QBED8145
Feature:
Water transparent
Package in bulk and tape and reel
High radiant intensity
Peak wavelength 940nm
AlGaAs technology
45deg emitting angle
Application:
Free air transmission system
Optoelectronic switch
Infrared applied system
Smoke Detector
Certification & Compliance:
TS16949
ISO9001
RoHS Compliant
5mm IR emitter
Description:
This device is spectrally match with phototransistor,
photodiode, and infrared receiver module
Dimension:
Units: mm / tolerance = +/-0.1mm
Product: QBED8145
Date: 06/03/2011
Version# 1.0
Page 1 of 6
QBED8145
5mm IR emitter
Electrical / Optical Characteristic
(T=25
o
C)
Product
QBED8145
I
F
(mA)
50
V
F
(V)
Typ.
Max.
1.3
2.2
Min.
930
Λ
P
(nm)
Typ.
940
Max.
960
Ιe(mW/sr)
Min.
Typ.
13.7
30
Absolute Maximum Rating
Material
GaAs
P
d
(mW)
110
I
F
(mA) I
FP
(mA)* V
R
(V)
70
100
5
T
OP
(
o
C)
T
ST
(
o
C)
T
SOL
(
o
C)**
260
-40 ~ +80 -40 ~ +100
*Duty 1/10 @ 10KHz
** IR Reflow for no more than 10 sec @ 260
o
C
Product: QBED8145
Date: 06/03/2011
Version# 1.0
Page 2 of 6
QBED8145
5mm IR emitter
Characteristic Curves:
Product: QBED8145
Date: 06/03/2011
Version# 1.0
Page 3 of 6
QBED8145
5mm IR emitter
Solder Profile & Footprint:
A. Soldering
1. When soldering, the soldering iron needs to be at least 2mm away
from the epoxy edge. After soldering, allow at least 3 minutes for
LEDs to cool back to normal temperature. Do not apply any
pressure to the epoxy encapsulation or the lead frame during the
soldering process.
2. When reflow soldering or wave soldering, please solder once for
less than 5 seconds at a maximum temperature of 260°C. During the
soldering process, if the temperature or timing is not controlled
within limits, it would cause the epoxy to deform or cause the die or
wires within the LED to be damaged.
WAVE SOLDERING PROFILE FOR LEAD FREE PROCESS:
Product: QBED8145
Date: 06/03/2011
Version# 1.0
Page 4 of 6
QBED8145
5mm IR emitter
3. When using soldering iron, please solder once for less than 5
seconds at a maximum temperature of 300°C. When soldering a row
of LED on a PCB, please do not solder both leads of a LED in
sequence. (Solder all the positive lead first, then all the negative
leads)
4. Do not dip the epoxy encapsulation part of LED into any soldering
paste liquid.
5. After soldering, do not adjust the location of the LED anymore.
When attaching electronic parts to a PCB with LEDs, the curing time for the whole
PCB should be less than 60 seconds, at less than a temperature of 120
Labeling:
Product: QBED8145
Date: 06/03/2011
Version# 1.0
Page 5 of 6