SAMPLE AND HOLD AMPLIFIER, 20 us ACQUISITION TIME, BCY8, ROHS COMPLIANT, METAL CAN, TO-99, 8 PIN
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | TO-99 |
| 包装说明 | TO-5, |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| 最长采集时间 | 25 µs |
| 标称采集时间 | 20 µs |
| 放大器类型 | SAMPLE AND HOLD CIRCUIT |
| 最大模拟输入电压 | 11.5 V |
| 最小模拟输入电压 | -11.5 V |
| JESD-30 代码 | O-XBCY-W8 |
| JESD-609代码 | e1 |
| 湿度敏感等级 | 1 |
| 负供电电压上限 | -18 V |
| 标称负供电电压 (Vsup) | -15 V |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | TO-5 |
| 封装形状 | ROUND |
| 封装形式 | CYLINDRICAL |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | COMMERCIAL |
| 采样并保持/跟踪并保持 | SAMPLE |
| 供电电压上限 | 18 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN SILVER COPPER |
| 端子形式 | WIRE |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 |
| LF398H/NOPB | LF198H/883 | LF198H | LF398MX/NOPB | LF398AN/NOPB | LF398M/NOPB | |
|---|---|---|---|---|---|---|
| 描述 | SAMPLE AND HOLD AMPLIFIER, 20 us ACQUISITION TIME, BCY8, ROHS COMPLIANT, METAL CAN, TO-99, 8 PIN | SAMPLE AND HOLD AMPLIFIER, 20 us ACQUISITION TIME, BCY8, METAL CAN, TO-99, 8 PIN | SAMPLE AND HOLD AMPLIFIER, 20 us ACQUISITION TIME, BCY8, METAL CAN, TO-99, 8 PIN | SAMPLE AND HOLD AMPLIFIER, 20 us ACQUISITION TIME, PDSO14, ROHS COMPLIANT, SOIC-14 | SAMPLE AND HOLD AMPLIFIER, 20 us ACQUISITION TIME, PDIP8, ROHS COMPLIANT, DIP-8 | SAMPLE AND HOLD AMPLIFIER, 20 us ACQUISITION TIME, PDSO14, ROHS COMPLIANT, SOIC-14 |
| 是否无铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 零件包装代码 | TO-99 | TO-99 | TO-99 | SOIC | DIP | SOIC |
| 包装说明 | TO-5, | TO-99, | , | SOP, | DIP, | SOP, |
| 针数 | 8 | 8 | 8 | 14 | 8 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长采集时间 | 25 µs | 25 µs | 25 µs | 25 µs | 25 µs | 25 µs |
| 标称采集时间 | 20 µs | 20 µs | 20 µs | 20 µs | 20 µs | 20 µs |
| 放大器类型 | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT |
| 最大模拟输入电压 | 11.5 V | 11.5 V | 11.5 V | 11.5 V | 11.5 V | 11.5 V |
| 最小模拟输入电压 | -11.5 V | -11.5 V | -11.5 V | -11.5 V | -11.5 V | -11.5 V |
| JESD-30 代码 | O-XBCY-W8 | O-XBCY-W8 | O-XBCY-W8 | R-PDSO-G14 | R-PDIP-T8 | R-PDSO-G14 |
| JESD-609代码 | e1 | e0 | e0 | e3 | e3 | e3 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 负供电电压上限 | -18 V | -18 V | -18 V | -18 V | -18 V | -18 V |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 14 | 8 | 14 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装形状 | ROUND | ROUND | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
| 供电电压上限 | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | YES | NO | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN SILVER COPPER | TIN LEAD | TIN LEAD | TIN | TIN | TIN |
| 端子形式 | WIRE | WIRE | WIRE | GULL WING | THROUGH-HOLE | GULL WING |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 |
| 封装代码 | TO-5 | TO-99 | - | SOP | DIP | SOP |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
