Single 3.3 V power supply
Wideband operation from 50 kHz to 2.5 GHz (typical
value)
Fully differential
Channels are delay matched
On-chip DC-offset compensations without external
capacitor
Interfacing with positive or negative supplied logic
Switching possibility between channels
Positive Emitter Coupled Logic (PECL) or Current-Mode
Logic (CML) compatible data outputs adjustable from
200 to 800 mV (p-p) single-ended
Power-down capability for unused outputs and detectors
Rise and fall times 80 ps (typical value)
Possibility to invert the output of each channel
separately
Input level-detection circuits for Received Signal
Strength Indicator (RSSI) or Loss Of Signal (LOS)
detection, programmable from 0.4 to 400 mV (p-p)
single-ended, with open-drain comparator output for
direct interfacing with positive or negative logic
Reference voltage for output level and LOS adjustment
Automatic strongest input signal switch possibility
(TZA3019 version B)
HTQFP32 or HBCC32 plastic package with exposed
pad.
APPLICATIONS
TZA3019
Postamplifier for Synchronous Digital Hierarchy and
Synchronous Optical Network (SDH/SONET)
transponder
SDH/SONET wavelength converter
Crosspoint or channel switch
PECL driver
Fibre channel arbitrated loop
Protection ring
Monitoring
Signal level detectors
Swing converter CML 200 mV (p-p) to
PECL 800 mV (p-p)
Port bypass circuit
2.5 GHz clock amplification.
GENERAL DESCRIPTION
The TZA3019 is a low gain postamplifier multiplexer with a
dual RSSI and/or LOS detector that is designed for use in
critical signal path control applications, such as
loop-through, redundant channel switching or Wavelength
Division Multiplexing (WDM). The signal path is
unregistered, so no clock is required for the data inputs.
The signal path is fully differential and delay matched. It is
capable of operating from 50 kHz to 2.5 GHz.
The TZA3019 HTQFP32 and HBCC32 packages can be
delivered in three versions:
TZA3019AHT and TZA3019AV with two RSSI signals
TZA3019BHT and TZA3019BV with one RSSI and one
LOS signal
TZA3019CHT and TZA3019CV with two LOS signals.
ORDERING INFORMATION
TYPE
NUMBER
TZA3019AHT
TZA3019BHT
TZA3019CHT
TZA3019AV
TZA3019BV
TZA3019CV
TZA3019U
PACKAGE
NAME
HTQFP32
HTQFP32
HTQFP32
HBCC32
HBCC32
HBCC32
DESCRIPTION
plastic, heatsink thin quad flat package; 32 leads; body 5
×
5
×
1 mm
plastic, heatsink thin quad flat package; 32 leads; body 5
×
5
×
1 mm
plastic, heatsink thin quad flat package; 32 leads; body 5
×
5
×
1 mm
plastic, heatsink bottom chip carrier; 32 terminals; body 5
×
5
×
0.65 mm
plastic, heatsink bottom chip carrier; 32 terminals; body 5
×
5
×
0.65 mm
plastic, heatsink bottom chip carrier; 32 terminals; body 5
×
5
×
0.65 mm
bare die; 2.22
×
2.22
×
0.28 mm
VERSION
SOT547-2
SOT547-2
SOT547-2
SOT560-1
SOT560-1
SOT560-1
2000 Apr 10
2
Philips Semiconductors
Preliminary specification
2.5 Gbits/s dual postamplifier with level
detectors and 2
×
2 switch
BLOCK DIAGRAM
TZA3019
handbook, full pagewidth
VEE1A
LOSTH1
32
10
25
VEE1B
LOS
DETECTOR
offset
27
RSSI1
LEVEL1
INV1
S1
GND1A
IN1
IN1Q
GND1A
12
29
31
1
2
3
4
TZA3019AHT
TZA3019AV
level
24
SWITCH
23
22
A1A
A1B
21
GND1B
OUT1
OUT1Q
GND1B
TEST
15
DFT
BAND GAP
REFERENCE
14
Vref
GND2A
IN2Q
IN2
GND2A
S2
INV2
LEVEL2
8
7
6
5
30
28
13
level
SWITCH
A2A
A2B
17
18
19
20
GND2B
OUT2Q
OUT2
GND2B
offset
LOS
DETECTOR
11
9
26
RSSI2
LOSTH2
VEE2A
16
VEE2B
MGT028
Fig.1 Block diagram (TZA3019AHT and TZA3019AV).
2000 Apr 10
3
Philips Semiconductors
Preliminary specification
2.5 Gbits/s dual postamplifier with level
detectors and 2
×
2 switch
TZA3019
handbook, full pagewidth
VEE1A
LOSTH1
32
10
25
VEE1B
LOS
DETECTOR
offset
12
29
31
1
2
3
4
A1A
A1B
5 kΩ
27
LOS1
TZA3019BHT
TZA3019BV
level
LEVEL1
INV1
S1
GND1A
IN1
IN1Q
GND1A
24
SWITCH
23
22
21
GND1B
OUT1
OUT1Q
GND1B
TEST
15
DFT
BAND GAP
REFERENCE
14
Vref
GND2A
IN2Q
IN2
GND2A
S2
INV2
LEVEL2
8
7
6
5
30
28
13
level
SWITCH
A2A
A2B
17
18
19
20
GND2B
OUT2Q
OUT2
GND2B
offset
LOS
DETECTOR
11
9
26
RSSI2
LOSTH2
VEE2A
16
VEE2B
MGT027
Fig.2 Block diagram (TZA3019BHT and TZA3019AV).
2000 Apr 10
4
Philips Semiconductors
Preliminary specification
2.5 Gbits/s dual postamplifier with level
detectors and 2
×
2 switch
TZA3019
handbook, full pagewidth
VEE1A
LOSTH1
32
10
25
VEE1B
LOS
DETECTOR
offset
12
29
31
1
2
3
4
A1A
A1B
5 kΩ
27
LOS1
TZA3019CHT
TZA3019CV
level
LEVEL1
INV1
S1
GND1A
IN1
IN1Q
GND1A
24
SWITCH
23
22
21
GND1B
OUT1
OUT1Q
GND1B
TEST
15
DFT
BAND GAP
REFERENCE
14
Vref
GND2A
IN2Q
IN2
GND2A
S2
INV2
LEVEL2
8
7
6
5
30
28
13
level
SWITCH
A2A
A2B
17
18
19
20
GND2B
OUT2Q
OUT2
GND2B
LOS
DETECTOR
offset
5 kΩ
26
LOS2
LOSTH2
VEE2A
11
9
16
VEE2B
MGS553
Fig.3 Block diagram (TZA3019CHT and TZA3019CV).
2000 Apr 10
5
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