UVPROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, SLIM, WINDOWED, CERDIP-24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Cypress(赛普拉斯) |
| 零件包装代码 | DIP |
| 包装说明 | 0.300 INCH, SLIM, WINDOWED, CERDIP-24 |
| 针数 | 24 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 25 ns |
| 其他特性 | PROGRAMMABLE SYNCHRONOUS OR ASYNCHRONOUS OUTPUT ENABLE; PROGRAMMABLE ASYNCHRONOUS REGISTERS |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-GDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 31.877 mm |
| 内存密度 | 16384 bit |
| 内存集成电路类型 | UVPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 字数 | 2048 words |
| 字数代码 | 2000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 2KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | WDIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, WINDOW |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 编程电压 | 12.5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大待机电流 | 0.09 A |
| 最大压摆率 | 0.09 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| CY7C245A-45WC | CY7C245A-45LMB | CY7C245AL-35PC | CY7C245A-45QMB | CY7C245A-35LMB | CY7C245A-35PC | CY7C245A-15PC | CY7C245A-18LMB | CY7C245AL-35WC | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | UVPROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, SLIM, WINDOWED, CERDIP-24 | OTP ROM, 2KX8, 25ns, CMOS, CQCC28, LCC-28 | OTP ROM, 2KX8, 25ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | UVPROM, 2KX8, 25ns, CMOS, CQCC28, WINDOWED, LCC-28 | OTP ROM, 2KX8, 25ns, CMOS, CQCC28, LCC-28 | OTP ROM, 2KX8, 25ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | OTP ROM, 2KX8, 10ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | OTP ROM, 2KX8, 12ns, CMOS, CQCC28, LCC-28 | UVPROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, SLIM, WINDOWED, CERDIP-24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | QLCC | DIP | QLCC | QLCC | DIP | DIP | QLCC | DIP |
| 包装说明 | 0.300 INCH, SLIM, WINDOWED, CERDIP-24 | LCC-28 | 0.300 INCH, SLIM, PLASTIC, DIP-24 | WINDOWED, LCC-28 | LCC-28 | 0.300 INCH, SLIM, PLASTIC, DIP-24 | 0.300 INCH, SLIM, PLASTIC, DIP-24 | LCC-28 | 0.300 INCH, SLIM, WINDOWED, CERDIP-24 |
| 针数 | 24 | 28 | 24 | 28 | 28 | 24 | 24 | 28 | 24 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 10 ns | 12 ns | 25 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-GDIP-T24 | S-CQCC-N28 | R-PDIP-T24 | S-CQCC-N28 | S-CQCC-N28 | R-PDIP-T24 | R-PDIP-T24 | S-CQCC-N28 | R-GDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 31.877 mm | 11.43 mm | 30.099 mm | 11.43 mm | 11.43 mm | 30.099 mm | 30.099 mm | 11.43 mm | 31.877 mm |
| 内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| 内存集成电路类型 | UVPROM | OTP ROM | OTP ROM | UVPROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | UVPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 28 | 24 | 28 | 28 | 24 | 24 | 28 | 24 |
| 字数 | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| 字数代码 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 125 °C | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C |
| 组织 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | WDIP | QCCN | DIP | WQCCN | QCCN | DIP | DIP | QCCN | WDIP |
| 封装等效代码 | DIP24,.3 | LCC28,.45SQ | DIP24,.3 | LCC28,.45SQ | LCC28,.45SQ | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | DIP24,.3 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE, WINDOW | CHIP CARRIER | IN-LINE | CHIP CARRIER, WINDOW | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE, WINDOW |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 240 | NOT SPECIFIED | NOT APPLICABLE | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 编程电压 | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 1.9812 mm | 4.826 mm | 2.794 mm | 1.9812 mm | 4.826 mm | 4.826 mm | 1.9812 mm | 5.08 mm |
| 最大待机电流 | 0.09 A | 0.12 A | 0.06 A | 0.12 A | 0.12 A | 0.09 A | 0.12 A | 0.12 A | 0.06 A |
| 最大压摆率 | 0.09 mA | 0.12 mA | 0.06 mA | 0.12 mA | 0.12 mA | 0.09 mA | 0.12 mA | 0.12 mA | 0.06 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | YES | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | QUAD | DUAL | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT APPLICABLE | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 11.43 mm | 7.62 mm | 11.43 mm | 11.43 mm | 7.62 mm | 7.62 mm | 11.43 mm | 7.62 mm |
| 厂商名称 | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | - | - | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
| 其他特性 | PROGRAMMABLE SYNCHRONOUS OR ASYNCHRONOUS OUTPUT ENABLE; PROGRAMMABLE ASYNCHRONOUS REGISTERS | PROGRAMMABLE SYNCHRONOUS OR ASYNCHRONOUS OUTPUT ENABLE; PROGRAMMABLE ASYNCHRONOUS REGISTERS | PROGRAMMABLE SYNCHRONOUS OR ASYNCHRONOUS OUTPUT ENABLE; PROGRAMMABLE ASYNCHRONOUS REGISTERS | PROGRAMMABLE SYNCHRONOUS OR ASYNCHRONOUS OUTPUT ENABLE; PROGRAMMABLE ASYNCHRONOUS REGISTERS | PROGRAMMABLE SYNCHRONOUS OR ASYNCHRONOUS OUTPUT ENABLE; PROGRAMMABLE ASYNCHRONOUS REGISTERS | PROGRAMMABLE SYNCHRONOUS OR ASYNCHRONOUS OUTPUT ENABLE; PROGRAMMABLE ASYNCHRONOUS REGISTERS | PROGRAMMABLE SYNCHRONOUS OR ASYNCHRONOUS OUTPUT ENABLE; PROGRAMMABLE ASYNCHRONOUS REGISTERS | - | PROGRAMMABLE SYNCHRONOUS OR ASYNCHRONOUS OUTPUT ENABLE; PROGRAMMABLE ASYNCHRONOUS REGISTERS |
ADI参考电路
嵌入式系统
分立器件
TI技术论坛
PCB设计
嵌入式系统
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