
EEPROM, 64X16, Serial, CMOS, PDSO8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ROHM(罗姆半导体) |
| 包装说明 | SSOP-8 |
| Reach Compliance Code | compliant |
| 最大时钟频率 (fCLK) | 2 MHz |
| 数据保留时间-最小值 | 10 |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e2 |
| 长度 | 4.4 mm |
| 内存密度 | 1024 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 64 words |
| 字数代码 | 64 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 64X16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LSSOP |
| 封装等效代码 | TSSOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.25 mm |
| 最大待机电流 | 0.000002 A |
| 最大压摆率 | 0.002 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Copper (Sn/Cu) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 宽度 | 3 mm |
| 写保护 | HARDWARE/SOFTWARE |

| BR9010FV-WE1 | BR9020RFVM-WTL | BR9020FV-WE1 | BR9020RFV-WE1 | BR9020F-WE1 | BR9040RFV-WE2 | BR9040RFV-WE1 | BR9010F-WE2 | BR9010FV-WE2 | BR9010F-WE1 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 64X16, Serial, CMOS, PDSO8 | EEPROM, 128X16, Serial, CMOS, PDSO8 | EEPROM, 128X16, Serial, CMOS, PDSO8 | EEPROM, 128X16, Serial, CMOS, PDSO8 | EEPROM, 128X16, Serial, CMOS, PDSO8 | EEPROM | EEPROM | EEPROM, 64X16, Serial, CMOS, PDSO8 | EEPROM, 64X16, Serial, CMOS, PDSO8 | EEPROM, 64X16, Serial, CMOS, PDSO8 |
| 包装说明 | SSOP-8 | MSOP-8 | SSOP-8 | SSOP-8 | SOP-8 | , | , | SOP-8 | SSOP-8 | SOP-8 |
| Reach Compliance Code | compliant | unknown | compliant | compliant | unknown | unknown | unknown | unknown | compliant | unknown |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | - | - | 符合 | 符合 | 符合 |
| 最大时钟频率 (fCLK) | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | - | - | 2 MHz | 2 MHz | 2 MHz |
| 数据保留时间-最小值 | 10 | 10 | 10 | 10 | 10 | - | - | 10 | 10 | 10 |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | - | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | - | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | 4.4 mm | 2.9 mm | 4.4 mm | 4.4 mm | 5 mm | - | - | 5 mm | 4.4 mm | 5 mm |
| 内存密度 | 1024 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | - | - | 1024 bit | 1024 bit | 1024 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | - | - | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | - | - | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - | - | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | - | - | 8 | 8 | 8 |
| 字数 | 64 words | 128 words | 128 words | 128 words | 128 words | - | - | 64 words | 64 words | 64 words |
| 字数代码 | 64 | 128 | 128 | 128 | 128 | - | - | 64 | 64 | 64 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | - | -40 °C | -40 °C | -40 °C |
| 组织 | 64X16 | 128X16 | 128X16 | 128X16 | 128X16 | - | - | 64X16 | 64X16 | 64X16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LSSOP | VSSOP | LSSOP | LSSOP | LSOP | - | - | LSOP | LSSOP | LSOP |
| 封装等效代码 | TSSOP8,.25 | TSSOP8,.16 | TSSOP8,.25 | TSSOP8,.25 | SOP8,.25 | - | - | SOP8,.25 | TSSOP8,.25 | SOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE | - | - | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | - | - | SERIAL | SERIAL | SERIAL |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | - | - | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.25 mm | 0.9 mm | 1.25 mm | 1.25 mm | 1.6 mm | - | - | 1.6 mm | 1.25 mm | 1.6 mm |
| 最大待机电流 | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | - | - | 0.000002 A | 0.000002 A | 0.000002 A |
| 最大压摆率 | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | - | - | 0.002 mA | 0.002 mA | 0.002 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - | - | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | - | - | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | - | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - | - | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | - | - | 1.27 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | - | DUAL | DUAL | DUAL |
| 宽度 | 3 mm | 2.8 mm | 3 mm | 3 mm | 4.4 mm | - | - | 4.4 mm | 3 mm | 4.4 mm |
| 写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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