TZA3019U概述

IC ATM/SONET/SDH SUPPORT CIRCUIT, UUC34, 2.22 X 2.22 X 0.28 MM, DIE-34, ATM/SONET/SDH IC

TZA3019U规格参数

参数名称	属性值
厂商名称	NXP(恩智浦)
零件包装代码	DIE
包装说明	DIE,
针数	34
Reach Compliance Code	unknown
JESD-30 代码	S-XUUC-N34
功能数量	1
端子数量	34
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	UNSPECIFIED
封装代码	DIE
封装形状	SQUARE
封装形式	UNCASED CHIP
认证状态	Not Qualified
标称供电电压	3.3 V
表面贴装	YES
电信集成电路类型	ATM/SONET/SDH SUPPORT CIRCUIT
温度等级	INDUSTRIAL
端子形式	NO LEAD
端子位置	UPPER

文档预览

下载PDF文档

全文
预览

INTEGRATED CIRCUITS

DATA SHEET

TZA3019

2.5 Gbits/s dual

postamplifier with level

detectors and 2

2 switch

Product speciﬁcation

Supersedes data of 2000 Apr 10

File under Integrated Circuits, IC19

2001 Jun 25

TZA3019U相似产品对比

	TZA3019U	TZA3019BHT	TZA3019CVH	TZA3019BVH	TZA3019AVH	TZA3019AHT
描述	IC ATM/SONET/SDH SUPPORT CIRCUIT, UUC34, 2.22 X 2.22 X 0.28 MM, DIE-34, ATM/SONET/SDH IC	IC ATM/SONET/SDH SUPPORT CIRCUIT, PQFP32, 5 X 5 X 1 MM, PLASTIC, HTQFP-32, ATM/SONET/SDH IC	IC ATM/SONET/SDH SUPPORT CIRCUIT, PBCC32, 5 X 5 MM, 0.65 MM HEIGHT, HEAT SINK, PLASTIC, MO-217, SOT-560-1, BCC-32, ATM/SONET/SDH IC	IC ATM/SONET/SDH SUPPORT CIRCUIT, PBCC32, 5 X 5 MM, 0.65 MM HEIGHT, HEAT SINK, PLASTIC, MO-217, SOT-560-1, BCC-32, ATM/SONET/SDH IC	IC ATM/SONET/SDH SUPPORT CIRCUIT, PBCC32, 5 X 5 MM, 0.65 MM HEIGHT, HEAT SINK, PLASTIC, MO-217, SOT-560-1, BCC-32, ATM/SONET/SDH IC	IC ATM/SONET/SDH SUPPORT CIRCUIT, PQFP32, 5 X 5 X 1 MM, PLASTIC, HTQFP-32, ATM/SONET/SDH IC
零件包装代码	DIE	QFP	BCC	BCC	BCC	QFP
包装说明	DIE,	HTFQFP,	HVBCC,	HVBCC,	HVBCC,	HTFQFP,
针数	34	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 代码	S-XUUC-N34	S-PQFP-G32	S-PBCC-B32	S-PBCC-B32	S-PBCC-B32	S-PQFP-G32
功能数量	1	1	1	1	1	1
端子数量	34	32	32	32	32	32
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
封装主体材料	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	DIE	HTFQFP	HVBCC	HVBCC	HVBCC	HTFQFP
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	UNCASED CHIP	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
标称供电电压	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES
电信集成电路类型	ATM/SONET/SDH SUPPORT CIRCUIT	ATM/SONET/SDH SUPPORT CIRCUIT	ATM/SONET/SDH SUPPORT CIRCUIT	ATM/SONET/SDH SUPPORT CIRCUIT	ATM/SONET/SDH SUPPORT CIRCUIT	ATM/SONET/SDH SUPPORT CIRCUIT
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	NO LEAD	GULL WING	BUTT	BUTT	BUTT	GULL WING
端子位置	UPPER	QUAD	BOTTOM	BOTTOM	BOTTOM	QUAD
厂商名称	NXP(恩智浦)	-	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
应用程序	-	SONET;SDH	SONET;SDH	SONET;SDH	SONET;SDH	SONET;SDH
长度	-	5 mm	5 mm	5 mm	5 mm	5 mm
座面最大高度	-	1.2 mm	0.8 mm	0.8 mm	0.8 mm	1.2 mm
端子节距	-	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
宽度	-	5 mm	5 mm	5 mm	5 mm	5 mm

推荐资源

求反相放大器的实际等效输出电阻的计算电路图

双向晶闸管电动机驱动电路b

电流截止反馈电路之四a

BA2266（玩具汽车和摩托艇）无线电遥控伺服系统单片电路

流水彩灯控制电路

窄带解调器

器件捷径: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

热门器件

开源项目推荐更多

热门活动更多

热门文章更多

技术资料推荐更多