Surface Mount Fuse
(Thin Film Chip Fuse)
Pb
6. Applications and ratings
Part
Designation
CT06V5TR20
CT06V5TR25
CT06V5TR315
CT06V5TR40
CT06V5TR50
CT06V5TR80
CT06V5T1R0
CT06V5T1R25
CT06V5T1R50
CT06V5T1R60
CT06V3T2R0
CT06V3T2R50
CT06V3T3R00
CT06V3T3R15
CT06V3T4R0
CT06V3T5R0
Rated
Current
0.20A
0.25A
0.315A
0.40A
0.50A
0.80A
1.00A
1.25A
1.50A
1.60A
2.00A
2.50A
3.00A
3.15A
4.00A
5.00A
Fusing
Time
Resistance*
(mΩ)
Typical
3000
1500
750
496
343
142
88
63
60
56
34
24.5
20
19
13
10
Document No
Issued date
Page
TCT-060S001A
2014/02/25
3/6
RoHS
Marking
B
C
D
E
F
K
L
M
P
N
S
T
3
U
W
Y
Rated
Voltage
Breaking
Capacity
50V DC /
32V AC
50A
50V DC
32V AC
Open within
2 min.at 200%
rated current
32V DC/AC
50A
32V DC/AC
*Resistance was measured with less than 10% of rated current.
7.Pre-Arcing time
Rated Current
0.2~5A(Type F)
Note:
Pre-arcing time at 10 times rated current according to the following types:
Type FF: less than 1ms
Type F: from 1ms to 10ms
Type T: greater than 10ms to 100ms
Type TT: greater than 100ms to 1000ms
1.25×In (Min)
1 hrs
2.0×In (Max)
120s
10.0×In (Max)
10ms
TA-I TECHNOLOGY CO., LTD
Surface Mount Fuse
(Thin Film Chip Fuse)
Pb
8. Reliability Tests
RoHS
Document No
Issued date
Page
TCT-060S001A
2014/02/25
4/6
Parameter
Carrying capacity
Fusing Time
Requirement
No fusing
Within 2 minute
Test Method
Rated current ,4hr
200% of its rated current
Reference Standard
UL248-14
IEC60127-4-9.2.1
IEC60127-1
IEC60127-4-9.3.1
Without
permanent
The rated voltage of the fuse and shall
arcing、
Breaking capacity
be maintained for 30 s after the fuse
has operated.
ignition、
bursting of fuse
Insulation
0.1MΩ and
Measure with DC twice the rated
Resistance
more
voltage after breaking capacity
Bending Test
Resistance to
solder Heat
Solderability
Temperature Rise
No mechanical
damages
∣△
R∣＜20%
95% coverage
minimum
△
T<70℃
Distance between holding points:
90mm, Bending:3mm,1time ,30sec
260℃±5℃,10±1second
235℃±5℃, 2±0.2second
(Solder : Sn96.5 / Ag3.0 / Cu0.5)
125% of its rated current, Measure of
surface temperature rise
IEC60127-4-9.3.3
IEC60115-1-4.33
IEC60028-2-58
IEC60028-2-58
IEC60127-4-9.7
IEC60115-1-4.23.2
JIS C5201-1-4.23.2
IEC60127-1-6.2
Resistance to Dry
∣△
R∣＜20%
155℃±5℃,96 hrs
Heat
No evident
damages on
15 s with a piece of cloth soaked in
Resistance to
protective
water and again for 15 s with a piece of
Solvent
coating and
cloth soaked in petroleum spirit.
marking
Thermal Shock
∣△
R∣＜10%
-55℃/+25℃/+155℃/+25℃, 10 cycles
Humidity
∣△
R∣＜20%
40±2°C/90~95%RH,1000 hrs
MIL-STD 202-107G
MIL-STD-202G
Method 103B
9. Storage Conditions:
Temperature: 5℃~35℃,Humidity:40%~75%
10. Shelf Life:
2 years from manufacturing date
TA-I TECHNOLOGY CO., LTD
NXP MCU
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